MODULAR SYNTHETIC JET EJECTOR AND SYSTEMS INCORPORATING THE SAME
A synthetic jet ejector ( 501 ) is provided which includes a diaphragm ( 503 ) and a chassis ( 505 ). The chassis has first and second major surfaces which are equipped with a set of interlocking features ( 509 ) such that a first instance of the synthetic jet ejector releasably attaches to a second instance of the synthetic jet ejector by way of the interlocking features.
1 . A device, comprising:
a plurality of heat sources arranged in a channel, wherein each heat source has a top; and
a synthetic jet ejector disposed in said channel;
wherein said synthetic jet ejector directs a synthetic jet across the tops of said heat sources.
2 . The device of claim 1 , wherein each heat source is a semiconductor chip.
3 . The device of claim 2 , wherein said channel has first and second major opposing surfaces, wherein said plurality of semiconductor chips are disposed on said first surface, and wherein the tops of said semiconductor chips are spaced apart from said second major surface.
4 . The device of claim 3 , wherein said channel is essentially rectangular in cross-section.
5 . The device of claim 3 , wherein said device is a computer comprising a motherboard, and wherein said second major surface is a major surface of said motherboard.
6 . The device of claim 5 , wherein said heat sources are selected from the group consisting of processing cores and memory units.
7 . The device of claim 5 , wherein said computer is a laptop computer.
8 . The device of claim 5 , wherein the tops of said semiconductor chips are spaced apart from said second major surface by a distance within the range of 0.75 mm and 1.25 mm.
9 . The device of claim 5 , wherein the tops of said semiconductor chips are spaced apart from said second major surface by a distance within the range of 0.85 mm and 1.15 mm.
10 . The device of claim 5 , wherein the tops of said semiconductor chips are spaced apart from said second major surface by a distance of about 1 mm.
11 . The device of claim 5 , wherein said first and second major surfaces are spaced apart by a distance within the range of about 3 mm to about 9 mm.
12 . The device of claim 5 , wherein said first and second major surfaces are spaced apart by a distance within the range of about 5 mm to about 7 mm.
13 . The device of claim 5 , wherein said first and second major surfaces are spaced apart by a distance of about 6 mm.
14 . The device of claim 5 , wherein said channel has a width of about 25 mm to about 50 mm.
15 . The device of claim 5 , wherein said channel has a width of about 30 mm to about 40 mm.
16 . The device of claim 5 , wherein said channel has a width of about 35 mm.
17 . A computer, comprising:
a plurality of heat sources;
a heat sink spaced apart from said heat sources;
a plurality of thermal conductors, each of which is in thermal contact with said heat sink and one of said heat sources; and
a synthetic jet ejector which directs a synthetic jet onto or across a surface of said heat sink.
18 . The computer of claim 17 , wherein at least one of said plurality of thermal conductors comprises graphene.
19 . The computer of claim 17 , wherein said heat sink includes a plurality of heat fins, and wherein said synthetic jet ejector directs each of a plurality of synthetic jets along the longitudinal axis of a channel formed by a pair of adjacent heat fins.
20 . The computer of claim 17 , wherein said synthetic jet ejector also serves as an acoustical speaker for the computer.
21 . The computer of claim 17 , wherein said computer is a handheld computer.
22 . A synthetic jet ejector, comprising:
a diaphragm; and
a chassis having first and second major surfaces which are equipped with a first set of interlocking features such that a first instance of the synthetic jet ejector releasably attaches to a second instance of the synthetic jet ejector by way of said first set of interlocking features.
23 . The synthetic jet ejector of claim 22 , wherein said diaphragm is attached to said chassis by way of a surround.
24 . The synthetic jet ejector of claim 22 , wherein said chassis has a sidewall, and further comprising first and second electrical terminals disposed along said sidewall.
25 . The synthetic jet ejector of claim 24 , wherein said first and second terminals power said synthetic jet ejector when they are attached to an external power source.
26 . The synthetic jet ejector of claim 24 , wherein said sidewall is equipped with a second set of interlocking features such that a first instance of the synthetic jet ejector releasably attaches to a second instance of the synthetic jet ejector by way of said second set of interlocking features interlocking features.
27 . The synthetic jet ejector of claim 26 , wherein said first set of interlocking features is selected from the group consisting of protrusions and indentations.
28 . The synthetic jet ejector of claim 27 , wherein said second set of interlocking features is selected from the group consisting of protrusions and indentations.
29 . The synthetic jet ejector of claim 22 , wherein said chassis has a sidewall, wherein said sidewall has a first set of nozzle features defined in a first edge thereof, and wherein said sidewall has a second set of nozzle features defined in a second edge thereof.
30 . The synthetic jet ejector of claim 29 wherein, when a first instance of the synthetic jet ejector releasably attaches to a second instance of the synthetic jet ejector by way of said first set of interlocking features, the first and second sets of nozzle features define a set of nozzles in the resulting construct.