Composition for an adhesive material

1. A composition for an adhesive material, comprising an epoxide resin mixture and an imidazole derivative component wherein the epoxide resin mixture comprises:

(a) 25 to 75% by weight of a first epoxide resin, wherein the first epoxide resin is a bifunctional aliphatic, cycloaliphatic or aromatic epoxide resin;

(b) 12.5 to 40% by weight of a second epoxide resin, wherein the second epoxide resin is a polyfunctional aliphatic or aromatic epoxide resin;

(c) 12.5 to 40% by weight of an epoxidized rubber, wherein the sum of (a), (b), and (c) yields 100% by weight; and

wherein the imidazole derivative component initiates homopolymerization of the epoxy resin mixture and is one or more imidazole derivatives, the imidazole derivative component is not soluble in the epoxide resin mixture at temperatures of below 50° C., and the imidazole derivative component is the only hardener present in the composition; and

wherein the composition forms a hardened adhesive material having a polyether structure and a creepage current resistance value of greater than 600 V.

2. The composition according to claim 1 , wherein the first epoxide resin is a liquid epoxide resin with an epoxide group content of 0.1 to 0.9 mol/100 g of the first epoxide resin.

3. The composition according to claim 1 , wherein the first epoxide resin is selected from the group consisting of epoxide resins of the bisphenol A type, epoxide resins of the bisphenol F type, epoxide resins based on bis-(epoxycyclohexyl)methylcarboxylate, epoxide resins based on hydrophthalic acid diglycidyl ester, and mixtures thereof.

4. The composition according to claim 1 , wherein the first epoxide resin has an epoxide group content of 0.4 to 0.7 mol/100 g of the first epoxide resin.

5. The composition according to claim 1 , wherein the second epoxide resin is an epoxide resin with an epoxide group content of 0.3 to 1.0 mol/100 g of the second epoxide resin or an epoxy functionality of 2 to 10 epoxide resin groups per molecule, or both.

6. The composition according to claim 1 , wherein the second epoxide resin is selected from the group consisting of epoxy phenol novolacs, epoxy cresol novolacs, and polyfunctional epoxide resin derivatives of aromatic amines or phenols.

7. The composition according to claim 1 , wherein the second epoxide resin is 4,4′-methylene-bis(N,N-diglycidylaniline), N,N-diglycidyl-4-glycidyloxyaniline, a polyglycidyl diaminodiphenyl ether or a polyglycidyl diaminodiphenyl sulfone.

8. The composition according to claim 1 , wherein the second epoxide resin is liquid, semi-solid or solid.

9. The composition according to claim 1 , wherein the epoxidized rubber is an epoxidized nitrile rubber.

10. The composition according to claim 9 , in which the epoxidized nitrile rubber is a liquid epoxidized nitrile rubber with at least one of the following features:

an epoxide group content of 0.1 to 0.5 mol/100 g of epoxidized nitrile rubber;

a viscosity of greater than 10,000 mPa·s;

a proportion of nitrile rubber in the epoxidized nitrile rubber of at least 5% by weight.

11. The composition according to claim 9 , wherein the epoxidized nitrile rubber is a liquid epoxidized nitrile rubber with at least one of the following features:

an epoxide group content of 0.2 to 0.4 mol/100 g of epoxidized nitrile rubber,

a viscosity of 40,000 to 600,000 mPa·s,

a proportion of nitrile rubber in the epoxidized nitrile rubber of 20 to 50% by weight.

12. The composition according to claim 1 , wherein the imidazole derivative component is present in the composition in an amount of 2 to 10% by weight, relative to the epoxide resin mixture.

13. The composition according to claim 1 , wherein the imidazole derivative component is selected from the group consisting of 2-phenyl-4,5-dihydroxymethyl imidazole, 2-phenyl-4-methyl-5-hydroxymethyl imidazole, and mixtures thereof.

14. An adhesive for electric and electronic components, comprising a composition according to claim 1 .