Silver halide conductive element precursor and devices
A conductive film element precursor can be used to provide conductive silver lines from silver halide in a non-color hydrophilic photosensitive layer. This precursor has a substrate having, in order on at least one supporting side: a non-color hydrophilic photosensitive layer comprising a silver halide at a coverage of less than 5000 mg Ag/m 2 , and a hydrophilic overcoat disposed over the non-color hydrophilic photosensitive layer. This hydrophilic overcoat is the outermost layer and comprises silver halide in an amount of at least 5 mg Ag/m 2 and up to and including 150 mg Ag/m 2 . The noted hydrophilic layers can be disposed on both supporting sides of the substrate to form a duplex conductive film element precursor. After imagewise exposure, the resulting exposed silver halide is developed and fixed to provide silver metal in conductive lines on either or both supporting sides of the substrate.
1. A conductive film element precursor comprising a substrate having a first supporting side and an opposing second supporting side, and the conductive film element precursor comprising, in order on the first supporting side the substrate:
a first non-color hydrophilic photosensitive layer comprising a silver halide at a coverage of less than 5000 mg Ag/m 2 , and
a first hydrophilic overcoat disposed over the first non-color hydrophilic photosensitive layer, which first hydrophilic overcoat is the outermost layer on the first supporting side of the substrate, and the first hydrophilic overcoat comprises silver halide in an amount of at least 5 mg Ag/m 2 and up to and including 150 mg Ag/m 2 .
2. The conductive film element precursor of claim 1 , wherein the silver halide in the first hydrophilic overcoat has a grain ESD of at least 100 nm and up to and including 1000 nm.
3. The conductive film element precursor of claim 1 , wherein the silver halide in the first non-color hydrophilic photosensitive layer has a grain ESD of at least 30 nm and up to and including 300 nm.
4. The conductive film element precursor of claim 1 , wherein the ratio of grain ESD to dry thickness of the first hydrophilic layer is from 0.25:1 to and including 1.75:1.
5. The conductive film element precursor of claim 1 , wherein the dry thickness of the first hydrophilic overcoat is at least 100 nm and up to and including 800 nm.
6. The conductive film element precursor of claim 1 , wherein the dry thickness of the first hydrophilic overcoat is at least 300 nm and up to and including 500 nm.
7. The conductive film element precursor of claim 1 , wherein the silver halide in the first hydrophilic overcoat comprises up to 100 mol % chloride or up to 100 mol % bromide, and up to and including 5 mol % iodide, based on total silver content.
8. The conductive film element precursor of claim 1 , wherein the silver halide in the first hydrophilic overcoat comprises up to 100 mol % bromide, based on the total silver.
9. The conductive film element precursor of claim 1 , wherein the exposure sensitivity of the silver halide emulsion in the first hydrophilic overcoat is at least 10% and up to and including 200% of the optimum sensitivity of the silver halide emulsion in the first non-color hydrophilic photosensitive layer, expressed as μJ/m 2 .
10. The conductive film element precursor of claim 1 , further comprising an UV absorbing layer between the first supporting side of the substrate and the first non-color hydrophilic photosensitive layer.
11. The conductive film element precursor of claim 1 , further comprising on the opposing second supporting side of the substrate, a second non-color hydrophilic photosensitive layer and a second hydrophilic overcoat disposed over the second non-color hydrophilic photosensitive layer.
12. The conductive film element precursor of claim 11 , wherein the second non-color hydrophilic photosensitive layer and the second hydrophilic overcoat have the same composition as the first non-color hydrophilic photosensitive layer and the first hydrophilic overcoat, respectively.
13. The conductive film element precursor of claim 1 , wherein the exposure sensitivity of the silver halide emulsion in the first hydrophilic overcoat is at least 10% and up to and including 200% of the optimum sensitivity of the silver halide emulsion in the first non-color hydrophilic photosensitive layer, as expressed as μJ/m 2 , and the exposure sensitivity of the silver halide emulsion in the second hydrophilic overcoat is at least 10% and up to and including 200% of the optimum sensitivity of the silver halide emulsion in the second non-color hydrophilic photosensitive layer, as expressed as μJ/m 2 .
14. A method for providing a conductive film element, comprising:
imagewise exposing a conductive film element precursor comprising:
a substrate having a first supporting side and an opposing second supporting side, and the conductive film element precursor comprising, in order on the first supporting side of the substrate:
a first non-color hydrophilic photosensitive layer comprising a silver halide at a coverage of less than 5000 mg Ag/m 2 , and
a first hydrophilic overcoat disposed over the first non-color hydrophilic photosensitive layer, which first hydrophilic overcoat is the outermost layer on the first supporting side of the substrate, and the first hydrophilic overcoat comprises silver in an amount of at least 5 mg Ag/m 2 and up to and including 150 mg Ag/m 2 ,
to provide a latent pattern containing silver halide in the first non-color hydrophilic photosensitive layer,
converting the silver halide in the latent pattern to silver metal by contacting the exposed conductive film element precursor with a developing solution comprising a silver halide developing agent,
removing unconverted silver halide from the first non-color hydrophilic photosensitive layer, leaving silver metal in a pattern corresponding to the latent pattern, and
optionally further treating the silver metal in the pattern to enhance its conductivity.
15. The method of claim 14 , wherein the conductive film element precursor further comprises on the opposing second supporting side of the substrate:
a second non-color hydrophilic photosensitive layer and a second hydrophilic overcoat disposed over the second non-color hydrophilic photosensitive layer, the second hydrophilic overcoat being the outermost layer on the opposing second supporting side of the substrate,
the second non-color hydrophilic photosensitive layer comprising a silver at a coverage of less than 5000 mg Ag/m 2 , and the second hydrophilic overcoat comprises silver halide in an amount of at least 5 mg Ag/m 2 and up to and including 150 mg Ag/m 2 ,
the method further comprising:
imagewise exposing the second non-color hydrophilic photosensitive film to provide a second latent pattern containing silver halide in the second non-color hydrophilic photosensitive layer,
converting the silver halide in the second latent pattern to silver metal during contacting the exposed conductive film element precursor with the developing solution comprising the silver halide developing agent,
removing unconverted silver halide from the second non-color hydrophilic photosensitive layer, leaving silver metal in a second pattern corresponding to the second latent pattern on the opposing second supporting side of the substrate, and
optionally further treating the silver metal in the second pattern to enhance its conductivity.
16. A conductive film element provided by the method of claim 14 , wherein the conductive film element comprises:
a substrate having a first supporting side and an opposing second supporting side, and comprising on the first supporting side:
a first non-color hydrophilic layer comprising a conductive silver pattern, and
a first hydrophilic overcoat disposed over the first non-color hydrophilic layer, which first hydrophilic overcoat is the outermost layer on the first supporting side of the substrate, and the first hydrophilic overcoat comprises silver halide in an amount of at least 5 mg Ag/m 2 and up to and including 150 mg Ag/m 2 .
17. The conductive film element of claim 16 , further comprising on the opposing second supporting side:
a second non-color hydrophilic layer comprising a conductive silver pattern, and
a second hydrophilic overcoat disposed over the second non-color hydrophilic layer, which second hydrophilic overcoat is an outermost layer on the opposing second supporting side of the substrate, and the second hydrophilic overcoat comprises silver halide in an amount of at least 5 mg Ag/m 2 and up to and including 150 mg Ag/m 2 .
18. The conductive film element of claim 17 , wherein the conductive silver pattern on the first supporting side of the substrate and the conductive silver pattern on the opposing second supporting side of the substrate have the same composition.
19. The conductive film element of claim 17 , wherein the conductive silver pattern on the first supporting side of the substrate and the conductive silver pattern on the opposing second supporting side of the substrate are different in composition, pattern arrangement, or conductive line thickness.