Semiconductor circuit

1. An inspection device comprising:

a first electro-optical system configured to irradiate an object to be inspected with a first electron beam to cause an irradiation mark to be placed on the object to be inspected;

a second electro-optical system configured to irradiate the object to be inspected with a second electron beam;

a first detector configured to detect a secondary electron generated from the object to be inspected in response to the irradiation by the second electron beam, and output a first signal based on the irradiation mark; and

a shape calculation unit configured to calculate a three-dimensional shape of the object to be inspected based on the first signal, an irradiation direction of the first electron beam, and an irradiation direction of the second electron beam.

2. The device according to claim 1 , wherein the first electro-optical system comprises beam deflectors configured to shift the irradiation direction of the first electron beam.

3. The device according to claim 2 , further comprising:

a control unit configured to generate a control signal to the beam deflectors to shift the irradiation direction of the first electron beam.

4. The device according to claim 3 , wherein the second electro-optical system comprises beam deflectors configured to shift the irradiation direction of the second electron beam, and the control unit is further configured to generate a control signal to the beam deflectors of the second electro-optical system to shift the irradiation direction of the second electron beam.

5. The device according to claim 1 , wherein the shape calculation unit is configured to produce an image of the irradiation mark and calculate a facing direction of a first surface of the object relative to a second surface of the object based on geometrical features of the image of the irradiation mark, the irradiation direction of the first electron beam, and the irradiation direction of the second electron beam.

6. The device according to claim 5 , further comprising:

a substantially flat member which is arranged at a position where the second electron beam which is reflected on the surface of the object to be inspected is focused;

a second detector configured to detect a secondary electron generated when the reflected electron beam becomes incident on the substantially flat member and output a second signal; and

a shape information collation unit, wherein

the shape calculation unit is further configured to acquire a first lattice image by processing the second signal, calculate an amount of distortion in the first lattice image relative to a reference lattice image, and calculate the three-dimensional shape from the amount of distortion, and

the shape information collation unit is configured to collate information on the three-dimensional shape acquired based on the geometrical features of the image of the irradiation mark and the three-dimensional shape acquired based on the amount of distortion.

7. The device according to claim 6 , wherein the shape calculation unit is configured to perform fitting of the first lattice image onto a plurality of second lattice images prepared in advance and calculates an amount of distortion in the first lattice image based on the fitting results.

8. The device according to claim 6 , wherein the flat member has a first lattice pattern and is mounted on a rotatable device with other flat members having different lattice patterns.

9. An inspection device comprising:

a first electro-optical system configured to irradiate an object to be inspected with a first electron beam;

a substantially flat member which is arranged at a position where the first electron beam which is reflected on a surface of the object to be inspected is focused;

a detector configured to detect a secondary electron generated when the reflected first electron beam becomes incident on the substantially flat member and output a first signal; and

a shape calculation unit configured to acquire a first lattice image by processing the first signal, calculate an amount of distortion in the first lattice image relative to a reference lattice image, and calculate a three-dimensional shape of the object to be inspected from the amount of distortion.

10. The device according to claim 9 , wherein the shape calculation unit is configured to perform fitting of the first lattice image to a plurality of second lattice images prepared in advance, and calculate an amount of distortion in the first lattice image based on the fitting results.

11. The device according to claim 10 , wherein the second lattice images are prepared in advance through simulation.

12. The device according to claim 9 , wherein the flat member has a first lattice pattern and is mounted on a rotatable device with other flat members having different lattice patterns.

13. An inspection method comprising:

marking an object to be inspected by irradiating the object with a first electron beam;

irradiating the object to be inspected with a second electron beam;

detecting a secondary electron generated from the object to be inspected in response to the irradiation by the second electron beam, and outputting a first signal based on the irradiation mark; and

calculating a three-dimensional shape of the object to be inspected based on the first signal, an irradiation direction of the first electron beam, and an irradiation direction of the second electron beam.

14. The method according to claim 13 , further comprising:

shifting the irradiation direction of the first electron beam.

15. The device according to claim 13 , further comprising:

generating an image of the irradiation mark;

calculating a facing direction of a first surface of the object relative to a second surface of the object based on geometrical features of the image of the irradiation mark, the irradiation direction of the first electron beam, and the irradiation direction of the second electron beam.

16. The method according to claim 13 , further comprising:

processing a second signal to produce a first lattice image, the second signal being generated when the second electron beam reflects off a surface of the object to be inspected and becomes incident on a flat member having a first lattice pattern formed thereon;

calculating an amount of distortion in the first lattice image relative to a reference lattice image; and

calculating the three-dimensional shape of the object to be inspected from the amount of distortion.

17. The method according to claim 16 , further comprising:

collating information on the three-dimensional shape acquired based on the geometrical features of the image of the irradiation mark and the three-dimensional shape acquired based on the amount of distortion.

18. The method according to claim 16 , further comprising:

performing fitting of the first lattice image onto a plurality of second lattice images prepared in advance; and

calculating an amount of distortion in the first lattice image based on the fitting results.

19. The method according to claim 18 , wherein the second lattice images are prepared in advance through simulation.

20. The method according to claim 16 , wherein the flat member has a first lattice pattern and is mounted on a rotatable device with other flat members having different lattice patterns.