Ultrathin Laminates
Ultrathin copper clad laminates including a fabric sheet material layer having a first planar surface, a second planar surface and an original thickness of from about 10 to about 30 microns and at least one copper foil sheet that is adhered to a planar surface of the fabric sheet material by a cured resin wherein the base laminate has a thickness of from about 1.0 to about 1.75 mils.
1 . A method for manufacturing an ultrathin laminate material comprising the steps of:
placing a first copper foil sheet having into contact with a first planar surface of a fabric sheet having a thickness of from 10 to about 30 microns wherein the fabric sheet is impregnated with a resin or a layer of resin lies between the first copper foil sheet and the fabric sheet first planar surface or both to form a layup; and
applying pressure and heat to the layup for a time sufficient to essentially fully cure the resin to form a laminate sheet having a base laminate thickness of from about 1.0 to about 1.75 mils.
2 . The method of claim 1 wherein a second copper sheet is placed into contact with a second planar surface of the fabric sheet before applying pressure and heat to the layup wherein the fabric sheet is impregnated with a resin or a layer of resin lies between the second copper foil sheet and the fabric sheet second planar surface or both.
3 . The method of claim 1 wherein a the copper foil includes a b-staged resin layer wherein the b-staged resin has a gel-time of 40-50 seconds and a viscosity of 15-25 Pascal seconds.
4 . The method of claim 1 wherein the method is a continuous method.
5 . The method of claim 1 wherein the laminate has an average minimum dielectric thickness of no less than about 0.080 mils and an average maximum dielectric thickness of no greater than about 1.2 mils.
6 . The method of claim 1 wherein the fabric sheet is a woven glass fabric sheet.
7 . The method of claim 1 wherein the fabric sheet is impregnated with a resin before the resin impregnated fabric sheet is placed into contact with a first copper foil sheet and a second copper foil sheet.
8 . The method of claim 1 wherein the first copper foil sheet includes a b-staged resin layer having a thickness of from about 10 to 25 microns.
9 . The method of claim 1 wherein the fabric sheet is pre-wetted before impregnating the fabric sheet with a resin.
10 . The method of claim 1 wherein the fabric sheet is pre-wetted before placing a resin layer of a resin coated copper foil into contact with a planar surface of the fabric sheet.
11 . A method for manufacturing an ultrathin laminate material comprising the steps of:
placing a first copper foil sheet having into contact with a first planar surface of a woven glass fabric sheet having a thickness of from 10 to about 30 microns wherein the fabric sheet is impregnated with a resin or a layer of resin lies between the first copper foil sheet and the fabric sheet first planar surface or both; and
applying pressure and heat to the stacked material for a time sufficient to essentially fully cure the resin to form a laminate sheet having an average minimum dielectric thickness of no less than about 0.80 mils and an average maximum dielectric thickness of no greater than about 1.2 mils.
12 . A method for manufacturing an ultrathin laminate material comprising the steps of:
forming at least one resin coated copper sheet including a copper foil sheet having a b-staged resin layer on one surface of the copper foil sheet;
placing the at least one resin coated copper foil sheet into contact with a first planar surface of a fabric sheet having a thickness of from 10 to about 30 microns such that the b-staged resin layer lies between the copper foil sheet and the fabric sheet first planar surface to form a layup; and
curing the resin layer to form an ultrathin laminate sheet including a c-staged resin.
13 . The method of claim 12 wherein the resin layer is cured by applying heat and pressure to the layup.
14 . The method of claim 12 wherein a second resin coated copper foil sheet is placed into contact with a second planar surface of the fabric sheet such that the b-staged resin layer lies between the copper foil sheet and the fabric sheet second planar surface.
15 . The method of claim 12 wherein the copper foil sheet is at least partially removed from the ultrathin laminate sheet.
16 . The method of claim 15 wherein the copper foil sheet is removed from the ultrathin laminate sheet.
17 . The method of claim 12 wherein the resin layer of the at least one resin coated copper sheet has a thickness of 25 microns or less and 8 microns or greater.
18 . The method of claim 12 wherein the ultrathin laminate sheet has a dielectric thickness ranging from about 0.8 to about 1.2 mils.
19 . The method of claim 12 wherein the at least one resin coated copper sheet has a thickness of from about 8 to about 20 microns.
20 . The method of claim 12 wherein all of the method steps are performed continuously.
21 . A method for manufacturing an ultrathin laminate material comprising the steps of:
forming a first resin coated copper sheet and a second resin coated copper sheet each of the first and second resin coated copper sheets including a copper foil sheet having a b-staged resin layer on one surface of the copper foil sheet;
placing the first resin coated copper foil sheet into contact with a first planar surface of a fabric sheet having a thickness of from 10 to about 30 microns such that the b-staged resin layer lies between the copper foil sheet and the fabric sheet first planar surface and placing the second resin coated copper foil sheet into contact with a second planar surface of the fabric sheet such that the b-staged resin layer lies between the copper foil sheet and the fabric sheet second planar surface to form a layup; and
curing the b-staged resin layers by applying heat and pressure to the layup to form an ultrathin laminate sheet including c-staged resin wherein the ultrathin laminate sheet has a dielectric thickness ranging from about 0.8 to about 1.2 mils.