IP Library Patent Application 14183557
Patent Application
App. No. 14/183,557

SOLAR CELL AND METHOD OF FABRICATING SAME

Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US None
App. No.
14/183,557
Abstract

A solar cell device and a method of fabricating the device is described. The solar cell is fabricated by providing a substrate, depositing a back contact over the substrate, depositing an absorber over the back contact, depositing a front contact over the absorber, and embedding a highly thermally conductive material within the solar cell. The highly thermally conductive material can be embedded as a highly thermally conductive layer between the substrate and the back contact, a highly thermally conductive fill within a P3 scribe line, or both.

Claims (35)

1 . A solar cell comprising:

a substrate;

a highly thermally conductive layer over said substrate;

a back contact over said highly thermally conductive layer;

an absorber over said back contact; and

a front contact over said absorber.

2 . The solar cell as in claim 1 , wherein said highly thermally conductive layer is on said substrate.

3 . The solar cell as in claim 1 , wherein said highly thermally conductive layer comprises a material having a greater thermal conductivity than a material of said substrate.

4 . The solar cell as in claim 1 , wherein said highly thermally conductive layer has a thermal conductivity of about 30 W/(m·K) or greater.

5 . The solar cell as in claim 1 , wherein said highly thermally conductive layer has a thermal conductivity of about 200 W/(m·K) or greater.

6 . The solar cell as in claim 1 , wherein said highly thermally conductive layer has a resistivity of about 1.00E+11Ω·m or greater.

7 . The solar cell as in claim 1 , wherein said highly thermally conductive layer comprises a thin film.

8 . The solar cell as in claim 1 , wherein said highly thermally conductive layer comprises stacked nanoparticles.

9 . The solar cell as in claim 1 , further comprising a P3 scribe line extending through said absorber and front contact, and a highly thermally conductive fill within said P3 scribe line.

10 . A solar cell comprising:

a substrate;

a back contact over said substrate;

an absorber over said back contact;

a front contact over said absorber; and

a scribe line extending through said absorber and front contact, wherein said scribe line comprises a highly thermally conductive fill therein.

11 . The solar cell as in claim 10 , wherein said highly thermally conductive fill comprises stacked nanoparticles.

12 . The solar cell as in claim 10 , wherein said highly thermally conductive fill comprises aluminum oxide.

13 . The solar cell as in claim 10 , wherein said highly thermally conductive fill comprises aluminum nitride.

14 . A method for fabricating a solar cell, comprising:

providing a substrate;

depositing a back contact over said substrate;

depositing an absorber over said back contact;

depositing a front contact over said absorber; and

embedding a highly thermally conductive material within said solar cell.

15 . The method as in claim 14 , wherein said embedding step comprises depositing a highly thermally conductive layer between said substrate and said back contact.

16 . The method as in claim 15 , wherein said highly thermally conductive layer is deposited by physical vapor deposition.

17 . The method as in claim 15 , wherein said highly thermally conductive layer is deposited by atomic layer deposition.

18 . The method as in claim 14 , further comprising scribing a P3 line extending through said absorber and front contact; and wherein said embedding step comprises depositing a highly thermally conductive fill within said P3 scribe line.

19 . The method as in claim 18 , wherein said highly thermally conductive fill is deposited by spraying nanoparticles of said highly thermally conductive material.

20 . The method as in claim 18 , wherein said embedding step further comprises depositing a highly thermally conductive layer between said substrate and said back contact.

Assignments (2)
MERGER Recorded Jun 16, 2016
From: TSMC SOLAR LTD.
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 039050/0299 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 19, 2014
From: CHEN, SHIH-WEI
To: TSMC SOLAR LTD.
Reel/Frame 032240/0853 →