METHOD OF PASSIVATING A CONDUCTIVE PATTERN WITH SELF-ASSEMBLING MONOLAYERS
A method includes disposing a conductive pattern on a substrate. Self-assembling monolayers are applied to exposed portions of the conductive pattern. The self-assembling monolayers self-organize and bond to the exposed portions of the conductive pattern. The substrate is cleaned.
1 . A method comprising:
disposing a conductive pattern on a substrate;
applying self-assembling monolayers to exposed portions of the conductive pattern, wherein the self-assembling monolayers self-organize and bond to the exposed portions of the conductive pattern; and
cleaning the substrate.
2 . The method of claim 1 , wherein applying self-assembling monolayers comprises spray coating a solution of self-assembling monolayers on the exposed portions of the conductive pattern.
3 . The method of claim 1 , wherein applying self-assembling monolayers comprises dip coating a solution of self-assembling monolayers on the exposed portions of the conductive pattern.
4 . The method of claim 1 , wherein applying self-assembling monolayers comprises roller coating a solution of self-assembling monolayers on the exposed portions of the conductive pattern.
5 . The method of claim 1 , wherein applying self-assembling monolayers comprises aerosol fogging the self-assembling monolayers on the exposed portions of the conductive pattern.
6 . The method of claim 1 , wherein the self-assembling monolayers comprise fluoro-based self-assembling monolayers.
7 . The method of claim 1 , wherein the self-assembling monolayers comprise hydrocarbon-based self-assembling monolayers.
8 . The method of claim 1 , wherein the self-assembling monolayers comprise Aculon® 620 solution.
9 . The method of claim 1 , wherein cleaning the substrate comprises rinsing the substrate with deionized water.
10 . The method of claim 1 , wherein the self-assembling monolayers comprise Aculon® 621 solution.
11 . The method of claim 1 , wherein cleaning the substrate comprises rinsing the substrate with isopropyl alcohol.
12 . The method of claim 1 , wherein the conductive pattern comprises a plurality of parallel conductive lines oriented in a first direction and a plurality of parallel conductive lines oriented in a second direction.
13 . The method of claim 1 , wherein the substrate is transparent.
14 . The method of claim 13 , wherein the transparent substrate comprises polyethylene terephthalate.
15 . The method of claim 1 , wherein the self-assembling monolayers do not self-organize or bond to exposed portions of the substrate.
16 . The method of claim 1 , wherein the conductive pattern comprises copper.
17 . The method of claim 1 , wherein the conductive pattern comprises a copper alloy.
18 . The method of claim 1 , wherein the self-assembling monolayers are applied at ambient temperature.
19 . The method of claim 1 , wherein the self-assembling monolayers are applied at ambient humidity.
20 . The method of claim 1 , wherein the self-assembling monolayers are applied at ambient pressure.
21 . The method of claim 1 , wherein the self-assembling monolayers self-organized and bonded to the exposed portions of the conductive pattern form a self-assembled monolayers passivation layer that has a thickness of approximately one molecule.