Solar cell contact and method of making the contact

1. A method of making a solar panel, comprising:

forming a back contact;

forming an absorber layer over the back contact;

forming a buffer layer over the absorber layer, and

forming a front contact comprising a transparent conductive material over the buffer layer, the front contact having a plurality of outer edges and a seed layer comprising a seed layer material along the outer edges.

2. The method of claim 1 , wherein the forming step includes applying the transparent conductive material and the seed layer material on the buffer layer simultaneously.

3. The method of claim 2 , wherein the back contact is formed above a substrate, and the step of forming the front contact includes heating a center portion of the substrate without directly applying heat to the outer edges of the solar panel.

4. The method of claim 2 , wherein the step of forming the front contact includes heating a center portion of the substrate to a range of about 150 degrees C. to about 200 degrees C., while the outer edges are in a temperature range from about 100 degrees C. to about 140 degrees C.

5. The method of claim 2 , wherein the step of forming the front contact includes heating a center portion of the substrate using a heating plate that is smaller in a width dimension that the solar cell substrate.

6. The method of claim 5 , wherein the back contact is formed above a substrate, and the step of forming the front contact further comprises:

heating the center portion of the substrate and the edges of the substrate after using a heating plate that is smaller in a width dimension than the substrate.

7. The method of claim 1 , wherein the back contact is formed above a substrate, and the step of forming the front contact comprises:

raising a first heating plate that is smaller in a width dimension than the substrate, while the substrate is on the first heating plate;

applying the transparent conductive material over the buffer layer while heating a center portion of the substrate;

lowering the first heating plate until a top surface of the first heating plate is flush with a top surface of a second heating plate under the edge of the substrate; and

applying additional transparent conductive material while heating the center of the substrate with the first heating plate and heating the edge of the substrate with the second heating plate simultaneously.

8. A method of making a solar panel, comprising:

forming a back contact;

forming an absorber layer over the back contact;

forming a buffer layer over the absorber layer, the buffer layer having an interior region and a plurality of outer edges around the interior region; and

forming a front contact comprising a transparent conductive material on an interior region of the buffer layer, and a seed layer comprising a seed layer material on the outer edges of the buffer layer.

9. The method of claim 8 , wherein:

the transparent conductive material and the seed layer material have the same chemical composition as each other; and

the seed layer material has a smaller grain size than the transparent conductive material.

10. The method of claim 9 , wherein the forming step includes applying the transparent conductive material and the seed layer material on the buffer layer simultaneously.

11. The method of claim 8 , wherein the transparent conductive material has a first thickness, the seed layer has a second thickness, and a ratio of the first thickness to the second thickness is in a range from 2:1 to 30:1.

12. The method of claim 11 , wherein the back contact is formed above a substrate, and the step of forming the front contact includes heating a center portion of the substrate without directly applying heat to the outer edges of the solar panel.

13. The method of claim 12 , wherein the step of forming the front contact includes heating the center portion of the substrate to a range of about 150 degrees C. to about 200 degrees C., while the outer edges are in a temperature range from about 100 degrees C. to about 140 degrees C.

14. The method of claim 12 , wherein the step of forming the front contact includes heating a center portion of the substrate using a heating plate that is smaller in a width dimension that the solar cell substrate.

15. The method of claim 8 , wherein the seed layer material has a crystal orientation of about 34.4 degrees, and the transparent conductive material has a crystal orientation of about 32 degrees.

16. A method of making a solar panel, comprising:

forming a back contact;

forming an absorber layer over the back contact;

forming a buffer layer over the absorber layer, the buffer layer having an interior region and a plurality of outer edges around the interior region; and

simultaneously forming a transparent conductive material on an interior region of the buffer layer and a seed layer comprising a seed layer material on the outer edges of the buffer layer, the seed layer material having a same chemical composition as the transparent conductive material and a smaller grain size than the transparent conductive material.

17. The method of claim 16 , wherein the back contact is formed above a substrate, and the step of forming the front contact includes heating a center portion of the substrate without directly applying heat to the outer edges of the solar panel.

18. The method of claim 17 , wherein the step of simultaneously forming includes heating a center portion of the substrate using a heating plate that is smaller in a width dimension that the solar cell substrate.

19. The method of claim 18 , wherein the back contact is formed above a substrate, and the step of simultaneously forming further comprises:

heating the center portion of the substrate and the edges of the substrate after using a heating plate that is smaller in a width dimension than the substrate.

20. The method of claim 16 , wherein the back contact is formed above a substrate, and the step of simultaneously forming comprises:

raising a first heating plate that is smaller in a width dimension than the substrate, while the substrate is on the first heating plate;

applying the transparent conductive material over the buffer layer while heating a center portion of the substrate;

lowering the first heating plate until a top surface of the first heating plate is flush with a top surface of a second heating plate under the edge of the substrate; and

applying additional transparent conductive material while heating the center of the substrate with the first heating plate and heating the edge of the substrate with the second heating plate simultaneously.