SUBSTRATE PROCESSING APPARATUS
A substrate processing apparatus includes a phosphoric acid supply device for supplying phosphoric acid aqueous solution onto the upper surface of a substrate held on a spin chuck, a heater for emitting heat toward a portion of the upper surface of the substrate with the phosphoric acid aqueous solution being held on the substrate, a heater moving device for moving the heater to move a position heated by the heater within the upper surface of the substrate, a water nozzle for discharging water therethrough toward a portion of the upper surface of the substrate with the phosphoric acid aqueous solution being held on the substrate and a water nozzle moving device for moving the water nozzle to move the water landing position within the upper surface of the substrate.
1 . A substrate processing apparatus comprising:
a substrate holding device for holding a substrate horizontally;
a phosphoric acid supply device for supplying phosphoric acid aqueous solution onto an upper surface of the substrate held on the substrate holding device to form a liquid film of phosphoric acid aqueous solution covering an entire upper surface of the substrate;
a heater for heating the liquid film of phosphoric acid aqueous solution from an upper surface side of the substrate;
a heater moving device for moving the heater to move a position heated by the heater along the upper surface of the substrate;
a water nozzle for discharging water therethrough toward the liquid film of phosphoric acid aqueous solution to cause the water to land on the liquid film; and
a water nozzle moving device for moving the water nozzle to move a water landing position along the upper surface of the substrate.
2 . The substrate processing apparatus according to claim 1 , further comprising a water flow rate control valve for supplying water therethrough to the water nozzle at a flow rate at which the liquid film of phosphoric acid aqueous solution is maintained in a puddle shape on the substrate.
3 . The substrate processing apparatus according to claim 1 , wherein the heater moving device is arranged to move the heater such that a region adjacent to the water landing position is heated.
4 . The substrate processing apparatus according to claim 3 , wherein
the substrate holding device includes a spin motor for rotating the substrate about a vertical line passing through a central portion of the upper surface of the substrate, and wherein
the heater moving device is arranged to move the heater such that a region downstream from the water landing position in a rotation direction of the substrate is heated.
5 . The substrate processing apparatus according to claim 1 , wherein
the substrate holding device includes a spin motor for rotating the substrate about a vertical line passing through a central portion of the upper surface of the substrate,
the substrate processing apparatus further comprising a control device for controlling the substrate holding device and the water nozzle moving device to move the water landing position between the central portion of the upper surface of the substrate and a peripheral portion of the upper surface of the substrate while rotating the substrate, and wherein
the control device is arranged to, when a rotation speed of the substrate is lower than a predetermined speed, move the water landing position between the central portion of the upper surface of the substrate and the peripheral portion of the upper surface of the substrate at a constant speed, while
the control device is arranged to, when the rotation speed of the substrate is equal to or higher than the predetermined speed, reduce a moving speed of the water landing position as the water landing position comes closer to the central portion of the upper surface of the substrate or increase the moving speed of the water landing position as the water landing position moves away from the central portion of the upper surface of the substrate.