Fuse circuit and semiconductor integrated circuit device
View Patent ↗Provided is a semiconductor integrated circuit device including a fuse circuit whose area and cost are minimized by a simple circuit configuration. The fuse circuit includes a first fuse and a second fuse having substantially the same shape and different sheet resistances, which are connected in series between terminals with different potentials. In a state in which none of the fuses is cut, a potential of an output terminal is fixed to a potential of one of the terminals.
1. A fuse circuit incorporated into a semiconductor device, the fuse circuit comprising:
a first fuse having a first end and a second end;
a second fuse having a first end and a second end, wherein the first end of the first fuse and the first end of the second fuse are connected at an output terminal;
a first voltage source arranged to apply a first voltage to one of the second end of the first fuse or the second end of the second fuse; and
a second voltage source arranged to apply a second voltage to the other of the second end of the first fuse or the second end of the second fuse, wherein the first voltage is set higher than the second voltage,
wherein one of the first or second fuse is cut and electrically disconnected between the first and second ends thereof, and either a first or second logical signal appears at the output terminal, depending on whether the first or second fuse is cut, wherein the first logical signal is recognizable by an electronic device as “1”, and the second logical signal is recognizable by the electronic device as “0”,
the first fuse and the second fuse each comprise a material composition having a specific electrical resistance, such that a layer of the material of the first fuse as initially formed, has a first sheet resistance, and a layer of material of the second fuse as initially formed, has a second sheet resistance different from the first sheet resistance, and each fuse has substantially the same planar dimensions, and
the first and second sheet resistances are chosen so that when the first ends of the first and second fuses as initially formed are connected serially at the output terminal, and the first and second voltages are applied to the second ends of the serially connected first and second fuses, a current flows through the serially connected first and second fuses and causes voltage drops along the first and second fuses so as to output a third voltage at the output terminal, wherein the third voltage is determined solely by a ratio between the first and second sheet resistances to be either closer to the first voltage than the second voltage so that the electronic device can recognize the third voltage as the first logical signal “1” or closer to the second voltage than the first voltage so that the electronic device can recognize the third voltage as the second logical signal “0”.
2. The fuse circuit according to claim 1 , wherein the material layer of one of the first fuse or the second fuse comprises a layer of low-resistance polysilicon and the material layer of another of the first or second fuses comprises a layer of high-resistance polysilicon.
3. A semiconductor integrated circuit device integrated on a semiconductor substrate, comprising:
the fuse circuit according to claim 1 ; and
a logic circuit connected to the output terminal of the fuse circuit.