IP Library Granted Patent US 9,578,788
Granted Patent B2
US 9,578,788 · App. 14/198,329 · Granted Feb 21, 2017

Inverter power module packaging with cold plate

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Quick Facts
Patent No.
US 9,578,788
App. No.
14/198,329
Granted
Feb 21, 2017
Kind
B2
Abstract

A heat sink is provided. The heat sink includes a single-piece housing having a floor and two walls, the walls perpendicular to the floor and the walls are parallel to each other. The heat sink includes the housing having an inlet and an outlet. The housing is configured to attach power modules to an outer surface of the floor and to outer surfaces of the two walls. The housing is configured to cool the power modules in response to fluid flow into the inlet.

Claims (56)

1. A power module package, comprising:

a first cold plate, with a first cold plate cover assembled thereto, and a first power module assembled to the first cold plate cover;

a second cold plate, with a second cold plate cover assembled thereto, and a second power module assembled to the second cold plate cover, the second cold plate extending perpendicularly from an edge of the first cold plate; and

a third cold plate, with a third cold plate cover assembled thereto, a third power module assembled to the third cold plate cover, the third cold plate extending perpendicularly from an edge of the second cold plate, the third cold plate parallel to the first cold plate;

an inner nesting region of the power module package, bounded by the first cold plate, the second cold plate and the third cold plate, the power module package configured to cool the first power module, the second power module, the third power module and the inner nesting region of the power module package in response to a fluid flowing through the first cold plate, the second cold plate and the third cold plate;

a first outlet, located at a juncture of the first cold plate and the second cold plate, the first outlet configured to flow the fluid out from the first cold plate; and

a second outlet, located at a juncture of the second cold plate and the third cold plate, the second outlet configured to flow the fluid out from the third cold plate.

2. The power module package of claim 1 , further comprising:

each of the first cold plate cover, the second cold plate cover and the third cold plate cover having pin fins, the pin fins configured to immerse in the fluid.

3. The power module package of claim 1 , further comprising:

each of the first power module, the second power module and the third power module having power devices facing the first cold plate cover, the second cold plate cover and the third cold plate cover, respectively.

4. The power module package of claim 1 , further comprising:

a thermal conductive compound thermally coupling the first power module to the first cold plate cover, the second power module to the second cold plate cover, and the third power module to the third cold plate cover.

5. The power module package of claim 1 , further comprising:

an inlet, centrally located at one end of the second cold plate, the inlet configured to flow the fluid into the second cold plate.

6. The power module package of claim 1 , further comprising:

separators attached to the first cold plate, the second cold plate and the third cold plate, the separators configured to guide the fluid through the first cold plate, the second cold plate and the third cold plate.

7. The power module package of claim 1 , further comprising:

the first cold plate having an aperture that fluidly couples an interior of the first cold plate to an interior of the second cold plate; and

the third cold plate having a further aperture that fluidly couples an interior of the third cold plate to the interior of the second cold plate.

8. A power module package, comprising:

a first cold plate, a second cold plate, and a third cold plate, each having a cold plate cover and a power module;

the first cold plate and the third cold plate arranged at opposed edges of the second cold plate and perpendicular to the second cold plate so as to bound an inner nesting region of the power module package; and

the first cold plate, the second cold plate and the third cold plate configured to flow a fluid therethrough so as to cool the first power module, the second power module, the third power module and the inner nesting region, wherein the fluid path enters the second cold plate and splits to the first cold plate and the third cold plate.

9. The power module package of claim 8 , further comprising:

the cold plate cover of each of the first cold plate, the second cold plate and the third cold plate having a plurality of pin fins arranged to contact the fluid.

10. The power module package of claim 8 , further comprising:

a plurality of power devices arranged to face the cold plate cover, on each of the first power module, the second power module and the third power module.

11. The power module package of claim 8 , further comprising:

the cold plate cover of each of the first cold plate, the second cold plate and the third cold plate having a thermal conductive compound to couple to the power module.

12. The power module package of claim 8 , further comprising:

the second cold plate having an inlet for receiving the fluid; and

each of the first and third cold plates configured to receive the fluid from the second cold plate.

13. The power module package of claim 8 , further comprising:

a juncture of the first and second cold plates having a first outlet for discharging the fluid; and

a juncture of the third and second cold plates having a second outlet for discharging the fluid.

14. The power module package of claim 8 , further comprising:

each of the first cold plate, the second cold plate and the third cold plate having separators configured to guide the fluid through the second cold plate to the first cold plate and the third cold plate, and through the first cold plate and the third cold plate.

15. A power module package, comprising:

a first cold plate having a first cold plate cover and a first power module;

a second cold plate having a second cold plate cover and a second power module;

a third cold plate having a third cold plate cover and a third power module; and

the first cold plate and the third cold plate monolithic with and perpendicular to the second cold plate and bounding an inner nesting region of the power module package, with a fluid path through the second cold plate and each of the first cold plate and the third cold plate, wherein the fluid path enters the second cold plate and splits to the first cold plate and the third cold plate.

16. The power module package of claim 15 , further comprising:

the second cold plate having an inlet for the fluid path;

a juncture between the first cold plate and the second plate having an outlet for the fluid path; and

a further juncture between the third cold plate and the second cold plate having a further outlet for the fluid path.

17. The power module package of claim 15 , further comprising:

the first cold plate cover having a first plurality of pin fins;

the second cold plate cover having a second plurality of pin fins; and

the third cold plate cover having a third plurality of pin fins.

18. The power module package of claim 15 , further comprising:

the first cold plate having a first plurality of separators;

the second cold plate having a second plurality of separators; and

the third cold plate having a third plurality of separators, each of the first, second and third plurality of separators configured to guide fluid along the fluid path.

19. The power module package of claim 15 , wherein the first cold plate and the third cold plate monolithic with and perpendicular to the second cold plate has a U-shaped cross-section bounded by the first cold plate, the second cold plate and the third cold plate.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Apr 5, 2019
From: AYAR THIRD INVESTMENT COMPANY
To: ATIEVA, INC.
Reel/Frame 048811/0472 →
SECURITY INTEREST Recorded Oct 5, 2018
From: ATIEVA, INC.
To: AYAR THIRD INVESTMENT COMPANY
Reel/Frame 047199/0221 →
RELEASE OF SECURITY INTEREST Recorded Sep 24, 2018
From: YINLONG ELECTRIC VEHICLE (HK) GROUP LIMITED
To: ATIEVA, INC.; ATIEVA USA, INC.; AVB METRICS, LLC
Reel/Frame 047620/0451 →
RELEASE OF SECURITY INTEREST Recorded Sep 13, 2018
From: TRINITY CAPITAL FUND III, L.P.
To: ATIEVA, INC.; ATIEVA USA, INC.; AVB METRICS, LLC
Reel/Frame 047529/0619 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2018
From: ATIEVA USA INC.
To: ATIEVA INC.
Reel/Frame 046696/0236 →
SECURITY INTEREST Recorded Nov 15, 2017
From: ATIEVA, INC.; ATIEVA USA, INC
To: YINLONG ELECTRIC VEHICLE (HK) GROUP LIMITED
Reel/Frame 044457/0942 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Mar 31, 2017
From: ATIEVA, INC
To: TRINITY CAPITAL FUND III, L. P.
Reel/Frame 042125/0897 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 12, 2014
From: TANG, YIFAN; JAN, JAMES; TSAI, BENSON
To: ATIEVA, INC.
Reel/Frame 032420/0837 →