IP Library Granted Patent US 9,293,263
Granted Patent B2
US 9,293,263 · App. 14/167,461 · Granted Mar 22, 2016

Solid electrolytic capacitor

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,293,263
App. No.
14/167,461
Granted
Mar 22, 2016
Kind
B2
Abstract

An outer insulation member made of a first resin packs a part of an anode terminal. The packed part of the anode terminal has a predetermined section. All surfaces of the predetermined section consist of a front surface, a back surface and edges connecting between the front surface and the back surface. The front surface includes a connection area. An anode lead wire is connected to the connection area while being not connected to the anode terminal other than the connection area. The all surfaces of the predetermined section are completely covered with a mask layer made of a second resin except for the connection area. The second resin is different from the first resin in at least one of composition thereof, content of an inclusion, size of an inclusion and shape of an inclusion.

Claims (53)

1. A solid electrolytic capacitor comprising:

a capacitor element including an anode body, an anode lead wire extending from said anode body and a cathode layer;

a cathode terminal connected to said cathode layer;

an outer insulation member comprising a first resin, wherein said outer insulation member encases said capacitor element and a portion of said cathode terminal; and

an anode terminal, a portion of which is encased in said outer insulation member, wherein said anode terminal has a predetermined section, all surfaces of the predetermined section consisting of a front surface, a back surface and edges connecting between said front surface and said back surface wherein said front surface includes a connection area with said anode lead wire being connected at said connection area while being not connected to said anode terminal other than at said connection area, wherein all surfaces of said predetermined section except for said connection area are covered with a mask layer comprising a second resin, said first resin and said second resin being different from each other in at least one of composition, contents of inclusions, sizes of inclusions and shapes of inclusions.

2. The solid electrolytic capacitor of claim 1 , wherein:

said mask layer has a contact angle of water droplets not smaller than 80 degrees.

3. The solid electrolytic capacitor of claim 2 , wherein:

said mask layer has a contact angle of water droplets not smaller than 85 degrees.

4. The solid electrolytic capacitor of claim 3 , wherein:

said mask layer has a contact angle of water droplets not smaller than 90 degrees.

5. The solid electrolytic capacitor of claim 1 , wherein:

said anode terminal includes a first portion, a second portion and a coupling portion coupling said first portion and said second portion;

said second portion is fixed to a circuit board when said solid electrolytic capacitor is mounted on said circuit board;

said first portion is provided with said predetermined section; and

said mask layer completely covers said first portion except for said connection area.

6. The solid electrolytic capacitor of claim 5 , wherein said mask layer covers, at least in part, said coupling portion.

7. The solid electrolytic capacitor of claim 1 , wherein said mask layer covers at least a portion of said anode lead wire.

8. The solid electrolytic capacitor as recited in claim 1 , wherein said mask layer covers at least a portion of said capacitor element, part of said anode terminal and part of said cathode terminal.

9. The solid electrolytic capacitor as recited in claim 1 , wherein:

said anode body and said anode lead wire are made of tantalum; and

said anode terminal is formed of a copper plate plated with at least one of nickel and tin.

10. The solid electrolytic capacitor as recited in claim 1 , wherein said second resin is made of silicone or fluoroplastic.

11. The solid electrolytic capacitor as recited in claim 1 , wherein said capacitor element further includes a solid electrolyte layer made of conductive polymer.

12. A method for forming a capacitor comprising:

providing an anode with a dielectric thereon and an anode lead wire extending therefrom;

providing an anode terminal comprising a first portion, a second portion and a coupling portion;

attaching said anode lead wire to said first portion at a connection area;

encasing at least a portion of said anode terminal with a mask layer comprising a second resin;

encasing said capacitor with a first resin wherein said first resin and said second resin differ by at least one of composition, contents of inclusions, sizes of inclusions and shapes of inclusions;

said anode terminal includes a first portion, a second portion and a coupling portion coupling said first portion and said second portion;

fixing said second portion to a circuit board; and

said mask layer completely covers said first portion except for said connection area.

13. The method for forming capacitor of claim 12 , wherein:

said mask layer has a contact angle of water droplets not smaller than 80 degrees.

14. The method for forming capacitor of claim 13 , wherein:

said mask layer has a contact angle of water droplets not smaller than 85 degrees.

15. The method for forming capacitor of claim 14 , wherein:

said mask layer has a contact angle of water droplets not smaller than 90 degrees.

16. The method for forming capacitor of claim 12 further comprising covering at least in part of said coupling portion with said mask layer.

17. The method for forming capacitor of claim 12 , further comprising covering at least a portion of said anode lead wire with said mask layer.

18. The method for forming capacitor as recited in claim 12 , wherein said mask layer covers at least a portion of said capacitor element, part of said anode terminal and part of said cathode terminal.

19. The method for forming capacitor as recited in claim 12 , wherein:

said anode body and said anode lead wire are made of tantalum; and

said anode terminal is formed of a copper plate plated with at least one of nickel and tin.

20. The method for forming capacitor as recited in claim 12 , wherein said second resin is made of silicone or fluoroplastic.

21. The method for forming capacitor as recited in claim 12 , wherein said capacitor element further includes a solid electrolyte layer made of conductive polymer.

22. A method for forming a capacitor comprising:

providing an anode with a dielectric thereon and an anode lead wire extending therefrom;

providing an anode terminal comprising a first portion, a second portion and a coupling portion coupling said first portion and said second portion, said first portion being provided with a predetermined section, all surfaces of the predetermined section consisting of a front surface, a back surface and edges connecting between said front surface and said back surface, said front surface including a connection area with said anode lead wire being connected at said connection area while being not connected to said anode terminal other than at said connection area;

attaching said anode lead wire to said first portion at a connection area;

encasing all surfaces of said predetermined section except for said connection area with a mask layer comprising a second resin; and

encasing said capacitor with a first resin wherein said first resin and said second resin differ by at least one of composition, contents of inclusions, sizes of inclusions and shapes of inclusions.

Assignments (6)
CHANGE OF ADDRESS Recorded Jun 6, 2024
From: TOKIN CORPORATION
To: TOKIN CORPORATION
Reel/Frame 067643/0209 →
RELEASE OF SECURITY INTEREST Recorded Nov 8, 2018
From: BANK OF AMERICA, N.A.
To: KEMET CORPORATION,; KEMET ELECTRONICS CORPORATION; KEMET BLUE POWDER CORPORATION
Reel/Frame 047450/0926 →
CHANGE OF NAME Recorded Jun 21, 2017
From: NEC TOKIN CORPORATION
To: TOKIN CORPORATION
Reel/Frame 042957/0255 →
SECURITY AGREEMENT Recorded May 22, 2017
From: KEMET CORPORATION; KEMET ELECTRONICS CORPORATION; KEMET BLUE POWDER CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 042523/0639 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2014
From: YOSHIDA, YUJI; UEDA, HAYATO; TAKADA, DAISUKE; IWAI, SATOSHI; MIZUKOSHI, TAKASHI
To: NEC TOKIN CORPORATION
Reel/Frame 032082/0097 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2014
From: LIU, YANMING
To: KEMET ELECTRONICS CORPORATION
Reel/Frame 032136/0030 →