IP Library Granted Patent US 9,279,058
Granted Patent B2
US 9,279,058 · App. 14/152,281 · Granted Mar 8, 2016

Digital embossing

Inventors: Darko Pervan (Viken, SE); Tony Pervan (Stockholm, SE)
Assignee: FLOOR IPTECH AB
C09D11/103B05D3/002B05D3/065B41F17/00B41J2/32B41J2/325B41J3/28B41J3/407B41J11/0015B41M5/50B44C1/24B44C5/04C08K3/22C09D197/02C08K2003/2227Y10T428/24066Y10T428/24901
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Quick Facts
Patent No.
US 9,279,058
App. No.
14/152,281
Granted
Mar 8, 2016
Kind
B2
Abstract

A method of forming a digital embossing ( 17 ) on a surface ( 2 ) by bonding hard press particles ( 67 ) to a carrier ( 68 ). A liquid binder pattern (P) is applied on the carrier by a digital drop application head. Hard press particles ( 67 ) are applied on the carrier ( 68 ) and the binder pattern such that some hard press particles are bonded to the carrier ( 68 ) by the liquid pattern and non-bonded press particles ( 67 ) are removed. The carrier ( 68 ) with the bonded hard press particles ( 67 ) is pressed to the surface ( 2 ) and an embossing is formed when the carrier ( 68 ) with the hard press particles ( 67 ) is removed.

Claims (26)

1. A method of forming a digital embossing on a surface by bonding hard press particles to a carrier, the method comprising the steps of:

providing a liquid binder pattern on the carrier by a digital drop application head that applies a liquid substance on the carrier;

applying the hard press particles on the carrier and the liquid binder pattern such that at least some hard press particles are bonded to the carrier by the liquid binder pattern;

removing non-bonded hard press particles from the carrier;

pressing the carrier with the bonded hard press particles to the surface to obtain an embossed surface; and

removing the carrier with the bonded hard press particles from the embossed surface,

wherein after removing the carrier with the bonded hard press particles from the embossed surface, the bonded hard press particles remain bonded to the carrier.

2. The method as claimed in claim 1 , wherein the hard press particles are mineral particles.

3. The method as claimed in claim 1 , wherein the carrier is a paper or a foil.

4. The method as claimed in claim 1 , wherein the liquid substance comprises water.

5. The method as claimed in claim 1 , wherein the surface is a powder or a paper or a foil.

6. The method as claimed in claim 1 , wherein the surface is a part of a panel.

7. A method of forming a digital embossing on a surface by bonding hard press particles to a carrier, the method comprising the steps of:

providing a liquid binder pattern on the carrier by a digital drop application head that applies a liquid substance on the carrier;

applying the hard press particles on the carrier and the liquid binder pattern such that at least some hard press particles are bonded to the carrier by the liquid binder pattern;

removing non-bonded hard press particles from the carrier;

pressing the carrier with the bonded hard press particles to the surface to obtain an embossed surface; and

removing the carrier with the bonded hard press particles from the embossed surface,

the carrier being substantially planar and comprising a front surface and a rear surface, the rear surface being on an opposite side of the carrier, wherein the hard press particles are arranged on the front surface of the carrier and a print is arranged on the opposite, rear surface of the carrier.

8. The method as claimed in claim 7 , wherein the hard press particles and the print are coordinated such that an in-register embossed printed surface is obtained when the carrier is pressed against the surface.

9. The method as claimed in claim 1 , wherein the method steps are performed in the following order:

providing a liquid binder pattern on the carrier by a digital drop application head that applies a liquid substance on the carrier;

applying the hard press particles on the carrier and the liquid binder pattern such that at least some hard press particles are bonded to the carrier by the liquid binder pattern;

removing non-bonded hard press particles from the carrier;

pressing the carrier with the bonded hard press particles to the surface to obtain an embossed surface; and

removing the carrier with the bonded hard press particles from the embossed surface.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 27, 2016
From: FLOOR IPTECH AB
To: CERALOC INNOVATION AB
Reel/Frame 038394/0603 →
CHANGE OF ASSIGNEE ADDRESS Recorded May 4, 2015
From: FLOOR IPTECH AB
To: FLOOR IPTECH AB
Reel/Frame 035645/0345 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 20, 2014
From: PERVAN, DARKO; PERVAN, TONY
To: FLOOR IPTECH AB
Reel/Frame 032484/0562 →
Continuity (2)
Provisional Application 61751418 · Jan 11, 2013
Related Publication 20140196618A1 · Jul 17, 2014