Foil composite card
Composite cards formed in accordance with the invention include a security layer comprising a hologram or diffraction grating formed at, or in, the center, or core layer, of the card. The hologram may be formed by embossing a designated area of the core layer with a diffraction pattern and depositing a thin layer of metal on the embossed layer. Additional layers may be selectively and symmetrically attached to the top and bottom surfaces of the core layer. A laser may be used to remove selected portions of the metal formed on the embossed layer, at selected stages of forming the card, to impart a selected pattern or information to the holographic region. The cards may be ‘lasered’ when the cards being processed are attached to, and part of, a large sheet of material, whereby the “lasering” of all the cards on the sheet can be done at the same time and relatively inexpensively. Alternatively, each card may be individually “lasered” to produce desired alpha numeric information, bar codes information or a graphic image, after the sheets are die-cut into cards.
1. A multilayered composite card comprising:
a base plastic layer having top and bottom surfaces;
an embossed metallic layer having an embossed pattern formed on the top surface of said base plastic layer;
first and second clear primer layers;
said first clear primer layer attached to the embossed metallic layer and the second clear primer layer attached to the bottom surface of the base plastic layer;
wherein a central core region of said multilayered composite card is defined by said first clear primer layer, said embossed metallic layer, said base plastic layer, and said second clear primer layer;
first and second buffer layers;
said first buffer layer attached to said first clear primer layer and said second buffer layer disposed between said second clear primer layer and a carrier layer; and
said carrier layer comprising an integrated circuit (IC) containing electronic circuitry connected to an antenna configured to enable contactless radio frequency (RF) communication,
wherein said embossed metallic layer acts as a radio frequency shield that reduces wireless receptivity of the antenna from a side of the antenna facing the embossed metallic layer and includes at least one window formed within the embossed pattern.
2. The multilayered composite card as claimed in claim 1 wherein said at least one window formed in the embossed metallic layer is formed by lasering the metallic layer.
3. The multilayered composite card as claimed in claim 1 , wherein said carrier layer is a plastic layer;
further including first and second additional plastic layers, the first additional plastic layer attached to the first buffer layer and the second additional plastic layer attached to the carrier layer, and
graphic material printed on selected ones of said carrier layer, said base plastic layer or said first or second additional plastic layers.
4. The multilayered composite card as claimed in claim 1 , further including an electrical contact assembly on one side of the multilayered composite card in electrical communication with the IC and operative to enable the IC to be accessed by direct contact via said contact assembly.
5. The multilayered composite card as claimed in claim 1 , wherein said embossed metallic layer has one or more patterns.
6. The multilayered composite card as claimed in claim 1 , wherein said embossed metallic layer is disposed on said base plastic layer, a first buffer plastic layer is disposed above said embossed metallic layer, and a second buffer plastic layer is formed below said base plastic layer, and wherein said carrier layer comprises a plastic layer attached to the second buffer plastic layer formed below the base plastic layer.
7. The multilayered composite card of claim 1 , further comprising a plastic layer having information selectively written thereon, and the at least one window is formed within the embossed pattern to enable visibility of the selected information.
8. The multilayered composite card of claim 1 further comprising a first clear plastic layer having information selectively written thereon, and which is attached to the first buffer layer; and
a second clear plastic layer having information selectively written thereon, and which is attached to the second buffer layer,
wherein the at least one window is formed within the embossed pattern to enable visibility of the information.
9. A card comprising:
a core subassembly;
a plurality of additional layers stacked with, and attached to, said core subassembly;
an integrated circuit (IC) containing selected electronic circuits mounted on, or within, one of said plurality of additional layers;
an antenna located on, or within, one of said plurality of additional layers, said antenna connected to said IC and configured to enable contactless radio frequency communication with an external device; and
wherein the core subassembly comprises an embossed metallic layer having an embossed pattern formed on a top surface of a base plastic layer, wherein said embossed metallic layer includes at least one window formed within the embossed pattern, and acts as a radio frequency shield that reduces wireless receptivity of the antenna from a side of the antenna facing the embossed metallic layer.
10. The card as claimed in claim 9 , wherein the at least one window is a laser-formed window.
11. A multilayered composite card comprising:
a base plastic layer having top and bottom surfaces;
an embossed metallic layer with a predetermined embossed pattern formed within the top surface of said base plastic layer;
first and second clear primer layers, said first clear primer layer attached to the embossed metallic layer and the second clear primer layer attached to the bottom surface of the base plastic layer, wherein a central core region of said multilayered composite card is defined by said first clear primer layer, said embossed metallic layer, said base plastic layer, and said second clear primer layer;
a first set of additional protective and buffer layers and a second set of additional protective and buffer layers; said first set attached to the first clear primer layer and the second set attached to the second clear primer layer; and
a carrier layer mounted within said second set, said carrier layer including an integrated circuit (IC) containing electronic circuitry connected to an antenna configured to enable contactless radio frequency (RF) communication,
wherein said embossed metallic layer acts as a radio frequency shield that reduces wireless receptivity of the antenna from a side of the antenna facing the embossed metallic layer and includes at least one window formed within the embossed pattern.