IP Library Granted Patent US 9,074,094
Granted Patent B2
US 9,074,094 · App. 14/143,067 · Granted Jul 7, 2015

Thermoplastic resin composition and molded product including same

Inventors: Doo-Young Kim (Uiwang-si, KR); Jung-Hun Lee (Uiwang-si, KR); Jin-Kyung Cho (Uiwang-si, KR); Do-Hoon Chang (Uiwang-si, KR); Chang-Min Hong (Uiwang-si, KR)
Assignee: Cheil Industries Inc.
C08L71/123C08K5/092C08K5/1539C08L77/02C08L77/06
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Quick Facts
Patent No.
US 9,074,094
App. No.
14/143,067
Granted
Jul 7, 2015
Kind
B2
Abstract

A thermoplastic resin composition includes a base resin including (A) about 16 to about 73 wt % of polyphenylene ether; (B) about 18 to about 82 wt % of polyamide; and (C) about 1 to about 20 wt % of a polyethylene-based polymer; (D) about 0.05 to about 1 part by weight of a multi-functional compatibilizer having at least two carboxyl groups and (E) about 0.05 to about 1 part by weight of a multi-functional compatibilizer having a carboxyl group or an acid anhydride group along with a carbon-carbon double bond, based on about 100 parts by weight of the base resin.

Claims (9)

1. A thermoplastic resin composition, comprising:

a base resin comprising (A) about 16 to about 73 wt % of polyphenylene ether; (B) about 18 to about 82 wt % of polyamide; and (C) about 1 to about 20 wt % of a polyethylene-based polymer;

(D) about 0.05 to about 1 part by weight based on about 100 parts by weight of the base resin of a multi-functional compatibilizer having at least two carboxyl groups, wherein the multi-functional compatibilizer having at least two carboxyl groups (D) comprises citric acid, malic acid, agaricic acid, or a combination thereof; and

(E) about 0.05 to about 1 part by weight based on about 100 parts by weight of the base resin of a multi-functional compatibilizer having a carboxyl group or an acid anhydride group along with a carbon-carbon double bond.

2. The thermoplastic resin composition of claim 1 , wherein the polyphenylene ether (A) has a number average molecular weight of about 9,000 to about 50,000 g/mol and a polydispersity index of about 1.0 to about 2.5, and the polyamide (B) has a number average molecular weight of about 3,000 to about 50,000 g/mol and polydispersity index of about 1.0 to about 5.0.

3. The thermoplastic resin composition of claim 1 , wherein the polyethylene-based polymer (C) has a weight average molecular weight of about 10,000 to about 300,000 g/mol.

4. The thermoplastic resin composition of claim 1 , wherein the polyethylene-based polymer (C) comprises high density polyethylene (HDPE), linear low density polyethylene (LLDPE), low density polyethylene (LDPE), an ethylene-octene copolymer, ultra-low density polyethylene, medium density polyethylene, an ethylene-propylene copolymer, an ethylene-butene copolymer, or a combination thereof

5. The thermoplastic resin composition of claim 1 , wherein the multi-functional compatibilizer having a carboxyl group or an acid anhydride group along with a carbon-carbon double bond (E) comprises maleic acid, fumaric acid, itaconic acid, maleic anhydride, itaconic anhydride, aconitic acid, or a combination thereof

6. A molded product comprising the thermoplastic resin composition of claim 1 .

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2017
From: SAMSUNG SDI CO., LTD.
To: LOTTE ADVANCED MATERIALS CO., LTD.
Reel/Frame 042114/0895 →
MERGER Recorded Jul 14, 2016
From: CHEIL INDUSTRIES INC.
To: SAMSUNG SDI CO., LTD.
Reel/Frame 039360/0858 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 30, 2013
From: KIM, DOO-YOUNG; LEE, JUNG-HUN; CHO, JIN-KYUNG; CHANG, DO-HOON; HONG, CHANG-MIN
To: CHEIL INDUSTRIES INC.
Reel/Frame 031857/0039 →
Priority Claims (1)
KR 10-2012-0158706 · Dec 31, 2012 · national
Continuity (1)
Related Publication 20140187686A1 · Jul 3, 2014