Molded leadframe for PCB-to-PCB connection

1. A method for making an electrical connector, comprising:

removing from a single metal sheet a unitary structure comprising a plurality of parallel substantially strip-shaped electrical conductors and at least one cross member interconnecting the plurality of electrical conductors;

embedding an end portion of each electrical conductor of the structure in a mass of molding compound defining a leadframe body, a lead portion of each electrical conductor remaining exterior to the mass of molding compound; and

separating the plurality of electrical conductors from each other by cutting the cross member while portions of each electrical conductor remain embedded in the molding compound.

2. The method of claim 1 , wherein the end portion of each electrical conductor has a planar surface not in contact with the molding compound and substantially coplanar with a lower surface of the leadframe body.

3. The method of claim 1 , wherein removing from a single metal sheet a unitary structure comprising a plurality of parallel substantially strip-shaped electrical conductors and at least one cross member interconnecting the plurality of electrical conductors comprises stamping the single metal sheet.

4. The method of claim 1 , wherein the end portion of each electrical conductor has an indentation.

5. The method of claim 4 , wherein embedding an end portion of each electrical conductor of the structure comprises:

placing the end portion of each electrical conductor in a mold cavity; and

introducing the molding compound into the mold cavity, wherein the molding compound conforms to a shape of the indentation.

6. The method of claim 1 , wherein the leadframe body includes a plurality of fastening features selected from the group consisting of pins extending from the leadframe body and holes extending through the leadframe body.

7. The method of claim 1 , wherein the end portion of each electrical conductor has a substantially trapezoidal cross-sectional shape.

8. The method of claim 1 , further comprising forming a bend in the lead portion of each electrical conductor.

9. The method of claim 8 , further comprising:

attaching the leadframe body to an optical data communication module having a module printed circuit board, the end portion of each electrical conductor contacting an electrical contact pad of the module printed circuit board; and

surface mounting the lead portion of each electrical conductor to a surface of a main printed circuit board, the lead portion of each electrical conductor contacting an electrical contact pad of the main printed circuit board.

10. The method of claim 9 , wherein the module printed circuit board is substantially perpendicular to the main printed circuit board.

11. The method of claim 9 , wherein the module printed circuit board is substantially parallel to the main printed circuit board.

12. The method of claim 9 , wherein a plurality of pins connect the leadframe body to the module printed circuit board.

13. The method of claim 1 , further comprising:

attaching the leadframe body to an optical data communication module having a module printed circuit board, the end portion of each electrical conductor contacting an electrical contact pad of a surface of the module printed circuit board; and

mounting the lead portion of each electrical conductor in a hole in a surface of a main printed circuit board.

14. The method of claim 1 , wherein:

the structure comprises two cross members; and

embedding an end portion of each electrical conductor in a mass of molding compound comprises embedding a first end portion of each electrical conductor in a first mass of molding compound defining a first leadframe body and embedding a second end portion of each electrical conductor in a second mass of molding compound defining a second leadframe body.

15. The method of claim 14 , further comprising cutting each electrical conductor of the plurality of electrical conductors at a location between the first and second leadframe bodies.

16. The method of claim 14 , further comprising:

attaching the first leadframe body to an optical data communication module having a module printed circuit board, each first end portion contacting an electrical contact pad of a surface of the module printed circuit board; and

attaching the second leadframe body a main printed circuit board, each second end portion contacting an electrical contact pad of a surface of the main printed circuit board.

17. The method of claim 16 , wherein attaching the second leadframe body a main printed circuit board comprises:

mounting a receptacle housing on the main printed circuit board, the receptacle housing having an opening;

mounting the second leadframe body in the opening in the receptacle housing; and

moving a latch member from a released position to a secured position, the second leadframe body retained between the latch member in the secured position and the surface of the main printed circuit board, the latch member exerting a force against the second leadframe body to urge each second end portion into contact with an electrical contact pad of a surface of the main printed circuit board.

18. A method for making an electrical connector, comprising:

stamping from a single metal sheet a unitary structure comprising a plurality of parallel substantially strip-shaped electrical conductors and at least one cross member interconnecting the plurality of electrical conductors;

embedding an end portion of each electrical conductor of the structure in a mass of molding compound defining a leadframe body, a lead portion of each electrical conductor remaining exterior to the mass of molding compound, wherein the end portion of each electrical conductor has a planar surface not in contact with the molding compound and substantially coplanar with a lower surface of the leadframe body;

separating the plurality of electrical conductors from each other by cutting the cross member while portions of each electrical conductor remain embedded in the molding compound;

attaching the leadframe body to an electronic module having a module printed circuit board, the end portion of each electrical conductor contacting an electrical contact pad of the module printed circuit board; and

surface mounting the lead portion of each electrical conductor to a surface of a main printed circuit board, the lead portion of each electrical conductor contacting an electrical contact pad of the main printed circuit board.

19. The method of claim 18 , further comprising, before surface mounting the lead portion of each electrical conductor, forming a bend of approximately 90 degrees in the lead portion of each electrical conductor between the leadframe body and the lead portion of each electrical conductor.

20. The method of claim 18 , wherein the electronic module is an optical data communication module.