IP Library Granted Patent US 9,253,380
Granted Patent B2
US 9,253,380 · App. 14/188,524 · Granted Feb 2, 2016

Thin form factor computational array cameras and modular array cameras

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,253,380
App. No.
14/188,524
Granted
Feb 2, 2016
Kind
B2
Abstract

Systems and methods in accordance with embodiments of the invention implement modular array cameras using sub-array modules. In one embodiment, an X×Y sub-array module includes: an X×Y arrangement of focal planes, where X and Y are each greater than or equal to 1; and an X×Y arrangement of lens stacks, the X×Y arrangement of lens stacks being disposed relative to the X×Y arrangement of focal planes so as to form an X×Y arrangement of cameras, where each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene; and image data output circuitry that is configured to output image data from the X×Y sub-array module that can be aggregated with image data from other sub-array modules so that an image of the scene can be constructed.

Claims (53)

1. An X×Y sub-array module comprising:

an X×Y arrangement of focal planes, wherein:

X and Y are each greater than or equal to 1;

each focal plane comprises a plurality of rows of pixels that also form a plurality of columns of pixels;

each focal plane does not include pixels from another focal plane; and

the X×Y arrangement of focal planes are embodied within an integrated circuit that does not include any focal planes of another X×Y sub-array module; and

an X×Y arrangement of lens stacks, the X×Y arrangement of lens stacks being disposed relative to the X×Y arrangement of focal planes so as to form an X×Y arrangement of cameras, each of which being configured to independently capture an image of a scene, wherein each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene;

image data output circuitry that is configured to output image data from the X×Y sub-array module that is capable of being aggregated with image data from other sub-array modules to construct so that an image of the scene; and

interface circuitry configured to couple, either directly or indirectly, with one of:

another X×Y sub-array module or a processor that is in electrical communication with at least one other X×Y sub-array module;

wherein the interface circuitry is configured to transmit output image data to a directly or indirectly coupled X×Y sub-array module or a directly or indirectly coupled processor that is in electrical communication with at least one other X×Y sub-array module.

2. The X×Y sub-array module of claim 1 , wherein X is 1.

3. The X×Y sub-array module of claim 1 , wherein X and Y are each greater than 1.

4. The X×Y sub-array module of claim 1 , wherein the arrangement of cameras are embodied within a single monolithic structure.

5. An M×N array camera comprising:

a plurality of X×Y sub-array modules, each comprising:

an X×Y arrangement of focal planes, wherein:

X and Y are each greater than or equal to 1;

each focal plane comprises a plurality of rows of pixels that also form a plurality of columns of pixels; and

each focal plane does not include pixels from another focal plane;

the X×Y arrangement of focal planes are embodied within an integrated circuit that does not include any focal planes of another X×Y sub-array module; and

an X×Y arrangement of lens stacks, the X×Y arrangement of lens stacks being disposed relative to the X×Y arrangement of focal planes so as to form an X×Y arrangement of cameras, each of which being configured to independently capture an image of a scene, wherein each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene;

image data output circuitry that is configured to output image data from the sub-array module that is capable of being aggregated with image data from other sub-array modules to construct an image of the scene; and

interface circuitry configured to couple, either directly or indirectly, with one of: another X×Y sub-array module or a processor that is in electrical communication with at least one other X×Y sub-array module;

wherein the interface circuitry is configured to transmit output image data to a directly or indirectly coupled X×Y sub-array module or a directly or indirectly coupled processor that is in electrical communication with at least one other X×Y sub-array module;

wherein the plurality of X×Y sub-array modules define at least some of the cameras in an M×N arrangement of cameras; and

a processor;

wherein each sub-array module is configured to transmit respective output image data to the processor via its respective distinct interface circuitry;

wherein the processor is configured to construct an image of the scene using image data generated by each of the sub-array modules.

6. The array camera of claim 5 , wherein X is 1 and M is 1.

7. The array camera of claim 5 , wherein the plurality of X×Y sub-array modules define an M×N arrangement of cameras.

8. The array camera of claim 5 , further comprising circuitry that aggregates the image data generated by each of the sub-array modules into a single MIPI output, and provides the MIPI output to the processor.

9. The array camera of claim 5 , further comprising a parallax disparity resolution module, wherein the parallax disparity resolution module is configured to receive image data captured by each sub-array module, implement a parallax detection and correction process on the received image data, and output the result for further processing.

10. The array camera of claim 9 , further comprising circuitry that converts the output of the parallax disparity resolution module into a single MIPI output, and provides the MIPI output to the processor.

11. The array camera of claim 10 , wherein the parallax disparity resolution module comprises a processor and memory, wherein the memory contains software to configure the processor to act as a parallax disparity resolution module.

12. The array camera of claim 10 , wherein the parallax disparity resolution module is a hardware parallax disparity resolution module.

13. The array camera of claim 5 , wherein M and N are each greater than or equal to 2.

14. The array camera of claim 5 , wherein at least two of the plurality of sub-array modules are adjoined to the interconnects of a single substrate, and are each capable of outputting image data through the interconnects.

15. The array camera of claim 14 , wherein each of the plurality of sub-array modules are adjoined to the interconnects of a single substrate, and are each capable of outputting image data through the interconnects.

16. The array camera of claim 15 , wherein the substrate is optically transparent.

17. The array camera of claim 16 , wherein the substrate is glass.

18. The array camera of claim 15 , wherein the substrate is ceramic with through-holes that clear the optical path.

19. The array camera of claim 5 , wherein at least one sub-array module is embodied within a single monolithic structure.

20. The array camera of claim 5 , wherein each sub-array module is embodied within a single respective monolithic structure.

21. The array camera of claim 5 , further comprising:

a plurality of I/O devices, wherein each of the plurality of I/O devices interfaces with at least one camera: and

a separate I/O block that includes circuitry configured to receive image data, aggregate the received image data, and output the aggregated image data to the processor; and

wherein each of the plurality of I/O devices interfaces with the I/O block.

22. The array camera of claim 21 , wherein the number of I/O devices equals the number of sub-array modules, and wherein each I/O device interfaces with a corresponding sub-array module.

23. The X×Y sub-array module of claim 1 , wherein the interface circuitry is configured to transmit output image data to a directly or indirectly coupled X×Y sub-array module.

24. The X×Y sub-array module of claim 1 , wherein the interface circuitry is configured to transmit output image data to a directly or indirectly coupled processor that is in electrical communication with at least one other X×Y sub-array module.

25. The M×N array camera of claim 5 , wherein at least one X×Y sub-array module comprises interface circuitry configured to transmit output image data to a directly or indirectly coupled X×Y sub-array module.

26. The M×N array camera of claim 5 , wherein at least one X×Y sub-array module comprises interface circuitry configured to transmit output image data to a directly or indirectly coupled X×Y processor that is in electrical communication with at least one sub-array module.

Assignments (13)
SECURITY INTEREST Recorded May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR ADVANCED TECHNOLOGIES INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.; ADEIA SEMICONDUCTOR INC.; ADEIA SEMICONDUCTOR SOLUTIONS LLC; ADEIA SEMICONDUCTOR TECHNOLOGIES LLC; ADEIA SOLUTIONS LLC
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 11, 2018
From: FOTONATION CAYMAN LIMITED
To: FOTONATION LIMITED
Reel/Frame 046539/0815 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 22, 2016
From: PELICAN IMAGING CORPORATION
To: FOTONATION CAYMAN LIMITED
Reel/Frame 040675/0025 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 22, 2016
From: KIP PELI P1 LP
To: PELICAN IMAGING CORPORATION
Reel/Frame 040674/0677 →
CHANGE OF NAME Recorded Oct 19, 2016
From: DBD CREDIT FUNDING LLC
To: DRAWBRIDGE SPECIAL OPPORTUNITIES FUND LP
Reel/Frame 040494/0930 →
CHANGE OF NAME Recorded Oct 19, 2016
From: DBD CREDIT FUNDING LLC
To: DRAWBRIDGE SPECIAL OPPORTUNITIES FUND LP
Reel/Frame 040423/0725 →
SECURITY INTEREST Recorded Jun 13, 2016
From: DBD CREDIT FUNDING LLC
To: DRAWBRIDGE OPPORTUNITIES FUND LP
Reel/Frame 039117/0345 →
SECURITY INTEREST Recorded Jun 13, 2016
From: DBD CREDIT FUNDING LLC
To: DRAWBRIDGE OPPORTUNITIES FUND LP
Reel/Frame 038982/0151 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR AND ASSIGNEE PREVIOUSLY RECORDED AT REEL: 037565 FRAME: 0439. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jan 25, 2016
From: KIP PELI P1 LP
To: DBD CREDIT FUNDING LLC
Reel/Frame 037591/0377 →
SECURITY INTEREST Recorded Jan 22, 2016
From: PELICAN IMAGING CORPORATION
To: KIP PELI P1 LP
Reel/Frame 037565/0439 →
SECURITY INTEREST Recorded Jan 22, 2016
From: PELICAN IMAGING CORPORATION
To: DBD CREDIT FUNDING LLC
Reel/Frame 037565/0417 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 22, 2016
From: PELICAN IMAGING CORPORATION
To: KIP PELI P1 LP
Reel/Frame 037565/0385 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 4, 2015
From: VENKATARAMAN, KARTIK; GALLAGHER, PAUL; LELESCU, DAN; MCMAHON, ANDREW KENNETH JOHN; DUPARRE, JACQUES; PAIN, BEDABRATA
To: PELICAN IMAGING CORPORATION
Reel/Frame 036249/0285 →