Synthetic jet actuator equipped with entrainment features
A thermal management system ( 201 ) is provided which includes a housing ( 203 ) equipped with a first set of apertures S 1 ={a 1 , a i } ( 213 ), a second set of apertures S 2 ={b 1 , . . . b j } ( 215 ) and a set of entrainment features S 3 ={c 1 , C k } ( 217 ), wherein i, j, k≧1, and wherein, for any pair of adjacent apertures P a ={a m , b n }, wherein a m ε S 1 and m ε I={1, . . . , i}, and wherein b n ε S 2 and n ε J={1, . . . , j}, there is at least one entrainment feature c p ε S 3 which is disposed between aperture a m and aperture b n , wherein p ε K={1, . . . , k} . The thermal management system also includes a synthetic jet actuator disposed in said housing which is in fluidic communication with the sets of apertures S 1 and S 2 and which operates to create a synthetic jet at each aperture d r ε { S 1 , S 2 }, wherein r ε I∪J.
1. A thermal management system, comprising:
a housing equipped with a first set of apertures S 1 ={a 1 , . . . , a i }, a second set of apertures S 2 ={b 1 , . . . , b j } and a set of entrainment features S 3 ={c 1 , . . . , c k }, wherein i, j, k≧1, and wherein, for any pair of adjacent apertures P a ={a m , b n }, wherein a m ε S 1 and m ε I={1, . . . , i}, and wherein b n ε S 2 and n ε J={1, . . . , j}, there is at least one entrainment feature c p ε S 3 which is disposed between aperture a m and aperture b n , wherein p ε K={1, . . . , k}; and
a synthetic jet actuator disposed in said housing which is in fluidic communication with the sets of apertures S 1 and S 2 and which operates to create a synthetic jet at each aperture d r ε {S 1 , S 2 }, wherein r ε I∪J.
2. The thermal management system of claim 1 , further comprising:
a heat sink equipped with a plurality of fins and positioned with respect to said synthetic jet actuator such that the synthetic jet created at each aperture d r is directed between an adjacent pair of said fins.
3. The thermal management system of claim 2 , wherein the housing comprises a lip which extends over said heat sink, and wherein the entrainment features are a series of passageways which extend through said lip.
4. The thermal management system of claim 2 , wherein the housing comprises a series of protrusions which extends over said heat sink, wherein the first and second sets of apertures are disposed in said series of protrusions, and wherein the entrainment features are a series of spaces between said protrusions.
5. The thermal management system of claim 1 , wherein a heat source is disposed on an external surface of said housing.
6. The thermal management system of claim 1 , wherein a heat source is disposed on an internal surface of said housing.
7. The thermal management system of claim 6 , wherein said heat source is a semiconductor chip.
8. The thermal management system of claim 1 , further comprising first and second heat sources associated with said housing, and wherein said first heat source is a heat pipe which is in thermal communication with a second heat source.
9. The thermal management system of claim 1 , wherein said thermal management system further comprises a heat sink which is equipped with a plurality of heat fins.
10. The thermal management system of claim 9 , wherein said first and second sets of apertures comprise a plurality of pairs of spaced apart apertures, and wherein each aperture in any of said pairs of spaced apart apertures directs a synthetic jet into a same space formed by a pair of adjacent heat fins.
11. A method for cooling a heat source, comprising:
providing a thermal management system comprising (a) a housing equipped with a first set of apertures S 1 ={a 1 , . . . , a i }, a second set of apertures S 2 ={b 1 , . . . , b j } and a set of entrainment features S 3 ={c 1 , . . . , c k }, wherein i, j, k≧1, and wherein, for any pair of adjacent apertures P a ={a m , b n }, wherein a m ε S 1 and m ε I={1, . . . , i}, and wherein b n ε S 2 and n ε J={1, . . . , j}, there is at least one entrainment feature c p ε S 3 which is disposed between aperture a m and aperture b n , wherein p ε K={1, . . . , k}, and (b) a synthetic jet actuator disposed in said housing which is in fluidic communication with the sets of apertures S 1 and S 2 and which operates to create a synthetic jet at each aperture d r ε {S 1 , S 2 }, wherein r ε I∪J;
disposing a heat source on a surface of said housing; and
operating said synthetic jet actuator so as to create a synthetic jet at each aperture d r ε {S 1 , S 2 }, wherein r ε I∪J.
12. The method of claim 11 , wherein operating the synthetic jet actuator entrains ambient fluid at each member of the set of entrainment features S 3 .
13. The method of claim 11 , wherein said heat source is disposed on an external surface of said housing.
14. The method of claim 11 , wherein said heat source is disposed on an internal surface of said housing.
15. The method of claim 11 , wherein said heat source is a semiconductor chip.
16. The method of claim 11 , wherein said heat source comprises first and second heat sources, and wherein said first heat source is a heat pipe which is in thermal communication with a second heat source.
17. The method of claim 11 , wherein said thermal management system further comprises a heat sink.
18. The method of claim 17 , wherein said heat sink comprises a plurality of heat fins.
19. The method of claim 18 , wherein said first and second sets of apertures comprise a plurality of pairs of spaced apart apertures, and wherein each aperture in any of said pairs of spaced apart apertures directs a synthetic jet into a same space formed by a pair of adjacent heat fins.
20. The method of claim 19 , wherein each of said plurality of heat fins has a planar surface, and wherein each aperture directs a synthetic jet along an axis that is parallel to the planar surface of one of said heat fins.