Inspecting device and inspecting method
An inspecting device inspects an inspecting target that is a semiconductor device or a photo device. The inspecting device includes: a stage for holding an inspecting target; a femtosecond laser for emitting pulsed light; a galvano mirror for obliquely irradiating the inspecting target with the pulsed light, while changing an optical path of the pulsed light, to scan the inspecting target with the pulsed light; and a detection part for detecting an electromagnetic wave emitted non-coaxially with the pulsed light from the inspecting target in accordance with the illumination with the pulsed light.
1. An inspecting device which takes a semiconductor device or a photo device as an inspecting target, the device comprising:
a light source for emitting pulsed light;
a scan part for obliquely irradiating an inspecting target with said pulsed light, while changing an optical path of said pulsed light, to scan said inspecting target with said pulsed light;
a detection part for detecting an electromagnetic wave emitted non-coaxially with said pulsed light from said inspecting target in accordance with the illumination with said pulsed light; and
an image generation part for generating an image indicating electric field intensity distribution of said inspecting target based on an electric field intensity of an electromagnetic wave detected by said detection part,
wherein said image generation part decides a position on said image which corresponds to an acquisition point of an electromagnetic wave intensity based on an incidence angle of said pulsed light on said inspecting target.
2. The inspecting device according to claim 1 , wherein
said detection part is provided with a detector for receiving pulsed light emitted from said light source as probe light, to detect said electromagnetic wave, and
said inspecting device further includes a delay part for delaying the arrival timing of said probe light at said detector relatively to the arrival timing of said electromagnetic wave.
3. The inspecting device according to claim 1 , wherein said image generation part decides said acquisition point of an electromagnetic wave intensity based on fluctuations of data acquisition interval due to fluctuations of said incidence angle.
4. An inspecting method for inspecting a semiconductor device or a photo device as an inspecting target, the method comprising the steps of:
a) emitting pulsed light from a light source;
b) obliquely irradiating an inspecting target with said pulsed light emitted in said step (a), while changing an optical path of said pulsed light, to scan said inspecting target with said pulsed light;
c) detecting an electromagnetic wave emitted non-coaxially with said pulsed light from said inspecting target in accordance with the illumination with said pulsed light in said step (b); and
(d) generating an image indicating electric field intensity distribution of said inspecting target based on an electric field intensity of an electromagnetic wave detected in said step (c) by an image generation part,
wherein said image generation part decides a position on said image which corresponds to an acquisition point of an electromagnetic wave intensity based on an incidence angle of said pulsed light on said inspecting target.
5. The inspecting method according to claim 4 , wherein said image generation part decides said acquisition point of an electromagnetic wave intensity based on fluctuations of data acquisition interval due to fluctuations of said incidence angle in step (d).