IP Library Granted Patent US 9,231,131
Granted Patent B2
US 9,231,131 · App. 14/148,988 · Granted Jan 5, 2016

Integrated photodetector waveguide structure with alignment tolerance

Inventors: Solomon Assefa (Ossining, NY); Bruce W. Porth (Jericho, VT); Steven M. Shank (Jericho, VT)
Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
H01L31/02327H01L31/028H01L31/1808H01L31/1872
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,231,131
App. No.
14/148,988
Granted
Jan 5, 2016
Kind
B2
Abstract

An encapsulated integrated photodetector waveguide structures with alignment tolerance and methods of manufacture are disclosed. The method includes forming a waveguide structure bounded by one or more shallow trench isolation (STI) structure(s). The method further includes forming a photodetector fully landed on the waveguide structure.

Claims (19)

1. A method comprising:

forming a waveguide structure bounded by one or more shallow trench isolation (STI) structure(s); and

forming a photodetector fully landed on the waveguide structure,

wherein the waveguide structure is formed from silicon material or silicon on insulator material,

wherein the forming of the waveguide structure comprises:

patterning of the silicon on insulator material to form one or more trenches extending to an underlying insulator layer; and

forming insulator material in the one or more trenches to form the STI structure(s),

wherein the photodetector lies within lateral boundaries of the waveguide structure, as defined by divots or recesses formed in the STI structure(s), and

wherein the forming the photodetector comprises:

forming an encapsulating material with a window exposing a portion of the waveguide structure;

forming sensor material on the encapsulating material and the exposed portion of the waveguide structure;

forming an upper encapsulating material on the sensor material and landing on the encapsulating material to seal the sensor material; and

crystallizing the sensor material through an annealing process,

wherein the encapsulating material, the sensor material and the upper encapsulating material are formed within lateral boundaries of the waveguide structure.

2. The method of claim 1 , wherein the waveguide structure is formed with a tapered portion.

3. The method of claim 2 , wherein the photodetector is formed with a tapered input end, fully landed on the waveguide structure.

4. The method of claim 2 , wherein the photodetector is formed with a non-tapered input end.

5. The method of claim 2 , wherein the photodetector and the waveguide structure are formed as continuously tapered structures.

6. The method of claim 1 , wherein the waveguide structure is formed as a continuously tapered structure and the photodetector is formed as a multiple tapered structure, with a tapered input end.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 7, 2014
From: ASSEFA, SOLOMON; PORTH, BRUCE W.; SHANK, STEVEN M.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 031905/0924 →
Continuity (1)
Related Publication 20150194543A1 · Jul 9, 2015