Masking substrates for application of protective coatings
A method for applying a protective coating to selected portions of a substrate is disclosed. The method includes applying a mask to or forming a mask on at least one portion of the substrate that is not to be covered with the protective coating. The mask may be selectively formed by applying a flowable material to the substrate. Alternatively, the mask may be formed from a preformed film. With the mask in place, the protective coating may be applied to the substrate and the mask. A portion of the protective coating that overlies the mask may be delineated from other portions of the protective coating; for example, by cutting, weakening or removing material from the protective coating at locations at or adjacent to the perimeter of the mask. The portion of the protective coating that overlies the mask, and the mask, may then be removed from the substrate.
1. A method for protectively coating a substrate, comprising:
introducing a flowable mask material into at least one selected communication port of a substrate to define a mask in the at least one selected communication port, the flowable mask material substantially conforming a shape of a surface of the at least one selected communication port under natural force;
applying a mechanical force to the flowable mask material to conform the flowable mask material to the shape of the surface of the at least one selected communication port after the flowable mask material has been introduced into the at least one selected communication port, wherein the mechanical force is applied by an instrument that does not form a part of a finished device including the substrate, wherein the mask bonds to the substrate;
applying a protective coating over the substrate and over the mask, such that the protective coating adheres to the substrate and the mask;
cutting the protective coating at locations outside an outer perimeter of the mask, wherein cuts from the cutting the protective coating does not extend completely through the protective coating; and
removing the mask and at least a portion of the protective coating over the mask.
2. The method of claim 1 , wherein introducing the flowable mask material comprises introducing the flowable mask material into a connector of an electronic assembly and wherein the mechanical force applied by the instrument is different than an applicator instrument that applies the liquid masking material.
3. The method of claim 1 , wherein introducing the flowable mask material comprises introducing a hot melt adhesive into the at least one selected communication port.
4. The method of claim 1 , wherein removing the mask and at least the portion of the protective coating over the mask comprises removing locations of the protective coating over or adjacent to a perimeter of the mask material.
5. The method of claim 4 , further comprising:
pulling at least the portion of the protective coating from the mask material or from the substrate.
6. The method of claim 5 , further comprising:
pulling the mask material from the substrate, with a portion of the protective coating remaining on protected areas of the substrate.
7. The method of claim 1 , further comprising:
inserting a plug into the at least one selected communication port in the substrate before introducing the flowable mask material.
8. The method of claim 7 , wherein introducing the flowable mask material comprises applying a seal around the plug to create a seal between the plug and the substrate at an opening of the at least one selected port.
9. A method for applying a protective coating to a substrate, comprising:
applying a liquid mask material to at least one selected location of an electronic device assembly, the at least one selected location being a location to be exposed through a protective coating, including introducing the liquid masking material into at least one communication port of the electronic device assembly, the liquid mask material flowing to substantially conform to a shape of a surface of the at least one selected location of the electronic device assembly upon being applied to the at least one selected location of the electronic device assembly;
applying a mechanical force to the liquid mask material to conform the liquid mask material to the shape of the surface of the at least one selected location after the liquid mask material has been applied to the at least one selected location, wherein the mechanical force is applied by an instrument that does not form a part of a finished device including the substrate;
allowing the liquid mask material to substantially harden and bond to the substrate, by cooling to an ambient temperature, to define a mask;
after the mask is hardened, applying the protective coating over the mask and the electronic device assembly, such that the protective coating adheres to the mask and the electronic device assembly;
cutting the protective coating at locations outside an outer perimeter of the mask; and
removing the mask and at least a portion of the protective coating over the mask.
10. The method of claim 9 , wherein applying the protective coating over the mask comprises applying a coating comprising poly(p-xylylene) and wherein the mechanical force applied by the instrument is different than an applicator instrument that applies the liquid masking material.
11. The method of claim 9 , wherein applying the protective coating over the mask comprises applying a coating comprising aluminum oxide.