Solid-state imaging device

1. A solid-state imaging device comprising:

a dielectric substrate;

a solid-state imaging element disposed on the dielectric substrate, and including a photosensitive unit at a portion of a front surface thereof;

an adhesive between the dielectric substrate and the solid-state imaging element, the adhesive being in contact with a portion of a rear surface of the solid-state imaging element so as to permit air flow along other portions of the rear surface of the solid-state image element;

connection conductors that electrically connect the solid-state imaging element and the dielectric substrate;

a frame-shaped spacer disposed on the front surface of the solid-state imaging element to surround the photosensitive unit; and

an optical lid that is provided on the spacer.

2. The solid-state imaging device according to claim 1 , further comprising a sealant that is provided along a side surface of the solid-state imaging element such that the connection conductors are covered by the sealant and the side surface of the solid-state imaging element is otherwise exposed.

3. The solid-state imaging device according to claim 1 , wherein the adhesive includes a plurality of adhesive strips that are parallel to, and separated at a prescribed distance from, each other.

4. The solid-state imaging device according to claim 3 , wherein the plurality of adhesive strips are parallel to one side of the solid-state imaging element.

5. The solid-state imaging device according to claim 4 , wherein the solid-state imaging element is rectangular and has opposing long sides and opposing short sides, and the plurality of adhesive strips are parallel to the short sides of the solid-state imaging element.

6. The solid-state imaging device according to claim 4 , wherein the solid-state imaging element is rectangular and has opposing long sides and opposing short sides, and the plurality of adhesive strips are parallel to the long sides of the solid-state imaging element.

7. The solid-state imaging device according to claim 1 , further comprising a lid seal agent for hermetically sealing the optical lid to the frame-shaped spacer.

8. The solid-state imaging device according to claim 7 , wherein the lid seal agent is made of ultraviolet curable adhesive.

9. The solid-state imaging device according to claim 1 , wherein the connection conductors are disposed on two sides of the sold-state imaging device.

10. The solid-state imaging device according to claim 1 , wherein the connection conductors are disposed on four sides of the sold-state imaging device.

11. The solid-state imaging device according to claim 1 , wherein the connection conductors include conductors on the corners of the solid-state imaging device.

12. The solid-state imaging device according to claim 1 , wherein the adhesive is a thermosetting adhesive.

13. The solid-state imaging device according to claim 1 , wherein the spacer has a protruding upper portion that facilitates placement of the optical lid.

14. The solid-state imaging device according to claim 1 , wherein the adhesive includes a plurality of circularly shaped areas.

15. A solid-state imaging device comprising:

a dielectric substrate;

a solid-state imaging element including a photosensitive unit at a portion of a front surface thereof and bonded to the dielectric substrate such that air vents are formed between the solid-state imaging element and the dielectric substrate to permit air to flow between the solid-state imaging element and the dielectric substrate;

connection conductors that electrically interconnect the solid-state imaging element and the dielectric substrate;

a frame-shaped spacer that is provided on the front surface of the solid-state imaging element so as to surround the photosensitive unit; and

an optical lid that is provided on the frame-shaped spacer to close the opening of the frame-shaped spacer.

16. The solid-state imaging device according to claim 15 , wherein the solid-state imaging element is rectangular and has opposing long sides and opposing short sides, and the air vents are formed to permit air to flow between the short sides.

17. The solid-state imaging device according to claim 15 , wherein the solid-state imaging element is rectangular and has opposing long sides and opposing short sides, and the air vents are formed to permit air to flow between the long sides.

18. The solid-state imaging device according to claim 15 , wherein a plurality of circularly shaped adhesives are disposed between the solid-state imaging element and the dielectric substrate to bond the solid-state imaging element to the dielectric substrate.

19. A method for fabricating a solid-state imaging device, the method comprising:

applying an adhesive to a dielectric substrate, the adhesive laid down in a plurality of areas separated from each other;

disposing a solid-state imaging element against the adhesive areas such that a rear surface of the solid-state imaging element is in contact with the plurality of areas and is separated from the dielectric substrate;

connecting electrode pads on a side of the solid-state imaging element to electrode pads on the dielectric substrate via bonding wires;

applying a spacer adhesive in a ring shape that surrounds the solid-state imaging element;

applying a frame-shaped spacer to the spacer adhesive;

applying a sealant over the bonding wires to cover the bonding wires;

applying a lid seal agent in two separate U-shaped portions on the upper surface of the frame-shaped spacer; and

disposing an optical lid onto the frame-shaped spacer such that the opening of the frame-shaped spacer is closed by affixing the optical lid to the lid seal agent.

20. The method for fabricating according to claim 19 , further comprising, after disposing the solid-state imaging element against adhesive areas, curing the adhesive while maintaining the separation of the rear surface of the solid-state imaging device from the front surface of the dielectric substrate.