IP Library Granted Patent US 9,345,131
Granted Patent B2
US 9,345,131 · App. 14/162,773 · Granted May 17, 2016

Flexible electronic device

Inventors: Yi-Cheng Peng (Taoyuan County, TW); Chang-An Ho (Keelung, TW)
Assignee: Industrial Technology Research Institute
H05K1/028G09F9/33G09F13/22H05K1/189H05K2201/09063H05K2201/10106H05K2201/10128
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Quick Facts
Patent No.
US 9,345,131
App. No.
14/162,773
Granted
May 17, 2016
Kind
B2
Abstract

A flexible electronic device including a component portion and at least one folded portion connected to the component portion is provided. The flexible electronic device has a plurality of flexed lines located on the single folded portion and a plurality of stress relief holes, wherein the stress relief holes are separated from each other, and at least a part of the stress relief holes is located on at least one of the flexed lines.

Claims (16)

1. A flexible electronic device, comprising a component portion and at least one folded portion connected to the component portion, wherein the flexible electronic device has a plurality of flexed lines located on one of the at least one folded portion and a plurality of stress relief holes, the stress relief holes are separated from each other, and at least a part of the stress relief holes is located on at least one of the flexed lines, and at least a part of the stress relief holes simultaneously passes through two flexed lines.

2. The flexible electronic device as claimed in claim 1 , wherein the flexed lines are parallel to each other.

3. The flexible electronic device as claimed in claim 1 , wherein the flexible electronic device has at least one notch, the notch extends from edge of the flexible electronic device towards the component portion to divide the folded portion into a plurality of sub-areas, wherein the stress relief holes are located at least on one of the sub-areas.

4. The flexible electronic device as claimed in claim 3 , wherein the stress relief holes are located only on one of the sub-areas.

5. The flexible electronic device as claimed in claim 1 , wherein the folded portion and the component portion comprises:

a carrier board;

an organic light emitting device, disposed on the carrier board; and

a cover, disposed on the carrier board and covering the organic light emitting device, wherein area of the carrier board not covered by the cover is the folded portion.

6. A flexible electronic device, comprising a component portion and at least one folded portion connected to the component portion, wherein the flexible electronic device has a plurality of flexed lines located on the single folded portion, wherein the folded portion comprises a reflexed portion located at an edge of the folded portion, and the reflexed portion is jointed to the component portion, wherein the component portion comprises a carrier board, the carrier board comprises a first portion and a second portion, and thickness of the first portion is less than thickness of the second portion.

7. The flexible electronic device as claimed in claim 6 , wherein the reflexed portion is jointed to the component portion through a bonding layer.

8. The flexible electronic device as claimed in claim 7 , wherein the bonding layer is disposed at an area where the reflexed portion and the component portion are overlapped with each other.

9. The flexible electronic device as claimed in claim 7 , wherein the bonding layer overlays a part of the component portion.

10. The flexible electronic device as claimed in claim 7 , wherein the bonding layer entirely overlays the component portion.

11. The flexible electronic device as claimed in claim 6 , further comprising a substrate disposed on the component portion and located between the reflexed portion and the component portion, wherein the reflexed portion, the component portion and the substrate are joined together through a bonding layer.

12. The flexible electronic device as claimed in claim 6 , wherein the first portion is adjacent to the folded portion and connected between the second portion and the folded portion, and the reflexed portion and the first portion are jointed together through a bonding layer.

13. The flexible electronic device as claimed in claim 12 , wherein thickness of the first portion is the same as thickness of the folded portion.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 15, 2022
From: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
To: HANNSTAR DISPLAY CORPORATION
Reel/Frame 059365/0305 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 6, 2014
From: PENG, YI-CHENG; HO, CHANG-AN
To: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Reel/Frame 032151/0244 →
Priority Claims (1)
TW 103101154 A · Jan 13, 2014 · national
Continuity (2)
Provisional Application 61756477 · Jan 25, 2013
Related Publication 20140209360A1 · Jul 31, 2014