Optical modules including focal length adjustment and fabrication of the optical modules
View Patent ↗Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.
1. A method of fabricating optical devices, the method comprising:
providing first spacers on a first side of a wafer composed of a material that is substantially transparent to light of a predetermined wavelength or range of wavelengths;
providing second spacers on a second side of the wafer, the first and second sides being opposite sides of the wafer;
attaching a plurality of singulated lens systems to the first spacers, wherein the singulated lens systems are physically unattached from one another at least at a time just prior to attaching the singulated lens systems to the first spacers;
adjusting a height of at least part of the second spacers to provide for FFL correction for one or more optical channels;
subsequently attaching the second spacers to respective image sensors, wherein each of the image sensors includes a light detecting element such that the light detecting element is laterally encircled entirely by a respective one of the second spacers after the second spacers are attached to the image sensors, wherein a plane parallel to the wafer intersects both the light detecting element and the second spacers:
separating the wafer so as to form single channel modules each of which includes a singulated lens system disposed over an image sensor.
2. The method of claim 1 further including measuring the FFL of the lens systems.
3. The method of claim 2 further including adjusting a height of at least some of the second spacers, based on results of the measuring, to provide for FFL correction for one or more optical channels.
4. The method of claim 3 wherein adjusting a height includes micromachining.
5. The method of claim 1 including forming the first spacers and the second spacers by vacuum injection.
6. The method of claim 1 wherein the singulated lens systems are injection molded lens stacks.
7. The method of claim 1 wherein the wafer is composed of a glass or polymer material.
8. The method of claim 1 wherein the first and second spacers are composed of a material that is substantially non-transparent to light of the predetermined wavelength or range of wavelengths.
9. The method of claim 1 wherein each of the lens systems includes a plurality of lenses stacked one over the other.
10. The method of claim 1 wherein each of the lens systems includes a plurality of lens arrays stacked one over the other.
11. A method of fabricating optical devices, the method comprising:
providing a first spacer wafer on a first side of a transparent wafer composed of a material that is substantially transparent to light of a predetermined wavelength or range of wavelengths;
providing a second spacer wafer on a second side of the transparent wafer, the first and second sides being opposite sides of the transparent wafer;
attaching a plurality of singulated lens systems to the first spacer wafer, the singulated lens systems being laterally spaced from one another, and the singulated lens systems being physically unattached from one another at least at a time just prior to attaching the singulated lens systems to the first spacer wafer;
adjusting a height of at least part of the second spacer wafer to provide for FFL correction for one or more optical channels;
subsequently attaching the second spacer wafer to image sensors laterally spaced from one another, wherein each of the image sensors includes a light detecting element such that the light detecting element is laterally encircled entirely by the second spacer wafer after the second spacer wafer is attached to the image sensors, wherein a plane parallel to the transparent wafer intersects both the light detecting elements and the second spacer wafer; and
separating the wafers so as to form single channel modules each of which includes a singulated lens system disposed over an image sensor.
12. The method of claim 11 further including measuring the FFL of the lens systems.
13. The method of claim 12 further including adjusting a height of at least part of the second spacer wafer, based on results of the measuring, to provide for FFL correction for one or more optical channels.
14. The method of claim 13 wherein adjusting a height includes micromachining.
15. The method of claim 11 wherein the singulated lens systems are injection molded lens stacks.
16. The method of claim 11 wherein the transparent wafer is composed of a glass or polymer material.
17. The method of claim 11 wherein the first and second spacer wafers are composed of a material that is substantially non-transparent to light of the predetermined wavelength or range of wavelengths.
18. The method of claim 11 wherein each of the lens systems includes a plurality of lenses stacked one over the other.
19. The method of claim 11 wherein each of the lens systems includes a plurality of lens arrays stacked one over the other.