Method for production of solid-state imaging element, solid-state imaging element, and imaging apparatus
View Patent ↗A method for producing a solid-state imaging element which has photoconversion pixels, the method including forming an impurity region of the first conduction type and a second impurity region of the second conduction type on the impurity region of the first conduction type by ion implantation by using the same mask; forming on the surface of the semiconductor substrate a transfer gate constituting the charge transfer section which extends over the second impurity region of the second conduction type; forming a charge accumulating region of the first conduction type constituting the sensor section by ion implantation; and forming a first impurity region of the second conduction type, which has a higher impurity concentration than the second impurity region of the second conduction type, by ion implantation.
1. A solid-state imaging element having pixels, each including a sensor section that performs photoelectric conversion and a charge transfer section that transfers charges generated by said sensor section, said solid-state imaging element comprising:
a semiconductor substrate of a first conductivity type with oppositely facing first and second surfaces;
a transfer gate of said charge transfer section on the first surface of said semiconductor substrate;
a charge accumulating region of the first conductivity type of said sensor section;
a first impurity region of the second conductivity type which is formed at the first surface of said semiconductor substrate at said sensor section;
a second impurity region of the second conductivity type which has a lower impurity concentration than said first impurity region of the second conductivity type, said second impurity region being formed (a) on said charge accumulating region and between said first impurity region of the second conductivity type and the charge accumulating region and extending under said transfer gate; and
an impurity region of the first conductivity type which is formed in self-alignment with said second impurity region of the second conductivity type and extending under the transfer gate, said impurity region of the first conductivity type and said charge accumulating region overlapping such that said charge accumulating region is within said impurity region of the first conductivity type.
2. The solid-state imaging element of claim 1 , wherein the first impurity region of the second conductivity type does not extend under the transfer gate.
3. The solid-state imaging element of claim 1 , further comprising a second charge accumulating region of the second conductivity type under said impurity region of the first conductivity type.
4. The solid-state imaging element of claim 1 , further comprising a well region of the second conductivity type in the semiconductor substrate between the entire sensor section and the second surface of the semiconductor substrate.
5. The solid-state imaging element of claim 1 , further comprising element isolation regions isolating the sensor section within the semiconductor substrate.
6. The solid-state imaging element of claim 1 , further comprising:
a well region of the second conductivity type in the semiconductor substrate between the entire sensor section and the second surface of the semiconductor substrate;
a second charge accumulating region of the second conductivity type under said impurity region of the first conductivity type; and
element isolation regions isolating the sensor section within the semiconductor substrate.
7. The solid-state imaging device of claim 1 , wherein the first conductivity type is n-type and the second conductivity type is p-type.
8. A solid-state imaging element having pixels, each including a sensor section that performs photoelectric conversion and a charge transfer section that transfers charges generated by said sensor section, said solid-state imaging element comprising:
a semiconductor substrate of a first conductivity type with oppositely facing first and second surfaces;
a transfer gate of said charge transfer section on the first surface of said semiconductor substrate;
a charge accumulating region of the first conductivity type of said sensor section;
a first impurity region of the second conductivity type which is formed at the first surface of said semiconductor substrate at said sensor section;
a second impurity region of the second conductivity type which has a lower impurity concentration than said first impurity region of the second conductivity type, said second impurity region being formed on said charge accumulating region and under said first impurity region of the second conductivity type and extending under said transfer gate;
an impurity region of the first conductivity type which is formed by self-alignment with said second impurity region of the second conductivity type; and
a third impurity region of the second conductivity type which is formed under said charge accumulating region, wherein said third impurity region of the second conductivity type is formed by self-alignment with said charge accumulating region.
9. A solid-state imaging element having pixels, each including a sensor section that performs photoelectric conversion and a charge transfer section that transfers charges generated by said sensor section, said solid-state imaging element comprising:
a semiconductor substrate of a first conductivity type;
a transfer gate of said charge transfer section on the surface of said semiconductor substrate;
a charge accumulating region of the first conductivity type of said sensor section;
a first impurity region of the second conductivity type which is formed at the surface of said semiconductor substrate at said sensor section;
a second impurity region of the second conductivity type which has a lower impurity concentration than said first impurity region of the second conductivity type, said second impurity region being formed on said charge accumulating region and under said first impurity region of the second conductivity type and extending under said transfer gate; and
an impurity region of the first conductivity type which is formed in self-alignment with said second impurity region of the second conductivity type,
wherein,
said impurity region of the first conductivity type is so formed at to be displaced toward said transfer gate from said second impurity region of the second conductivity type.
10. An imaging apparatus comprising:
a light collecting section configured to collect incident light;
a solid-state imaging element having pixels, each including a sensor section that performs photoelectric conversion and a charge transfer section that transfers charges generated by said sensor section, said solid-state imaging element including (a) a semiconductor substrate of a first conductivity type with oppositely facing first and second surfaces, (b) a transfer gate of said charge transfer section on the first surface of said semiconductor substrate, (c) a charge accumulating region of the first conductivity type of said sensor section, (d) a first impurity region of the second conductivity type which is formed at the first surface of said semiconductor substrate at said sensor section, (e) a second impurity region of the second conductivity type which has a lower impurity concentration than said first impurity region of the second conductivity type, said second impurity region being formed on said charge accumulating region and between said first impurity region of the second conductivity type and the charge accumulating region and extending under said transfer gate, and (f) an impurity region of the first conductivity type which is formed in self-alignment with said second impurity region of the second conductivity type; and extending under the transfer gate, said impurity region of the first conductivity type and said charge accumulating region overlapping such that said charge accumulating region is within said impurity region of the first conductivity type; and
a signal processing section configured to process signals resulting from photoelectric conversion by said solid-state imaging element.