METHOD OF ALIGNING TRANSPARENT SUBSTRATES USING MOIRÉ INTERFERENCE
A method of aligning transparent substrates includes disposing one or more Moiré interference patterns on a side of a first transparent substrate, disposing one or more inverted Moiré interference patterns on a side of a second transparent substrate, and aligning the first transparent substrate to the second transparent substrate using Moiré interference. Each Moiré interference pattern is center-aligned to a corresponding inverted Moiré interference pattern.
1 . A method of aligning transparent substrates comprising:
disposing one or more Moiré interference patterns on a side of a first transparent substrate;
disposing one or more inverted Moiré interference patterns on a side of a second transparent substrate; and
aligning the first transparent substrate to the second transparent substrate using Moiré interference,
wherein each Moiré interference pattern is center-aligned to a corresponding inverted Moiré interference pattern.
2 . The method of claim 1 , further comprising:
bonding the first transparent substrate to the second transparent substrate.
3 . The method of claim 2 , wherein the first transparent substrate is bonded to the second transparent substrate by a lamination process.
4 . The method of claim 2 , wherein the first transparent substrate is bonded to the second transparent substrate by an optically clear adhesive.
5 . The method of claim 2 , wherein the first transparent substrate is bonded to the second transparent substrate by an optically clear resin.
6 . The method of claim 2 , wherein the first transparent substrate is bonded to the second transparent substrate with an air gap disposed between them.
7 . The method of claim 1 , wherein each Moiré interference pattern comprises a plurality of concentric circles and each corresponding inverted Moiré interference pattern comprises an inverse image of the Moiré interference pattern.
8 . The method of claim 1 , wherein, when a corresponding pair of a Moiré interference pattern and an inverted Moiré interference pattern overlap and are not center-aligned, the patterns interfere producing Moiré interference that visually indicates the centers of the patterns.
9 . A method of aligning conductive patterns disposed on transparent substrates comprising:
disposing a first conductive pattern and one or more Moiré interference patterns on a side of a first transparent substrate;
disposing a second conductive pattern and one or more inverted Moiré interference patterns on a side of a second transparent substrate; and
aligning the first transparent substrate to the second transparent substrate using Moiré interference,
wherein each Moiré interference pattern is center-aligned to a corresponding inverted Moiré interference pattern.
10 . The method of claim 9 , further comprising:
bonding the first transparent substrate to the second transparent substrate.
11 . The method of claim 10 , wherein the first transparent substrate is bonded to the second transparent substrate by a lamination process.
12 . The method of claim 10 , wherein the first transparent substrate is bonded to the second transparent substrate by an optically clear adhesive.
13 . The method of claim 10 , wherein the first transparent substrate is bonded to the second transparent substrate by an optically clear resin.
14 . The method of claim 10 , wherein the first transparent substrate is bonded to the second transparent substrate with an air gap disposed between them.
15 . The method of claim 9 , wherein each Moiré interference pattern comprises a plurality of concentric circles and each corresponding inverted Moiré interference pattern comprises an inverse image of the Moiré interference pattern.
16 . The method of claim 9 , wherein, when a corresponding pair of a Moiré interference pattern and an inverted Moiré interference pattern overlap and are not center-aligned, the patterns interfere producing Moiré interference that visually indicates the centers of the patterns.
17 . The method of claim 9 , wherein the plurality of Moiré interference patterns are disposed on the first transparent substrate and the plurality of inverted Moiré interference patterns are disposed on the second transparent substrate such that the first conductive pattern is aligned to the second conductive pattern at a predetermined alignment.
18 . The method of claim 9 , wherein the plurality of Moiré interference patterns are disposed on the first transparent substrate and the plurality of inverted Moiré interference patterns are disposed on the second transparent substrate such that the first conductive pattern is aligned to the second conductive pattern at a predetermined alignment that includes a predetermined offset.
19 . The method of claim 9 , wherein the first transparent substrate is aligned to the second transparent substrate such that the first conductive pattern is aligned to the second conductive pattern at a predetermined alignment.
20 . The method of claim 9 , wherein the first transparent substrate is aligned to the second transparent substrate such that the first conductive pattern is aligned to the second conductive pattern at a predetermined alignment that includes a predetermined offset.