Capacitive switch, apparatus for transceiving signal, and manufacturing method thereof

1. A capacitive switch, comprising:

a first conductive cantilever,

a second conductive cantilever,

a substrate, and

a coplanar waveguide arranged on the substrate,

wherein:

the coplanar waveguide comprises a first conductor configured to transmit an electrical signal and a second conductor and a third conductor that are arranged as ground wires on two sides of the first conductor;

an insulation medium layer is arranged on the first conductor, and

a conducting layer is arranged on the insulation medium layer;

the first conductive cantilever is connected to the second conductor by using a first fixed end of the first conductive cantilever, and the second conductive cantilever is connected to the third conductor by using a second fixed end of the second conductive cantilever; and

when a direct-current signal is not transmitted on the capacitive switch, a first free end of the first conductive cantilever and a second free end of the second conductive cantilever hang over the conducting layer; when the direct-current signal is transmitted on the capacitive switch, the first free end of the first conductive cantilever and the second free end of the second conductive cantilever contact the conducting layer.

2. The capacitive switch according to claim 1 , wherein the first fixed end is vertically connected to the first free end to form the first conductive cantilever with a right-angled bending structure, and the second fixed end is vertically connected to the second free end to form the second conductive cantilever with a right-angled bending structure.

3. The capacitive switch according to claim 1 , wherein the first fixed end is connected to the first free end by using a first supporting part to form the first conductive cantilever with a Z-shaped bending structure, and the first fixed end is parallel to the first free end; and the second fixed end is connected to the second free end by using a second supporting part to form the second conductive cantilever with a Z-shaped bending structure, and the second fixed end is parallel to the second free end.

4. The capacitive switch according to claim 1 , wherein at least one contact is arranged on a face of the first free end of the first conductive cantilever, and the face of the first free end of the first conductive cantilever faces the conducting layer; and

at least one contact is arranged on a face of the second free end of the second conductive cantilever, and the face of the second free end of the second conductive cantilever faces the conducting layer.

5. An apparatus for transceiving a signal, comprising: a signal source processing circuit, a microwave processing circuit, an integrated control circuit, and a capacitive switch, wherein:

the capacitive switch comprises a first conductive cantilever, a second conductive cantilever, a substrate, and a coplanar waveguide arranged on the substrate;

the coplanar waveguide comprises a first conductor configured to transmit an electrical signal and a second conductor and a third conductor that are arranged as ground wires on two sides of the first conductor;

wherein:

an insulation medium layer is arranged on the first conductor, and

a conducting layer is arranged on the insulation medium layer;

the first conductive cantilever is connected to the second conductor by using a first fixed end of the first conductive cantilever, and the second conductive cantilever is connected to the third conductor by using a second fixed end of the second conductive cantilever;

the signal source processing circuit is connected to an input end arranged on the first conductor of the capacitive switch;

the microwave processing circuit is connected to an output end arranged on the first conductor of the capacitive switch;

the integrated control circuit is connected to a control end arranged on the first conductor of the capacitive switch; and

when a direct-current signal is not transmitted at the control end arranged on the first conductor of the capacitive switch, a first free end of the first conductive cantilever and a second free end of the second conductive cantilever hang over the conducting layer; when the direct-current signal is transmitted at the control end arranged on the first conductor of the capacitive switch, the first free end of the first conductive cantilever contacts the conducting layer, and the second free end of the second conductive cantilever contacts the conducting layer.

6. The apparatus according to claim 5 , wherein the first fixed end is vertically connected to the first free end to form the first conductive cantilever with a right-angled bending structure, and the second fixed end is vertically connected to the second free end to form the second conductive cantilever with a right-angled bending structure.

7. The apparatus according to claim 5 , wherein the first fixed end is connected to the first free end by using a first supporting part to form the first conductive cantilever with a Z-shaped bending structure, and the first fixed end is parallel to the first free end; and the second fixed end is connected to the second free end by using a second supporting part to form the second conductive cantilever with a Z-shaped bending structure, and the second fixed end is parallel to the second free end.

8. The apparatus according to claim 5 , wherein at least one contact is arranged on a face of the first free end of the first conductive cantilever, and the face of the first free end of the first conductive cantilever faces the conducting layer; and

at least one contact is arranged on a face of the second free end of the second conductive cantilever, and the face of the second free end of the second conductive cantilever faces the conducting layer.

9. A method for manufacturing a capacitive switch, comprising:

coating a metal layer on a face of a substrate, and performing etching to form a coplanar waveguide, wherein the coplanar waveguide comprises a first conductor configured to transmit an electrical signal and a second conductor and a third conductor that are arranged as ground wires on two sides of the first conductor;

coating an insulation medium film on the structure formed by performing etching, and performing etching to form an insulation medium layer, wherein the insulation medium layer is formed on the first conductor;

coating a conductive film on the structure formed by performing etching, and performing etching to form a conducting layer, wherein the conducting layer is formed on the insulation medium layer;

coating a sacrificial layer on the structure formed by performing etching, and performing etching to form a sacrificial structure, wherein edges of the sacrificial structure cover a part of the second conductor and a part of the third conductor;

coating a metal layer on the structure formed by performing etching, and performing etching to form a first conductive cantilever and a second conducive cantilever, wherein the first conductive cantilever is connected to the second conductor by using a first fixed end of the first conductive cantilever, and the second conductive cantilever is connected to the third conductor by using a second fixed end of the second conductive cantilever; and

removing the sacrificial structure.

10. The method according to claim 9 , wherein the coating a metal layer on the structure formed by performing etching and performing etching to form a first conductive cantilever and a second conducive cantilever comprise:

coating the metal layer on the structure formed by performing etching, and performing etching to form the first conductive cantilever and the second conducive cantilever, wherein the first fixed end is vertically connected to a first free end to form the first conductive cantilever with a right-angled bending structure, and the second fixed end is vertically connected to a second free end to form the second conductive cantilever with a right-angled bending structure.

11. The method according to claim 9 , wherein the coating a metal layer on the structure formed by performing etching and performing etching to form a first conductive cantilever and a second conducive cantilever comprise:

coating the metal layer on the structure formed by performing etching, and performing etching to form the first conductive cantilever and the second conducive cantilever, wherein the first fixed end is connected to a first free end by using a first supporting part to form the first conductive cantilever with a Z-shaped bending structure, and the first fixed end is parallel to the first free end; and the second fixed end is connected to a second free end by using a second supporting part to form the second conductive cantilever with a Z-shaped bending structure, and the second fixed end is parallel to the second free end.

12. The method according to claim 9 , wherein at least one contact receiving area of the first conductive cantilever and at least one contact receiving area of the second conductive cantilever is further formed on a face of the sacrificial layer structure; and

accordingly, after the sacrificial structure is removed, at least one contact is further formed on a face of the first free end of the first conductive cantilever, and the face of the first free end of the first conductive cantilever faces the conducting layer; and at least one contact is further formed on a face of the second free end of the second conductive cantilever, and the face of the second free end of the second conductive cantilever faces the conducting layer.