Integrated thermo-optic switch with thermally isolated and heat restricting pillars
System and method embodiments are provided for a thermo-optic switch with thermally isolated and heat restricting pillars. The embodiments enable increased integration density in photonic integrated chips (PICs), reduced power consumption, improved switching speed, and increased chip lifetime. In an embodiment, an optical waveguide; a resistive heater in thermal contact with a surface of the optical waveguide; and a plurality of heat flow restricting pillars connected to the sides of the optical waveguide and supporting the optical waveguide such that the optical waveguide is substantially thermally isolated from a substrate below the optical waveguide by a gap formed between the optical waveguide and the substrate, and wherein the pillars restrict heat flow from the optical waveguide to a supporting structure that supports the pillars.
1. A thermo-optic switch, comprising:
an optical waveguide;
a resistive heater in thermal contact with a surface of the optical waveguide; and
a plurality of heat flow restricting pillars connected to sides of the optical waveguide and supporting the optical waveguide such that the optical waveguide is substantially thermally isolated from a substrate below the optical waveguide by a gap formed between the optical waveguide and the substrate, and wherein the pillars restrict heat flow from the optical waveguide to a supporting structure that supports the pillars,
wherein a surface of each of the pillars closest to the optical waveguide is smaller than a surface of each of the pillars farthest from the optical waveguide, and
wherein a width of the surface of each of the pillars closest to the optical waveguide is about 1 micron and a width of the surface of the pillars farthest from the optical waveguide is in a range of about 1.8 microns to about 2.5 microns.
2. The thermo-optic switch of claim 1 , wherein the pillars are substantially isolated from each other.
3. The thermo-optic switch of claim 1 , wherein the pillars are separated from each other by trenches.
4. The thermo-optic switch of claim 3 , wherein the trenches and the gap comprise one of air and a vacuum.
5. The thermo-optic switch of claim 1 , wherein each of the pillars comprises a substantially trapezoidal shape.
6. The thermo-optic switch of claim 1 , wherein each of the pillars comprises a substantially conical shape.
7. The thermo-optic switch of claim 1 , wherein the pillars comprise silicon dioxide.
8. A network component configured for manipulating optical signals, the network component comprising:
a processor;
a receiver connected to the processor; and
a photonic integrated circuit (PIC) connected to the receiver, wherein the PIC comprises a plurality of thermo-optical switches, wherein each of the thermo-optical switches comprises:
an optical waveguide;
a resistive heater in thermal contact with a surface of the optical waveguide; and
a plurality of heat flow restricting pillars connected to sides of the optical waveguide and supporting the optical waveguide such that the optical waveguide is substantially thermally isolated from a substrate below the optical waveguide by a gap formed between the optical waveguide and the substrate, and wherein the pillars restrict heat flow from the optical waveguide to a supporting structure that supports the pillars,
wherein a surface of each of the pillars closest to the optical waveguide is smaller than a surface of each of the pillars farthest from the optical waveguide, and
wherein a width of the surface of each of the pillars closest to the optical waveguide is about 1 micron and a width of the surface of the pillars farthest from the optical waveguide is in a range of about 1.8 microns to about 2.5 microns.
9. The network component of claim 8 , wherein the pillars are substantially isolated from each other.
10. The network component of claim 8 , wherein the pillars are separated from each other by trenches.
11. The network component of claim 10 , wherein the trenches and the gap comprise one of air and a vacuum.
12. The network component of claim 8 , wherein each of the pillars comprises a substantially trapezoidal shape.
13. The network component of claim 8 , wherein each of the pillars comprises a substantially conical shape.
14. The network component of claim 8 , wherein the pillars comprise silicon dioxide.
15. The network component of claim 8 , wherein the PIC comprises at least 6,000 of the thermo-optical switches per square inch.
16. A photonic integrated circuit (PIC), comprising:
a plurality of optical inputs; and
a plurality of thermo-optic switches connected to the inputs, wherein each of the thermo-optic switches comprises:
an optical waveguide;
a resistive heater in thermal contact with a surface of the optical waveguide; and
a plurality of heat flow restricting pillars connected to sides of the optical waveguide and supporting the optical waveguide such that the optical waveguide is substantially thermally isolated from a substrate below the optical waveguide by a gap formed between the optical waveguide and the substrate, and wherein the pillars restrict heat flow from the optical waveguide to a supporting structure that supports the pillars,
wherein a surface of each of the pillars closest to the optical waveguide is smaller than a surface of each of the pillars farthest from the optical waveguide, and
wherein a width of the surface of each of the pillars closest to the optical waveguide is about 1 micron and a width of the surface of the pillars farthest from the optical waveguide is in a range of about 1.8 microns to about 2.5 microns.
17. The PIC of claim 16 , wherein the pillars are substantially isolated from each other.
18. The PIC of claim 16 , wherein the pillars are separated from each other by trenches.
19. The PIC of claim 18 , wherein the trenches and the gap comprise one of air and a vacuum.
20. The PIC of claim 16 , wherein each of the pillars comprises a substantially trapezoidal shape.
21. The PIC of claim 16 , wherein each of the pillars comprises a substantially conical shape.
22. The PIC of claim 16 , wherein the pillars comprise silicon dioxide.
23. The PIC of claim 16 , wherein the PIC comprises at least 6,000 of the thermo-optical switches per square inch.