SUBSTRATE CLEANING AND DRYING METHOD AND SUBSTRATE DEVELOPING METHOD
Provided is a substrate cleaning and drying method, including a cleaning step of cleaning a developed substrate by supplying a cleaning liquid to the substrate; a puddle-forming step of forming a puddle of the cleaning liquid on the substrate; a film-thinning step of thinning a film thickness of the cleaning liquid on the substrate; and a drying step of drying the substrate by spinning the substrate and generating outward airflow and inward airflow between the outward airflow and the substrate, the outward airflow covering a portion above the substrate and the inward airflow causing removal of the cleaning liquid on the substrate.
1 . A substrate cleaning and drying method comprising:
a cleaning step of cleaning a developed substrate by supplying a cleaning liquid to the substrate;
a puddle-forming step of forming a puddle of the cleaning liquid on the substrate;
a film-thinning step of thinning a film thickness of the cleaning liquid on the substrate; and
a drying step of drying the substrate by spinning the substrate and generating outward airflow and inward airflow between the outward airflow and the substrate, the outward airflow covering a portion above the substrate and the inward airflow causing removal of the cleaning liquid on the substrate.
2 . The substrate cleaning and drying method according to claim 1 , wherein
the inward airflow runs to a top face of the substrate, and
the outward airflow runs in the portion above the substrate in a substantially horizontal direction.
3 . The substrate cleaning and drying method according to claim 2 , wherein
the inward airflow impinges on the top face of the substrate to spread circumferentially, and
the outward airflow causes a reduced level of the inward airflow spreading circumferentially.
4 . The substrate cleaning and drying method according to claim 1 , wherein
the outward airflow runs from the center toward a periphery edge of the substrate in plan view, and
the inward airflow impinges on the center of the substrate to spread to the periphery edge of the substrate.
5 . The substrate cleaning and drying method according to claim 4 , wherein
the outward airflow is generated by ejecting gas from a portion above the center of the substrate in a substantially horizontal direction, and
the inward airflow is generated by ejecting gas downwardly from the portion above the center of the substrate in a substantially vertical direction.
6 . The substrate cleaning and drying method according to claim 1 , wherein
the outward airflow and the inward airflow is generated simultaneously through a single gas nozzle.
7 . The substrate cleaning and drying method according to claim 6 , wherein
the outward airflow is generated by ejecting gas circumferentially from a side face of the gas nozzle, and
the inward airflow is generated by ejecting gas downwardly from a lower surface of the gas nozzle.
8 . The substrate cleaning and drying method according to claim 6 , wherein
the gas nozzle is smaller than the substrate in plan view.
9 . The substrate cleaning and drying method according to claim 1 , wherein
in the drying step, the gas nozzle is moved from the portion above the center of the substrate in a substantially horizontal direction while generating the outward airflow and the inward airflow.
10 . The substrate cleaning and drying method according to claim 1 , wherein
no cleaning liquid is supplied to the substrate in the drying step.
11 . The substrate cleaning and drying method according to claim 1 , wherein
a periphery edge of the substrate is not dried prior to an inside of the periphery edge in the drying step with a spinning rate of the substrate being a given upper limit or less.
12 . A substrate developing method comprising:
a developing step of developing a substrate by supplying developer to the substrate:
a cleaning step of cleaning the substrate by supplying a cleaning liquid to the developed substrate;
a puddle-forming step of forming a puddle of the cleaning liquid on the substrate;
a film-thinning step of thinning a film thickness of the cleaning liquid on the substrate; and
a drying step of drying the substrate by spinning the substrate and generating outward airflow and inward airflow between the outward airflow and the substrate, the outward airflow covering a portion above the substrate and the inward airflow causing movement of the cleaning liquid on the substrate.