Flow sensor and manufacturing method of the same and flow sensor module and manufacturing method of the same
View Patent ↗Technique of suppressing performance variations for each flow sensor is provided. In a flow sensor FS 1 of the present invention, a part of a semiconductor chip CHP 1 is configured to be covered with resin (MR) in a state in which a flow sensing unit (FDU) formed on a semiconductor chip CHP 1 is exposed. Since an upper surface SUR(MR) of the resin (MR) is higher than an upper surface SUR(CHP) of the semiconductor chip (CHP 1 ) by sealing the resin (MR) on a part of the upper surface SUR(CHP) of the semiconductor chip CHP 1 in a direction parallel to an air flow direction, the air flow around the flow sensing unit (FDU) can be stabilized. Further, interface peeling between the semiconductor chip (CHP 1 ) and the resin (MR) can be prevented by an increase of contact area between the semiconductor chip (CHP 1 ) and the resin (MR).
1. A flow sensor comprising:
(a) a chip mounting unit mounting a semiconductor chip; and
(b) the semiconductor chip mounted on the chip mounting unit, the semiconductor chip having a flow sensing unit formed in a thin plate part;
wherein the semiconductor chip is a flow sensor in which at least a part of the chip mounting unit is sealed with a sealing body containing resin in a state that the flow sensing unit is exposed, and
wherein, in an optional cross-section parallel to a travelling direction of a gas that flows above the exposed flow sensing unit, an upper surface of the resin is lower than an upper surface of the semiconductor chip in a first region in which the sealing body is in contact with the semiconductor chip, and, the upper surface of the resin is higher than the upper surface of the semiconductor chip in at least a part of a second region that is more apart from the semiconductor chip than the first region.
2. The flow sensor according to claim 1 ,
wherein another semiconductor chip different from the semiconductor chip is further sealed with the sealing body.
3. The flow sensor according to claim 1 ,
wherein a pair of air current control units clamping the exposed flow sensing unit and having a long shape in a direction parallel to the travelling direction of the gas that flows above the flow sensing unit is integrally formed with the sealing body.
4. The flow sensor according to claim 1 ,
wherein, when a height dimension from the upper surface of the semiconductor chip to the upper surface of the resin in the second region is defined as H1 and a dimension of the semiconductor chip exposed from the resin is defined as L1 in the direction parallel to the travelling direction of the gas of the semiconductor chip, a relationship of 0<H1/L1≦1.5 is satisfied.
5. The flow sensor according to claim 1 ,
wherein, in the optical cross-section parallel to the travelling direction of the gas that flows above the exposed flow sensing unit, the sealing body does not cover the upper surface of the first semiconductor chip.
6. A flow sensor comprising:
(a) a chip mounting unit mounting a semiconductor chip; and
(b) the semiconductor chip mounted on the chip mounting unit, the semiconductor chip having a flow sensing unit formed in a thin plate part;
wherein the semiconductor chip is a flow sensor in which at least a part of the chip mounting unit is sealed with a sealing body containing resin in a state that the flow sensing unit is exposed, and
wherein, in an optional cross-section parallel to a travelling direction of a gas that flows above the exposed flow sensing unit, an upper part of the semiconductor chip is partially covered with the resin.
7. The flow sensor according to claim 6 ,
wherein another semiconductor chip different from the semiconductor chip is further sealed with the sealing body.
8. The flow sensor according to claim 6 ,
wherein a pair of air current control units clamping the exposed flow sensing unit and having a long shape in a direction parallel to the travelling direction of the gas that flows above the flow sensing unit is integrally formed with the sealing body.