WIDE EMISSION ANGLE LED PACKAGE WITH REMOTE PHOSPHOR COMPONENT
An improved approach is provided for implementing LED lighting systems and lamps that address the issues identified above. A new type of LED package is disclosed that reduces manufacturing and production costs, while simultaneously allowing for improved thermal management and wide angle light distribution. A self-contained LED package is disclosed that can be mounted as an entire unit onto a lamp platform. The LED package permits the dimensional configuration of the package components to be aligned with desired emission angles. For example, overhangs between phosphor components and circuit boards in the package can be avoided, thereby ensuring that the final lighting system will provide any desired emission angles.
1 . An LED package, comprising:
a substrate having an outer substrate edge;
an array of one or more LEDs mounted on the substrate; and
a photoluminescence component comprising a photoluminescence material, wherein the photoluminescence component is remote from and encloses the array of one or more LEDs; the photoluminescence component having a surface with an outer component edge,
wherein the outer component edge is aligned with or extends beyond the outer substrate edge such that the package produces light emission angles from the photoluminescence component at greater than 180 degrees.
2 . The LED package of claim 1 , wherein the LED package is mountable as a self-contained unit onto a lamp platform.
3 . The LED package of claim 1 , wherein the array of one or more LEDs comprises at least one of a blue LED array, Red Blue LED Packaged Arrays, or chip on board (COB).
4 . The LED package of claim 1 , wherein the array of one or more LEDs is surrounded by an encapsulant.
5 . The LED package of claim 4 , wherein a solid optical medium fills an interior volume of the photoluminescence component to remove air interfaces between the array of one or more LEDs and the photoluminescence component.
6 . The LED package of claim 1 , further comprising a thermal pad configurable to thermally connect the LED package to a heat sink.
7 . The LED package of claim 1 , further comprising electrical connectors selected from the group consisting of: integrated electrical pads on a base of the package, a side of the package, on top of the package, and at least one of the electrical connectors is annular in shape.
8 . The LED package of claim 1 , wherein the array of one or more LEDs comprises a circular array and the substrate comprises a circular or annular shape wherein the diameter of the circular LED array is within 25% in size of the diameter of the substrate.
9 . The LED package of claim 1 , wherein the package produces the light emission angles from the photoluminescence component at greater than 250 degrees.
10 . The LED package of claim 1 , wherein a relatively small portion of the outer substrate extends beyond the outer component edge.
11 . A lighting system, comprising:
an LED package, wherein the LED package comprises a substrate having a outer substrate edge, an array of one or more LEDs mounted on the substrate, and a photoluminescence component comprising a photoluminescence material;
the photoluminescence component is remote from and encloses the array of one or more LEDs;
the photoluminescence component having a surface with an outer component edge;
the outer component edge is aligned with or extends beyond the outer substrate edge such that the package produces light emission angles from the photoluminescence component at greater than 180 degrees; and
a lamp body upon the LED package is mounted as a unit.
12 . The lighting system of claim 11 , wherein a thermal pad on the LED package is mounted to an upper surface of a heat sink on the lamp body.
13 . The lighting system of claim 11 , wherein the array of one or more LEDs comprises at least one of a blue LED array, Red Blue LED Packaged Arrays, or chip on board (COB).
14 . The lighting system of claim 11 , in which the array of one or more LEDs is surrounded by an encapsulant.
15 . The lighting system of claim 14 , wherein a solid optical medium fills an interior volume of the photoluminescence component to remove air interfaces between the array of one or more LEDs and the photoluminescence component.
16 . The lighting system of claim 11 , further comprising a thermal pad configurable to thermally connect the LED package to a heat sink.
17 . The lighting system of claim 11 , further comprising electrical connectors selected from the group consisting of: integrated electrical pads on a base of the package, a side of the package, on top of the package and at least one of the electrical connectors is annular in shape.
18 . The lighting system of claim 11 , wherein the array of one or more LEDs comprises a circular array and the substrate comprises a circular or annular shape wherein the diameter of the circular LED array is within 25% in size of the diameter of the substrate.
19 . The lighting system of claim 11 , wherein light emission angles are producible at greater than 250 degrees.
20 . The lighting system of claim 11 , wherein a relatively small portion of the outer substrate extends beyond the outer component edge.