Systems and methods for thermally managing high-temperature processes on temperature sensitive substrates
View Patent ↗A method for depositing one or more thin-film layers on a flexible polyimide substrate having opposing front and back outer surfaces includes the following steps: (a) heating the flexible polyimide substrate such that a temperature of the front outer surface of the flexible polyimide substrate is higher than a temperature of the back outer surface of the flexible polyimide substrate, and (b) depositing the one or more thin-film layers on the front outer surface of the flexible polyimide substrate. A deposition zone for executing the method includes (a) one of more physical vapor deposition sources adapted to deposit one or more metallic materials on the front outer surface of the substrate, and (b) one or more radiant zone boundary heaters.
1. A method for depositing one or more thin-film layers on a flexible polyimide substrate having opposing front and back outer surfaces, the method comprising the steps of:
heating at least the front outer surface of the flexible polyimide substrate, using one or more radiant heat generating elements disposed on a front side of the flexible polyimide substrate, such that a temperature of the front outer surface of the flexible polyimide substrate is higher than a temperature of the back outer surface of the flexible polyimide substrate; and
depositing the one or more thin-film layers on the front outer surface of the flexible polyimide substrate, using one or more deposition sources disposed on the front side of the flexible polyimide substrate, the one or more deposition sources being separate from the one or more radiant heat generating elements.
2. The method of claim 1 , each of the one or more radiant heat generating elements being at least partially in line of sight with the front outer surface of the flexible polyimide substrate.
3. The method of claim 2 , the one or more radiant heat generating elements comprising electric radiant heaters.
4. The method of claim 3 , further comprising maintaining a vacuum around the flexible polyimide substrate during the steps of heating and depositing.
5. The method of claim 4 , the step of depositing comprising depositing a material selected from the group consisting of Copper-Indium-DiSelenide and an alloy of Copper-Indium-DiSelenide on the front outer surface of the flexible polyimide substrate.
6. The method of claim 5 , the step of depositing comprising reacting at least Copper and Indium in the presence of Selenium.
7. A method for depositing one or more thin-film layers on a flexible polyimide substrate having opposing front and back outer surfaces, the method comprising the steps of:
depositing an oxide layer on the back outer surface of the flexible polyimide substrate;
heating at least the front outer surface of the flexible polyimide substrate such that a temperature of the front outer surface of the flexible polyimide substrate is higher than a temperature of the back outer surface of the flexible polyimide substrate;
depositing the one or more thin-film layers on the front outer surface of the flexible polyimide substrate; and
maintaining a vacuum around the flexible polyimide substrate during the steps of heating and depositing;
the step of heating comprising radiantly heating the front outer surface of the flexible polyimide substrate using one or more radiant heat generating elements, each of the one or more radiant heat generating elements being at least partially in line of sight with the front outer surface of the flexible polyimide substrate, the one or more radiant heat generating elements comprising electric radiant heaters,
the step of depositing comprising (a) depositing a material selected from the group consisting of Copper-Indium-DiSelenide and an alloy of Copper-Indium-DiSelenide on the front outer surface of the flexible polyimide substrate and (b) reacting at least Copper and Indium in the presence of Selenium.
8. A method for depositing one or more thin-film layers on a flexible polyimide substrate having opposing front and back outer surfaces, the method comprising the steps of:
heating at least the front outer surface of the flexible polyimide substrate, using one or more radiant heat generating elements disposed on a front side of the flexible polyimide substrate, such that a temperature of the front outer surface of the flexible polyimide substrate is higher than a temperature of the back outer surface of the flexible polyimide substrate;
depositing the one or more thin-film layers on the front outer surface of the flexible polyimide substrate, using one or more deposition sources disposed on the front side of the flexible polyimide substrate, the one or more deposition sources being separate from the one or more radiant heat generating elements; and
allowing radiant transfer of heat away from the flexible polyimide substrate via the back outer surface of the flexible polyimide substrate.
9. The method of claim 8 , further comprising depositing a high emittance coating on the back outer surface of the polyimide substrate.
10. The method of claim 9 , the high emittance coating being selected from the group consisting of a transparent oxide and an optically-transparent nitride.
11. The method of claim 8 , each of the one or more radiant heat generating elements being at least partially in line of sight with the front outer surface of the flexible polyimide substrate.
12. The method of claim 11 , the one or more radiant heat generating elements comprising electric radiant heaters.
13. The method of claim 12 , further comprising maintaining a vacuum around the flexible polyimide substrate during the steps of heating and depositing.
14. The method of claim 13 , the step of depositing comprising depositing a material selected from the group consisting of Copper-Indium-DiSelenide and an alloy of Copper-Indium-DiSelenide on the front outer surface of the flexible polyimide substrate.
15. The method of claim 14 , the step of depositing comprising reacting at least Copper and Indium in the presence of Selenium.