Semiconductor device having compressively strained channel region and method of making same
A semiconductor device and method making it utilize a three-dimensional channel region comprising a core of a first semiconductor material and an epitaxial covering of a second semiconductor material. The first and second semiconductor materials have respectively different lattice constants, thereby to create a strain in the epitaxial covering. The devices are formed by a gate-last process, so that the second semiconductor material is deposited only after the high temperature processes have been performed. Consequently, the lattice strain is not substantially relaxed, and the improved performance benefits of the lattice strained channel region are not compromised.
1. A semiconductor device, comprising:
a three-dimensional channel region including a fin body comprising a core of a first semiconductor material and a cladding region that is an epitaxial covering of a second semiconductor material covering the core of the first semiconductor material on three sides of an upper part of the core of the first semiconductor material, the first and second semiconductor materials having respectively different lattice constants, thereby to create a strain in the epitaxial covering;
a source region positioned adjacent one end of the three-dimensional channel region, and a drain region positioned adjacent an opposite end of the three-dimensional channel region; and
a gate electrode superposed on the three-dimensional channel region,
wherein the second semiconductor material is present in a region underlying the gate electrode, and
the epitaxial covering of the second semiconductor material is recessed within the core of the first semiconductor material in cross-sectional view taken through the source region, the gate electrode, and the drain region, and
the core and the cladding region that are made of the first and the second semiconductor materials having the respectively different lattice constants result in a valence band energy offset between the core and the cladding region, thereby suppressing off-state leakage current.
2. The semiconductor device according to claim 1 , wherein each of the core and the epitaxial covering projects upwardly relative to an underlying substrate.
3. The semiconductor device according to claim 1 , wherein the core is formed integrally with an underlying substrate of the first semiconductor material.
4. The semiconductor device according to claim 1 , wherein the core is formed on an insulating layer of a semiconductor on insulator (SOI) substrate.
5. The semiconductor device according to claim 4 , wherein each of the three-dimensional channel region, the source region, the drain region, and the gate electrode are separated from an underlying substrate by the insulating layer, thereby to form a transistor that is fully isolated from the underlying substrate.
6. The semiconductor device according to claim 1 , wherein the first semiconductor material comprises silicon and germanium, and
wherein said second semiconductor material comprises silicon.
7. The semiconductor device according to claim 1 , wherein the epitaxial covering of the second semiconductor material is surrounded on three sides by the core of the first semiconductor material in cross-sectional view perpendicular to a facing direction of the source region and the drain region.
8. A semiconductor device, comprising:
a three-dimensional channel region including a fin body comprising a core of a first semiconductor material and a cladding region that is an epitaxial covering of a second semiconductor material covering the core of the first semiconductor material on three sides of an upper part of the core of the first semiconductor material, the first and second semiconductor materials having respectively different lattice constants, thereby to create a strain in the epitaxial covering;
a source region positioned adjacent one end of the three-dimensional channel region, and a drain region positioned adjacent an opposite end of the three-dimensional channel region;
a gate electrode superposed on the three-dimensional channel region; and
a three-dimensional gate dielectric layer between the gate electrode and the three-dimensional channel region,
wherein the epitaxial covering of the second semiconductor material is recessed within the core of the first semiconductor material in cross-sectional view taken through the source region, the gate electrode, and the drain region, and
the core and the cladding region that are made of the first and the second semiconductor materials having the respectively different lattice constants result in a valence band energy offset between the core and the cladding region, thereby suppressing off-state leakage current.
9. The semiconductor device according to claim 8 , wherein each of the core and the epitaxial covering projects upwardly relative to an underlying substrate.
10. The semiconductor device according to claim 8 , wherein the core is formed integrally with an underlying substrate of the first semiconductor material.
11. The semiconductor device according to claim 8 , wherein the core is formed on an insulating layer of a semiconductor on insulator (SOI) substrate.
12. The semiconductor device according to claim 11 , wherein each of the three-dimensional channel region, the source region, the drain region, and the gate electrode are separated from an underlying substrate by the insulating layer, thereby to form a transistor that is fully isolated from the underlying substrate.
13. The semiconductor device according to claim 8 , wherein the second semiconductor material has a larger lattice constant than the first semiconductor material, thereby to create a compressive strain in the epitaxial covering.
14. The semiconductor device according to claim 13 , wherein the first semiconductor material comprises silicon and the second semiconductor material comprises silicon and germanium.
15. The semiconductor device according to claim 8 , wherein the second semiconductor material has a smaller lattice constant than the first semiconductor material, thereby to create a tensile strain in the epitaxial covering.
16. The semiconductor device according to claim 15 , wherein the first semiconductor material comprises silicon and germanium and wherein the second semiconductor material comprises silicon.
17. The semiconductor device according to claim 8 , wherein the three-dimensional gate dielectric layer extends upwardly from the three-dimensional channel region, between the gate electrode and each of a pair of sidewall spacers.
18. The semiconductor device according to claim 8 , wherein the three-dimensional channel region is repeated as a series of the channel regions, and wherein the gate electrode overlies plural channel regions within the series.
19. The semiconductor device according to claim 18 , wherein the three-dimensional gate dielectric layer extends downwardly between adjacent channel regions within the series.
20. The semiconductor device according to claim 8 , wherein the epitaxial covering of the second semiconductor material is surrounded on three sides by the core of the first semiconductor material in cross-sectional view perpendicular to a facing direction of the source region and the drain region.