Granted Patent B2

US 8,908,332 · App. 14/146,710 · Granted Dec 9, 2014

Abstract

Claims (20)

1. A suspension assembly comprising:

a mounting plate having a through-hole;

a microactuator mounted on the mounting plate;

a flexure attached to the mounting plate, the flexure including a trace layer that includes a ground trace; and

a conductive epoxy bonded to the microactuator extending through the through-hole to bond to the flexure, wherein the epoxy extends to the ground trace of the flexure such that the microactuator is grounded to the flexure.

2. The suspension assembly of claim 1 further comprising a plurality of microactuators, each microactuator mounted in a respective microactuator mounting structure of the mounting plate, the epoxy being bonded to each of the microactuators and extending through the through-hole to bond to the flexure.

3. The suspension assembly of claim 1 wherein the microactuator is a piezoelectric microactuator.

4. The suspension assembly of claim 3 wherein the piezoelectric microactuator is gold (Au) plated.

5. The suspension assembly of claim 1 wherein the epoxy is silver (Ag).

6. The suspension assembly of claim 1 wherein the flexure further comprises a metal layer and an insulator layer.

7. The suspension assembly of claim 6 wherein the metal layer comprises stainless steel and the insulator layer comprises a polyimide.

8. The suspension assembly of claim 6 wherein the metal layer includes a gap to allow for air flow.

9. The suspension assembly of claim 6 wherein the flexure further comprises an opening in the metal layer and the insulator layer, wherein the opening extends through the metal layer and the insulator layer to the ground trace.

10. The suspension assembly of claim 9 wherein the epoxy extends through the opening.

11. The suspension assembly of claim 6 wherein the flexure further comprises a copper layer that includes the ground trace and a plurality of conductive traces, wherein the ground trace is grounded to the metal layer.

12. The suspension assembly of claim 11 wherein the copper layer is gold (Au) plated such that the epoxy extends from a gold plating of the microactuator to the gold plated copper layer.

13. The suspension assembly of claim 11 wherein the microactuator is configured to position a read head, and wherein the read head is electrically connected to one or more of the plurality of conductive traces.

14. The suspension assembly of claim 11 further comprising an air-hole formed through the copper layer to allow for air flow.

15. The suspension assembly of claim 1 wherein a load beam of the mounting plate includes a gap to allow for air flow.

16. The suspension assembly of claim 1 wherein the ground trace is gold plated.

Assignments (8)