Configurable analog front ends for circuits with substantially gate enclosed inner electrode MOSFET switch

1. A configurable integrated circuit (IC), comprising:

a substrate having a semiconductor surface that said IC is formed within and thereon, said IC including:

a configurable Analog Front End (cAFE) including at least one circuit module or input/output (IO);

an analog switch having at least a first Substantially Gate Enclosed Metal Oxide Semiconductor Field Effect Transistor (SGEFET) having a gate stack including a gate on a gate dielectric, a source, and a drain,

wherein said drain or said source is a Substantially Gate Enclosed (SGE) inner electrode relative to said gate stack and another of said source and said drain is outside said gate stack, and

an analog bus,

wherein said inner electrode of said first SGEFET is directly coupled to said analog bus, and

a switch control that provides control signals to at least said gate of said first SGEFET for controlling a connectivity between said circuit module or said IO and said analog bus.

2. The configurable IC of claim 1 , wherein said first SGEFET is a Ring-FET.

3. The configurable IC of claim 1 , wherein said analog switch consists of a single transistor.

4. The configurable IC of claim 1 , wherein said analog switch further comprises a second SGEFET configured with said first SGEFET to provide a first transmission gate (TG).

5. The configurable IC of claim 4 , wherein said analog switch further comprises a third SGEFET and a fourth SGEFET configured together to provide a second TG, said first TG and said second TG in a cascaded TG arrangement having an intermediate node between said first TG and said second TG.

6. The configurable IC of claim 5 , wherein said switch control is coupled to both said gate and a body of said first SGEFET and a gate and a body of said second SGEFET in said first TG, to a gate and a body of said third SGEFET and to a gate and a body of said fourth SGEFET in said second TG.

7. The configurable IC of claim 5 , further comprising a buffer having an input coupled to a node including said inner electrode of said first SGEFET in said first TG through said analog bus and an output coupled to said switch control.

8. The configurable IC of claim 5 , wherein said analog switch comprises a cascaded multiplexer circuit.

9. The configurable IC of claim 1 , wherein said circuit module consists of at least one selected from the group consisting of an operational amplifier, an instrumentation amplifier, a transconductance amplifier, a power amplifier (PA), an analog-to-digital converter (ADC), a digital-to-analog converter (DAC), an integrator, a filter, a mixer, a comparator, a modulator, and an oscillator.

10. The configurable IC of claim 1 , wherein said configurable IC comprises a microcontroller unit (MCU), said MCU including:

said switch control, a program memory, digital I/O interface, and a central processing unit (CPU) each coupled to an address bus and to a data bus,

wherein said analog switch comprises at least one switch matrix including said first SGEFET and at least a second SGEFET,

wherein said at least one circuit module or input/output (IO) comprises a plurality of said circuit modules, and

wherein said switch control is coupled to said analog bus by said switch matrix.

11. The configurable IC of claim 10 , wherein said switch matrix consists of a single switch matrix.

12. The configurable IC of claim 10 , wherein said switch matrix includes a plurality of said switch matrices, wherein at least one of said plurality of said switch matrices is inside one of said plurality of said circuit modules or said IO's.

13. A configurable integrated circuit (IC), comprising:

a substrate having a semiconductor surface that said IC is formed within and thereon, said IC including:

a configurable Analog Front End (cAFE) including at least one circuit module or input/output (IO);

an analog switch having at least a first Ring-FET having a gate stack including a gate on a gate dielectric, a source, and a drain,

wherein said drain or said source is an enclosed inner electrode relative to said gate stack and another of said source and said drain is outside said gate stack, and

an analog bus,

wherein said inner electrode of said first Ring-FET is directly coupled to said analog bus, and

a switch control that provides control signals to at least said gate of said first Ring-FET for controlling a connectivity between said circuit module or said IO and said analog bus.

14. The configurable IC of claim 13 , wherein said analog switch further comprises a second Ring-FET configured with said first Ring-FET to provide a first transmission gate (TG).

15. The configurable IC of claim 14 , wherein said analog switch further comprises a third Ring-FET and a fourth Ring-FET configured together to provide a second TG, said first TG and said second TG in a cascaded TG arrangement having an intermediate node between said first TG and said second TG.

16. The configurable IC of claim 15 , wherein said switch control is coupled to said gate and a body of said first Ring-FET and to a gate and a body of said second Ring-FET in said first TG, and to a gate and a body of said third Ring-FET and to a gate and a body of said fourth Ring-FET in said second TG.

17. The configurable IC of claim 15 , further comprising a buffer having an input coupled to a node including said inner electrode of said first Ring-FET in said first TG through said analog bus and an output coupled to said switch control.

18. The configurable IC of claim 15 , wherein said analog switch comprises a cascaded multiplexer circuit.