RFID tag and micro chip integration design
An integrated micro chip, method of integrating a micro chip, and micro chip integration system are described. In an embodiment, a micro chip such as a micro RFID chip or integrated passive device (IPD) is electrostatically transferred and bonded to a conductive pattern including a line break. In an embodiment, the line break is formed by a suitable cutting technique such as laser laser ablation, ion beam etching, or photolithography with chemical etching to accommodate the micro chip.
1. An RFID tag comprising:
a substrate;
a conductive antenna pattern including an antenna feed line that connects two terminal ends of the antenna pattern, and a line break in the antenna feed line, wherein the line break has a maximum width of 100 μm or less; and
a micro RFID chip bonded to the antenna feed line on opposite sides of the line break, wherein the micro RFID chip has a maximum length and width of 100 μm or less, and the RFID chip is bonded to the antenna feed line with solder bonds.
2. The RFID tag of claim 1 , wherein the micro RFID chip has a maximum length and width of 20 μm or less.
3. The RFID tag of claim 2 , wherein the line break has a maximum width of 20 μm or less.
4. The RFID tag of claim 2 , wherein the conductive antenna pattern comprises aluminum or copper.
5. The RFID tag of claim 2 , wherein the micro RFID chip includes a logic component node below 0.180 μm.
6. The RFID tag of claim 2 , wherein an underfill encapsulation material is not located between the antenna pattern and the micro RFID chip.
7. The RFID tag of claim 2 , wherein a stand-off bond pad height separating the micro RFID chip and antenna feed is approximately 3 μm or less.
8. The RFID tag of claim 1 , wherein a stand-off bond pad height separating the micro RFID chip and antenna feed line is less than 50 μm.
9. A method of integrating a micro RFID chip comprising:
cutting an array of conductive patterns on a substrate to form an array of line breaks in the array of conductive patterns;
picking up an array of micro RFID chips from a carrier substrate with a corresponding array of electrostatic transfer heads of an electrostatic transfer head assembly, wherein each micro RFID chip has a maximum length and width of 100 μm or less; and
transferring thermal energy from the electrostatic transfer head assembly and through the array of micro RFID chips to bond the array of micro RFID chips to the array of conductive patterns on opposite sides of the corresponding line breaks with solder bonds.
10. The method of claim 9 , wherein each micro RFID chip has a maximum length and width of 20 μm or less.
11. The method of claim 10 , wherein each conductive pattern includes an antenna.
12. The method of claim 11 , wherein the antenna is selected from the group consisting of a dipole antenna and looped antenna.
13. The method of claim 9 , wherein each line break has a maximum width of 100 μm or less.
14. The method of claim 13 , wherein cutting comprises laser ablation.
15. The method of claim 9 , further comprising forming the array of conductive pattern on the substrates, wherein forming comprises a technique selected from the group consisting of lamination, screen printing, ink jet printing, and metal vapor deposition.
16. The method of claim 9 , further comprising electrostatically transferring an array of micro LED devices to the array of conductive patterns, wherein each conductive pattern includes an electrode trace line.