Granted Patent B2

US 9,308,596 · App. 14/157,887 · Granted Apr 12, 2016

Abstract

Claims (95)

1. An assembly, comprising:

a first component including a hole between two first component surfaces, the hole including a first metal layer on a third surface of the first component inside the hole, the third surface at least partially defining the hole;

a second component including a second component surface adjacent one of the first component surfaces, the second component including a second metal layer on the second component; and

a fusible material placed at least partially in the hole and at least partially contacting the first and second metal layers, the fusible material establishing a connection between the first and second metal layers.

2. The assembly of claim 1 , wherein the second component includes a recess in the second component surface, the second metal layer being at least partially in the recess.

3. The assembly of claim 2 , wherein

the first metal layer is metalized onto the first component inside the hole; and

the second metal layer is metalized onto the second component inside the recess.

4. The assembly of claim 1 , wherein

the first component comprises a first material that is different from the metal of the first metal layer; and

the second component comprises a second material that is different from the metal of the second metal layer.

5. The assembly of claim 4 , wherein

the second component comprises a silicon wafer; and

the first component comprises one of borosilicate or silicon.

6. The assembly of claim 1 , wherein the fusible material comprises solder.

7. The assembly of claim 1 , wherein the connection between the first and second metal layers comprises a mechanical connection that secures the first component to the second component.

8. The assembly of claim 1 , wherein

the fusible material comprises a metal alloy;

the first component supports an electrically conductive member that is at least partially exposed on the one of the first component surfaces;

the electrically conductive member is spaced from the hole; and

the second metal layer is positioned on the second component such that the metal alloy contacts the first metal layer, the second metal layer and the conductive member.

9. The assembly of claim 8 , comprising a second conductive member and wherein

the metal alloy contacts the second conductive member; and

the metal alloy establishes an electrically conductive connection between the conductive member and the second conductive member.

10. The assembly of claim 9 , wherein

the first component comprises a borosilicate wafer;

the second component comprises a silicon wafer;

the second component includes at least one channel configured to carry a fluid;

the channel is open toward the one surface of the first component; and

the conductive member comprises a heater element situated to selectively heat a fluid in the channel.

11. The assembly of claim 1 , wherein

the first component comprises a silicon substrate turning minor;

the second component comprises an optical waveguide component; and

the connection established by the fusible material provides a mechanical connection securing the silicon substrate turning minor to the one surface of the optical waveguide component.

12. A method, comprising:

making a hole in a first component between two first component surfaces;

establishing a first metal layer on a third surface of the first component inside the hole, the third surface at least partially defining the hole;

establishing a second metal layer on a second component;

situating a surface of the second component adjacent one of the first component surfaces;

placing a fusible material at least partially in the hole;

melting at least some of the fusible material in the hole, such that the fusible material at least partially contacts the first and second metal layers; and

establishing a connection between the first and second metal layers with the melted fusible material.

13. The method of claim 12 , comprising

making a recess in the second component; and

establishing the second metal layer inside the recess.

14. The method of claim 13 , comprising

metalizing the first metal layer onto the first component inside the hole; and

metalizing the second metal layer onto the second component inside the recess.

15. The method of claim 12 , wherein

the first component comprises a first material that is different from the metal of the first metal layer; and

the second component comprises a second material that is different from the metal of the second metal layer.

16. The method of claim 12 , wherein the fusible material comprises solder.

17. The method of claim 12 , wherein establishing the connection comprises establishing a mechanical connection that secures the first component to the second component.

18. The method of claim 12 , wherein

the fusible material comprises a metal alloy;

the method comprising:

supporting an electrically conductive member on the first component where the conductive member is at least partially exposed on the one of the first component surfaces;

making the hole in the first component in a position where the electrically conductive member is spaced from the hole;

situating at least one of the recess and the second metal layer relative to the hole where the melted metal alloy contacts the first metal layer, the second metal layer and the conductive member; and

establishing an electrically conductive connection between the melted metal alloy and a second conductive member such that the metal alloy establishes an electrically conductive connection between the conductive member and the second conductive member.

19. The method of claim 18 , wherein

the first component comprises a borosilicate wafer;

the second component comprises a silicon wafer;

the second component includes at least one channel configured to carry a fluid;

the channel is open toward the one surface of the first component; and

the conductive member comprises a heater element situated to selectively heat a fluid in the channel.

20. The method of claim 12 , wherein

the first component comprises a silicon substrate turning minor;

the second component comprises an optical waveguide component; and

the method comprises:

securing the silicon substrate turning minor to the one surface of the optical waveguide component using the established connection.

21. The method of claim 12 , wherein the first component is a generally planar substrate, and the second component is a generally planar substrate.

22. An assembly, comprising:

a first component including a hole between two first component surfaces, the hole including a first metal layer on the first component inside the hole;

a second component including a second component surface adjacent one of the first component surfaces, the second component including a second metal layer on the second component;

a fusible material at least partially in the hole and at least partially contacting the second metal layer, the fusible material establishing a connection between the first and second metal layers, the fusible material comprising a metal alloy;

an electrically conductive member; and

a second conductive member;

wherein:

the first component comprises a borosilicate wafer, and supports the electrically conductive member, which is at least partially exposed on the one of the first component surfaces;

the electrically conductive member is spaced from the hole;

the second metal layer is positioned on the second component such that the metal alloy contacts the first metal layer, the second metal layer and the conductive member;

the metal alloy contacts the second conductive member;

the metal alloy establishes an electrically conductive connection between the conductive member and the second conductive member;

the second component comprises a silicon wafer and includes at least one channel configured to carry a fluid;

the channel is open toward the one surface of the first component; and

the conductive member comprises a heater element situated to selectively heat a fluid in the channel.

23. An assembly, comprising:

a first component including a hole between two first component surfaces, the hole including a first metal layer the first component inside the hole;

a second component including a second component surface adjacent one of the first component surfaces, the second component including a second metal layer on the second component; and

a fusible material at least partially in the hole and at least partially contacting the second metal layer, the fusible material establishing a connection between the first and second metal layers;

wherein the first component comprises a silicon substrate turning minor;

wherein the second component comprises an optical waveguide component; and

wherein the connection established by the fusible material provides a mechanical connection securing the silicon substrate turning mirror to the one surface of the optical waveguide component.

24. The assembly of claim 1 , wherein the first component is a generally planar substrate, and the second component is a generally planar substrate.

Assignments (10)