IP Library Granted Patent US 9,338,332
Granted Patent B2
US 9,338,332 · App. 14/188,521 · Granted May 10, 2016

Thin form factor computational array cameras and modular array cameras

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,338,332
App. No.
14/188,521
Granted
May 10, 2016
Kind
B2
Abstract

Systems and methods in accordance with embodiments of the invention implement one-dimensional array cameras, as well as modular array cameras using sub-array modules. In one embodiment, a 1×N array camera module includes: a 1×N arrangement of focal planes, where N is greater than or equal to 2, each focal plane includes a plurality of rows of pixels that also form a plurality of columns of pixels, and each focal plane not including pixels from another focal plane; and a 1×N arrangement of lens stacks, the arrangement of lens stacks being disposed relative to the arrangement of focal planes so as to form a 1×N arrangement of cameras, each configured to independently capture an image of a scene, where each lens stack has a field of view that is shifted with respect to that of each other lens stack so that each shift includes a sub-pixel shifted view of the scene.

Claims (55)

1. A 1×N array camera module comprising:

a plurality of 1×X sub-array modules, each comprising:

a 1×X arrangement of focal planes, wherein:

X is greater than or equal to 1;

each focal plane comprises a plurality of rows of pixels that also form a plurality of columns of pixels;

each focal plane does not include pixels from another focal plane; and

the 1×X arrangement of focal planes is embodied within an integrated circuit that does not include any focal planes of another 1×X sub-array module; and

a 1×X arrangement of lens stacks, the 1×X arrangement of lens stacks being disposed relative to the 1×X arrangement of focal planes so as to form a 1×X arrangement of cameras, each of which being configured to independently capture an image of a scene, wherein each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene;

image data output circuitry that is configured to output image data from the 1×X sub-array module that is capable of being aggregated with image data from other 1×X sub-array modules to construct an image of the scene; and

interface circuitry configured to couple, either directly or indirectly, with one of: another 1×X sub-array module or a processor that is in electrical communication with at least one other 1×X sub-array module;

wherein the interface circuitry is configured to transmit output image data to a directly or indirectly coupled 1×X sub-array module or a directly or indirectly coupled processor that is in electrical communication with at least one other 1×X sub-array module;

wherein the plurality of 1×X sub-array modules are positioned in a one-dimensional arrangement so as to form a 1×N arrangement of cameras; and wherein N is greater than or equal to 2.

2. The array camera module of claim 1 wherein N is greater than or equal to 3.

3. The array camera module of claim 2 , wherein N is 5.

4. The array camera module of claim 3 , wherein the 1×N arrangement of cameras includes a green camera that is configured to image light corresponding with the green band of the visible spectrum.

5. The array camera module of claim 4 , wherein the green camera is centrally disposed relative to the 1×N arrangement of cameras.

6. The array camera of claim 5 , wherein the lens stack of the green camera is configured to focus light corresponding with the green band of the visible spectrum onto the corresponding focal plane.

7. The array camera of claim 5 , wherein a red camera that is configured to image light corresponding with the red band of the visible spectrum and a blue camera that is configured to image light corresponding with the blue band of the visible spectrum are each disposed on either side of the centrally disposed green camera.

8. The array camera module of claim 2 , wherein N is 7.

9. The array camera module of claim 8 , wherein the 1×N arrangement of cameras includes a green camera that is configured to image light corresponding with the green band of the visible spectrum, and that is centrally disposed relative to the 1×N arrangement of cameras.

10. The array camera module of claim 9 , wherein a red camera that is configured to image light corresponding with the red band of the visible spectrum and a blue camera that is configured to image light corresponding with the blue band of the visible spectrum are each disposed on either side of the centrally disposed green camera.

11. The array camera module of claim 2 , wherein N is 9.

12. The array camera module of claim 11 , wherein the 1×N arrangement of cameras includes a green camera that is configured to image light corresponding with the green band of the visible spectrum, and that is centrally disposed relative to the 1×N arrangement of cameras.

13. The array camera module of claim 12 , wherein a red camera that is configured to image light corresponding with the red band of the visible spectrum and a blue camera that is configured to image light corresponding with the blue band of the visible spectrum are each disposed on either side of the centrally disposed green camera.

14. The array camera module of claim 1 , wherein the 1×N arrangement of lens stacks is embodied within a monolithic structure.

15. The array camera module of claim 1 , wherein N is 9, and X is 3 for at least one sub-array module.

16. The array camera module of claim 15 , wherein N is 9 and X is 3 for each of the plurality of sub-array modules.

17. The array camera module of claim 1 ,

wherein each of at least two sub-array modules are adjoined to the interconnects of a single substrate, and are thereby in electrical communication with each other.

18. The array camera module of claim 17 , wherein the substrate is optically transparent.

19. The array camera module of claim 18 , wherein the substrate is glass.

20. A 1×X sub-array module comprising:

a 1×X arrangement of focal planes, wherein:

X is greater than or equal to 1;

each focal plane comprises a plurality of rows of pixels that also form a plurality of columns of pixels;

each focal plane does not include pixels from another focal plane; and

the 1×X arrangement of focal planes is embodied within an integrated circuit that does not include any focal planes of another 1×X sub-array module;

a 1×X arrangement of lens stacks, the 1×X arrangement of lens stacks being disposed relative to the 1×X arrangement of focal planes so as to form a 1×X arrangement of cameras, each of which being configured to independently capture an image of a scene, wherein each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene;

image data output circuitry that is configured to output image data from the 1×X sub-array module that is capable of being aggregated with image data from another 1×X sub-array module to construct an image of the scene; and

interface circuitry configured to couple, either directly or indirectly, with one of: another 1×X sub-array module or a processor that is in electrical communication with at least one other 1×X sub-array module;

wherein the interface circuitry is configured to transmit output image data to a directly or indirectly coupled processor that is in electrical communication with at least one other 1×X sub-array module.

21. The sub-array module of claim 20 , wherein the interface circuitry implements a MIPI CSI 2 interface.

22. A 1×N array camera comprising:

a plurality of 1×X sub-array modules, each comprising:

a 1×X arrangement of focal planes, wherein:

X is greater than or equal to 1;

each focal plane comprises a plurality of rows of pixels that also form a plurality of columns of pixels;

each focal plane does not include pixels from another focal plane; and

the 1×X arrangement of focal planes is embodied within an integrated circuit that does not include any focal planes of another 1×X sub-array module; and

a 1×X arrangement of lens stacks, the 1×X arrangement of lens stacks being disposed relative to the 1×X arrangement of focal planes so as to form a 1×X arrangement of cameras, each of which being configured to independently capture an image of a scene, where each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene;

image data output circuitry that is configured to output image data from the 1×X sub-array module that is capable of being aggregated with image data from other 1×X sub-array modules to construct an image of the scene; and

interface circuitry configured to couple, either directly or indirectly, with one of: another 1×X sub-array module or a processor that is in electrical communication with at least one other 1×X sub-array module;

wherein the interface circuitry is configured to transmit output image data to a directly or indirectly coupled 1×X sub-array module or a directly or indirectly coupled processor that is in electrical communication with at least one other 1×X sub-array module;

wherein the plurality of 1×X sub-array modules are positioned in a one-dimensional arrangement so as to form a 1×N arrangement of cameras; wherein N is greater than or equal to 2; and

a processor that is configured to construct an image of the scene using image data generated by the 1×N arrangement of cameras.

Assignments (13)
SECURITY INTEREST Recorded May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR ADVANCED TECHNOLOGIES INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.; ADEIA SEMICONDUCTOR INC.; ADEIA SEMICONDUCTOR SOLUTIONS LLC; ADEIA SEMICONDUCTOR TECHNOLOGIES LLC; ADEIA SOLUTIONS LLC
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 11, 2018
From: FOTONATION CAYMAN LIMITED
To: FOTONATION LIMITED
Reel/Frame 046539/0815 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 22, 2016
From: PELICAN IMAGING CORPORATION
To: FOTONATION CAYMAN LIMITED
Reel/Frame 040675/0025 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 22, 2016
From: KIP PELI P1 LP
To: PELICAN IMAGING CORPORATION
Reel/Frame 040674/0677 →
CHANGE OF NAME Recorded Oct 19, 2016
From: DBD CREDIT FUNDING LLC
To: DRAWBRIDGE SPECIAL OPPORTUNITIES FUND LP
Reel/Frame 040494/0930 →
CHANGE OF NAME Recorded Oct 19, 2016
From: DBD CREDIT FUNDING LLC
To: DRAWBRIDGE SPECIAL OPPORTUNITIES FUND LP
Reel/Frame 040423/0725 →
SECURITY INTEREST Recorded Jun 13, 2016
From: DBD CREDIT FUNDING LLC
To: DRAWBRIDGE OPPORTUNITIES FUND LP
Reel/Frame 039117/0345 →
SECURITY INTEREST Recorded Jun 13, 2016
From: DBD CREDIT FUNDING LLC
To: DRAWBRIDGE OPPORTUNITIES FUND LP
Reel/Frame 038982/0151 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR AND ASSIGNEE PREVIOUSLY RECORDED AT REEL: 037565 FRAME: 0439. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jan 25, 2016
From: KIP PELI P1 LP
To: DBD CREDIT FUNDING LLC
Reel/Frame 037591/0377 →
SECURITY INTEREST Recorded Jan 22, 2016
From: PELICAN IMAGING CORPORATION
To: KIP PELI P1 LP
Reel/Frame 037565/0439 →
SECURITY INTEREST Recorded Jan 22, 2016
From: PELICAN IMAGING CORPORATION
To: DBD CREDIT FUNDING LLC
Reel/Frame 037565/0417 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 22, 2016
From: PELICAN IMAGING CORPORATION
To: KIP PELI P1 LP
Reel/Frame 037565/0385 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 5, 2015
From: VENKATARAMAN, KARTIK; GALLAGHER, PAUL; LELESCU, DAN; MCMAHON, ANDREW; DUPARRE, JACQUES
To: PELICAN IMAGING CORPORATION
Reel/Frame 035097/0505 →