IP Library Granted Patent US 9,029,926
Granted Patent B2
US 9,029,926 · App. 14/145,256 · Granted May 12, 2015

Solid-state imaging device

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Quick Facts
Patent No.
US 9,029,926
App. No.
14/145,256
Granted
May 12, 2015
Kind
B2
Abstract

A solid-state imaging device includes a substrate, a photoelectric conversion section, a first impurity layer having a carrier polarity of a second conductivity type, a charge-to-voltage converting section, an amplifying section, and a second impurity layer having a carrier polarity of the second conductivity type. The second impurity layer is disposed in a region between the photoelectric conversion section and the amplifying section. The second impurity concentration of the second P-type impurity layer is made higher than the first impurity concentration of the first impurity layer.

Claims (15)

1. A solid-state imaging device comprising:

a substrate;

a well region disposed on the substrate;

a photoelectric conversion section configured to convert incident light into a signal charge, the photoelectric conversion section being disposed on the well region;

at least one transistor section disposed on the well region;

an isolation region disposed in a region between the photoelectric conversion section and the transistor section; and

an impurity layer located below the isolation region.

2. The solid-state imaging device according to claim 1 , wherein at least the one transistor section is a transfer transistor.

3. The solid-state imaging device according to claim 2 , wherein the transfer transistor configured to transfer the signal charge from the photoelectric conversion section to the charge-to-voltage converting section, the transfer section being disposed in a region between the photoelectric conversion section and the charge-to-voltage converting section.

4. The solid-state imaging device according to claim 1 , wherein at least the one transistor section is an amplifier transistor.

5. The solid-state imaging device according to claim 1 , wherein the isolation layer formed by a technique of one of LOCOS and STI.

6. The solid-state imaging device according to claim 1 , further comprising:

a plurality of the photoelectric conversion sections arranged in a predetermined direction; and

a diffusion isolation layer formed by a technique of diffusion isolation in a region between the photoelectric conversion sections adjacent to each other in the predetermined direction.

7. The solid-state imaging device according to claim 1 , wherein the impurity layer is disposed within the well region.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 19, 2016
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 040419/0001 →