Structural epoxy resin adhesives containing elastomeric tougheners capped with ketoximes
View Patent ↗Structural adhesives are prepared from an elastomeric toughener that contains urethane and/or urea groups, and have terminal isocyanate groups that are capped with ketoxime compound. The adhesives have very good storage stability and cure to form cured adhesives that have good lap shear and impact peel strengths, even at −40° C.
1. An epoxy-based structural adhesive, comprising: A) 25-60 wt % non-rubber-modified epoxy resin, based on weight of the adhesive; B) 5-45 wt % of one or more reactive elastomeric tougheners containing capped isocyanate groups, based on weight of the adhesive; and C) one or more epoxy curing agents; wherein at least 90% of the capped isocyanate groups of the reactive tougheners in the structural adhesive are capped with a ketoxime compound, wherein the one or more elastomeric tougheners comprises at least one of a ketoxime-capped reaction product of i) a polyol with an aliphatic polyisocyanate, or ii) a polyamine with a polyisocyanate; which, when the structural adhesive is cured, has an impact peel strength at room temperature greater than 39 N/mm.
2. The epoxy-based structural adhesive of claim 1 , wherein at least 95% of the capped isocyanate groups of all reactive tougheners in the structural adhesive are capped with a ketoxime compound and 1% or fewer of the capped isocyanate groups are capped with an epoxy-functional capping group.
3. The epoxy-based structural adhesive of claim 1 , wherein the reactive toughener(s) contain at least one segment of a polyether or a butadiene homopolymer or copolymer, the segment having a molecular weight of at least 800 daltons.
4. The epoxy-based structural adhesive of claim 1 , wherein the epoxy resin includes at least one diglycidyl ether of a polyhydric phenol, the adhesive further comprises a liquid rubber-modified epoxy resin, a core-shell rubber or both a liquid rubber-modified epoxy resin and a core-shell rubber; and the adhesive contains from about 8 to 30 weight percent of the reactive toughener.
5. The epoxy-based structural adhesive of claim 1 , which is a one-part adhesive that contains a curing agent and a catalyst, and which cures rapidly at a temperature of 140° C. or higher but slowly if at all at a temperature of 80° C. or lower.
6. The epoxy-based structural adhesive of claim 1 , which further contains at least one monomeric or oligomeric, addition polymerizable, ethylenically unsaturated material having a molecular weight of less than about 1500.
7. The epoxy-based structural adhesive of claim 1 , which contains at least one epoxide-terminated liquid rubber.
8. The structural adhesive of claim 1 which, when cured, has at least one of the following properties: a) a lap shear strength of at least about 15 MPa at 23° C.; b) a Young's modulus of at least about 1000 MPa at 23° C.; and c) a tensile strength of at least about 20 MPa at 23° C.
9. A method comprising providing a first substrate and a second substrate; applying the epoxy-based structural adhesive of claim 1 to one or both of the first and second substrates; contacting the first and second substrates so that the adhesive is located between the first and second substrates; and curing the structural adhesive to form an adhesive bond between the first and second substrates.
10. A cured composition prepared by curing the epoxy-based adhesive of claim 1 .
11. The cured composition of claim 10 , having a lap shear strength of at least about 15 MPa at 23° C.
12. The cured composition of claim 10 , having a Young's modulus of at least about 1000 MPa at 23° C.
13. The cured composition of claim 10 , having a tensile strength of at least about 20 MPa at 23° C.