Refurbished component, electronic device including the same, and method of refurbishing a component of an electronic device

1. A method of refurbishing a surface of a component for an electronic device, the method comprising:

abrading a surface to be refurbished with an abrasive to remove a coating on the surface and provide an abraded surface;

optionally firstly cleaning the abraded surface by contacting with a glass cleaner to provide a firstly cleaned surface;

optionally secondly cleaning the firstly cleaned surface by contacting the firstly cleaned surface with a grease remover to provide a secondly cleaned surface;

optionally contacting the secondly cleaned surface with an activator to provide an activated surface; and

disposing a coating resin on the abraded and optionally activated surface; and

curing the coating resin to provide a coated surface to refurbish the surface of the electronic device,

wherein the coating resin comprises a first resin and a second resin,

the first resin comprises a clear coat and a hardener;

wherein the clear coat comprises a hydroxyl-functional binder comprising a polyurethane, a (meth)acrylic acid copolymer, or a combination thereof; the polyurethane having a number average molecular weight Mn of 500 to 500,000 g/mol, an acid value of 0 to 100 mg KOH/g, and a hydroxyl value of 40 to 400 mg KOH/g; the (meth)acrylic acid copolymer has a number average molecular mass Mn of 1000 to 20,000 g/mol, an acid value of 0 to 100 mg KOH/g, and a hydroxyl value of 40 to 400 mg KOH/g; and

the hardener comprises a polyisocyanate crosslinker; and

the second resin comprises a first component comprising

a hydroxyl functional dendritic polymer;

optionally an acrylic polyol; and

a plurality of metal oxide nanoparticles optionally encapsulated in a hydroxyl functional polymer or a hydroxyl functional fluorosurfactant.

2. The method of claim 1 , wherein the abrading comprises abrading with a diamond polishing compound.

3. The method of claim 2 , wherein the diamond polishing compound comprises diamond having a mesh of 600 to 2000 grit.

4. The method of claim 1 , wherein the abrading comprises abrading with aluminum oxide having a particle size of 5 to 80 micrometers by abrasive jet machining.

5. The method of claim 1 , wherein the activator comprises a silane.

6. The method of claim 1 , wherein the polyurethane comprises a silicon-modified or a (meth)acrylate-modified polyurethane resin.

7. The method of claim 1 , wherein the polyisocyanate crosslinker has an average NCO functionality of 1.5 to 5.

8. The method of claim 7 , wherein the polyisocyanate crosslinker comprises hexamethylene diisocyanate, isophorone diisocyanate, 3-isocyanatomethyl-3,5,5-trimethylcyclohexyl isocyanate, 1-isocyanato-3,3,5-trimethyl-5-isocyanatomethyl-cyclohexane, bis(isocyanatocyclohexyl)-methane, a derivative of one of the foregoing, or a combination thereof.

9. The method of claim 1 , wherein the first resin further comprises a reducer, the reducer comprising butyl acetate, propylene glycol monoethyl ether acetate, propylene glycol methyl ether acetate, 2-methoxy-1-methylethyl acetate, 2-methoxypropyl-1-acetate, acetone, xylene, toluene, a combination comprising at least one of the foregoing.

10. The method of claim 1 , wherein the second resin further comprises a second component, wherein the second component comprises a cross-linking agent comprising polyisocyanate, a melamine formaldehyde resin, or a combination thereof.

11. The method of claim 1 , wherein the hydroxyl functional dendritic polymer is a branched polyester having a hydroxyl functionality of 40 to 80.

12. The method of claim 1 , wherein the acrylic polyol has a hydroxyl functionality of 2 to 6.

13. The method of claim 1 , wherein the plurality of encapsulated metal oxide nanoparticles comprises encapsulated aluminum oxide nanoparticles, encapsulated zinc oxide nanoparticles, or a combination thereof.

14. The method of claim 1 , wherein the hydroxyl functional polymer is a hydroxyl functional silicone polyacrylate.

15. The method of claim 1 , wherein the hydroxyl functional fluorosurfactant is a hydroxyl functional fluorinated methacrylate polymer.

16. A method of refurbishing a surface, the method comprising:

abrading a surface to be refurbished with an abrasive to remove a coating on the surface and provide an abraded surface;

optionally firstly cleaning the abraded surface by contacting with a glass cleaner to provide a firstly cleaned surface;

optionally secondly cleaning the firstly cleaned surface by contacting the firstly cleaned surface with a grease remover to provide a secondly cleaned surface;

optionally contacting the secondly cleaned surface with an activator to provide an activated surface; and

disposing a coating resin on the abraded and optionally activated surface; and

curing the coating resin to provide a coated surface to refurbish the surface,

wherein the coating resin comprises a first resin and a second resin,

the first resin comprises a clear coat and a hardener;

wherein the clear coat comprises a hydroxyl-functional binder comprising a polyurethane, a (meth)acrylic acid copolymer, or a combination thereof; the polyurethane having a number average molecular weight Mn of 500 to 500,000 g/mol, an acid value of 0 to 100 mg KOH/g, and a hydroxyl value of 40 to 400 mg KOH/g; the (meth)acrylic acid copolymer has a number average molecular mass Mn of 1000 to 20,000 g/mol, an acid value of 0 to 100 mg KOH/g, and a hydroxyl value of 40 to 400 mg KOH/g; and

the hardener comprises a polyisocyanate crosslinker; and

the second resin comprises a first component comprising

a hydroxyl functional dendritic polymer;

optionally an acrylic polyol; and

a plurality of metal oxide nanoparticles optionally encapsulated in a hydroxyl functional polymer or a hydroxyl functional fluorosurfactant.

17. A refurbished component for an electronic device comprising a surface and a polymerization product of a resin comprising a first component and a second component disposed on the surface,

wherein the first component comprises:

a hydroxyl functional dendritic polymer having a hydroxyl functionality of 40 to 80;

a plurality of metal oxide nanoparticles optionally encapsulated in a hydroxyl functional polymer or a hydroxyl functional fluorosurfactant; and

a hydroxyl-functional binder comprising a polyurethane, a (meth)acrylic copolymer, or a combination thereof, wherein the hydroxyl-functional binder has a hydroxyl functionality of 2 to 25; the polyurethane having a number average molecular weight Mn of 500 to 500,000 g/mol, an acid value of 0 to 100 mg KOH/g, and a hydroxyl value of 40 to 400 mg KOH/g; the (meth)acrylic acid copolymer has a number average molecular mass Mn of 1000 to 20,000 g/mol, an acid value of 0 to 100 mg KOH/g, and a hydroxyl value of 40 to 400 mg KOH/g; and

wherein the second component comprises a cross-linking agent comprising a polyisocyanate, a melamine formaldehyde resin, or a combination thereof.

18. A method of refurbishing a surface of a component for an electronic device, the method comprising:

abrading a surface to be refurbished with an abrasive to remove a coating on the surface and provide an abraded surface;

optionally firstly cleaning the abraded surface by contacting with a glass cleaner to provide a firstly cleaned surface;

optionally secondly cleaning the firstly cleaned surface by contacting the firstly cleaned surface with a grease remover to provide a secondly cleaned surface;

contacting the secondly cleaned surface with an activator to provide an activated surface; and

disposing a coating resin on the abraded and activated surface; and

curing the coating resin to provide a coated surface to refurbish the surface of the electronic device,

wherein the coating resin comprises a first resin and a second resin,

the first resin comprises a clear coat, hardener, and a reducer,

wherein the clear coat comprises a hydroxyl-functional binder comprising a polyurethane, a (meth)acrylic acid copolymer, or a combination thereof; the polyurethane having a number average molecular weight Mn of 500 to 500,000 g/mol, an acid value of 0 to 100 mg KOH/g, and a hydroxyl value of 40 to 400 mg KOH/g; the (meth)acrylic acid copolymer has a number average molecular mass Mn of 1000 to 20,000 g/mol, an acid value of 0 to 100 mg KOH/g, and a hydroxyl value of 40 to 400 mg KOH/g; and

the hardener comprises a polyisocyanate crosslinker; and

the reducer comprises a solvent; and

the second resin comprises a first component and a second component,

wherein the first component comprises:

a hydroxyl functional dendritic polymer;

optionally an acrylic polyol; and

a plurality of metal oxide nanoparticles optionally encapsulated in a hydroxyl functional polymer or a hydroxyl functional fluorosurfactant; and

the second component comprises a cross-linking agent comprising a polyisocyanate, a melamine formaldehyde resin, or a combination thereof, and

wherein the surface comprises glass.