IP Library Granted Patent US 9,847,179
Granted Patent B2
US 9,847,179 · App. 14/182,400 · Granted Dec 19, 2017

Solid electrolytic capacitor and method of manufacturing a solid electrolytic capacitor

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Quick Facts
Patent No.
US 9,847,179
App. No.
14/182,400
Granted
Dec 19, 2017
Kind
B2
Abstract

Provided is a method for forming a capacitor. The method includes: providing an anode with a dielectric thereon and a conductive node in electrical contact with the anode; applying a conductive seed layer on the dielectric; forming a conductive bridge between the conductive seed layer and the conductive node; applying voltage to the anode; electrochemically polymerizing a monomer thereby forming an electrically conducting polymer of monomer on the conductive seed layer; and disrupting the conductive bridge between the conductive seed layer and the conductive node.

Claims (23)

1. A capacitor comprising:

an anode;

a dielectric on said anode;

a disrupted conductive bridge between an external electrical connection and an active cathode region wherein said active cathode region is on said dielectric and said external electrical connection is not in said active cathode region;

an electrochemical polymer on said active cathode region; and

a conductive node in electrical contact with said anode and said disrupted conductive bridge.

2. A capacitor of claim 1 wherein said active cathode region comprises a conductive seed layer.

3. A capacitor of claim 2 wherein said conductive seed layer comprises a material selected from manganese dioxide and a conductive polymer.

4. A capacitor of claim 1 wherein said conductive bridge comprises said conductive seed layer.

5. A capacitor of claim 4 wherein said conductive bridge is said conductive seed layer.

6. A capacitor of claim 1 further comprising:

an insulator on said dielectric.

7. A capacitor of claim 6 wherein said conductive bridge extends over said insulator.

8. The capacitor of claim 6 wherein said conductive bridge is disrupted over said insulator.

9. A capacitor of claim 1 wherein said conductive bridge is electrically connected to a process carrier.

10. A capacitor of claim 1 wherein said disruption of said conductive bridge comprises laser ablation.

11. A capacitor of claim 1 wherein said conductive bridge comprises a material selected from manganese dioxide and conductive polymer.

12. A capacitor of claim 1 wherein said disruption of said electrical conductivity comprises disruption of conductivity of said conductive bridge.

13. A capacitor of claim 1 wherein said anode is selected from the group consisting of a valve metal and a conductive oxide of a valve metal.

14. A capacitor of claim 13 wherein said anode is selected from the group consisting of aluminum, tantalum, niobium and NbO.

15. The capacitor of claim 1 wherein said disrupted conductive bridge is a disrupted electrical path between said anode and said conductive node.

16. The capacitor of claim 1 wherein said disrupted conductive node comprises a material that is a conductive, non-valve metal.

17. The capacitor of claim 1 wherein said conductive node comprises a material selected from a noble metal, stainless steel and carbon.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Nov 8, 2018
From: BANK OF AMERICA, N.A.
To: KEMET CORPORATION,; KEMET ELECTRONICS CORPORATION; KEMET BLUE POWDER CORPORATION
Reel/Frame 047450/0926 →
SECURITY AGREEMENT Recorded May 22, 2017
From: KEMET CORPORATION; KEMET ELECTRONICS CORPORATION; KEMET BLUE POWDER CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 042523/0639 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 18, 2014
From: POLTORAK, JEFFREY; SUMMEY, BRANDON K.; QIU, YONGJIAN
To: KEMET ELECTRONICS CORPORATION
Reel/Frame 032232/0699 →