Low thermal conductivity matrices with embedded nanostructures and methods thereof

1. A method for making a matrix with at least one embedded array of nanostructures, the method comprising:

preparing one or more fill materials;

filling voids corresponding to nanostructures with at least the one or more fill materials, each of the one or more fill materials being associated with a thermal conductivity less than 50 Watts per meter per degree Kelvin, the nanostructures including a semiconductor material; and

forming a matrix embedded with at least the nanostructures, the matrix being associated with at least a sublimation temperature and a melting temperature, the sublimation temperature and the melting temperature each being above 350° C.;

wherein the process for filling the voids includes:

keeping the nanostructures substantially parallel to each other; and

fixing the nanostructures in position relative to each other by the one or more fill materials;

wherein the process for preparing the one or more fill materials includes doping the one or more fill materials.

2. The method of claim 1 , and further comprising forming the nanostructures including first ends and second ends respectively.

3. The method of claim 1 , wherein the one or more fill materials each include at least one selected from a group consisting of photoresist, spin-on glass, spin-on dopant, aerogel, xerogel, and oxide.

4. The method of claim 1 , and further comprising pretreating one or more surfaces of the nanostructures.

5. The method of claim 4 wherein the process for pretreating includes altering the hydrophobicity of the one or more surfaces of the nanostructures.

6. The method of claim 1 , and further comprising preparing the one or more fill materials.

7. The method of claim 1 , and further comprising curing the one or more fill materials.

8. A method for making a matrix with at least one embedded array of nanostructures, the method comprising:

filling voids corresponding to nanostructures with at least one or more fill materials, each of the one or more fill materials being associated with a thermal conductivity less than 50 Watts per meter per degree Kelvin, the nanostructures including a semiconductor material;

curing the one or more fill materials; and

forming a matrix embedded with at least the nanostructures, the matrix being associated with at least a sublimation temperature and a melting temperature, the sublimation temperature and the melting temperature each being above 350° C.;

wherein the process for filling the voids includes:

keeping the nanostructures substantially parallel to each other; and

fixing the nanostructures in position relative to each other by the one or more fill materials;

wherein the process for curing the one or more fill materials includes heating the one or more fill materials to at least 300° C.

9. The method of claim 8 wherein the process for curing the one or more fill materials includes heating the one or more fill materials to at least 500° C.

10. A method for making a matrix with at least one embedded array of nanostructures, the method comprising:

filling voids corresponding to nanostructures with at least one or more fill materials, each of the one or more fill materials being associated with a thermal conductivity less than 50 Watts per meter per degree Kelvin, the nanostructures including a semiconductor material;

forming a matrix embedded with at least the nanostructures, the matrix being associated with at least a sublimation temperature and a melting temperature, the sublimation temperature and the melting temperature each being above 350° C.; and

planarizing at least one surface of the matrix;

wherein the process for filling the voids includes:

keeping the nanostructures substantially parallel to each other; and

fixing the nanostructures in position relative to each other by the one or more fill materials.

11. The method of claim 10 wherein the process for planarizing at least one surface of the matrix includes polishing the surface of the matrix.

12. The method of claim 1 , wherein the process for filling the voids includes:

applying the one or more fill materials in liquid form to the nanostructures; and

rotating the nanostructures to remove at least a portion of the one or more fill materials.

13. A method for making a matrix with at least one embedded array of nanostructures, the method comprising:

filling voids corresponding to nanostructures with at least one or more fill materials, each of the one or more fill materials being associated with a thermal conductivity less than 50 Watts per meter per degree Kelvin, the nanostructures including a semiconductor material; and

forming a matrix embedded with at least the nanostructures, the matrix being associated with at least a sublimation temperature and a melting temperature, the sublimation temperature and the melting temperature each being above 350° C.;

wherein the process for filling the voids includes:

keeping the nanostructures substantially parallel to each other; and

fixing the nanostructures in position relative to each other by the one or more fill materials;

wherein the process for filling the voids includes dipping the nanostructures in the one or more fill materials.

14. The method of claim 1 , wherein the process for filling the voids includes depositing the one or more fill materials.

15. A method for making a matrix with at least one embedded array of nanostructures, the method comprising:

filling voids corresponding to nanostructures with at least one or more fill materials, each of the one or more fill materials being associated with a thermal conductivity less than 50 Watts per meter per degree Kelvin, the nanostructures including a semiconductor material; and

forming a matrix embedded with at least the nanostructures, the matrix being associated with at least a sublimation temperature and a melting temperature, the sublimation temperature and the melting temperature each being above 350° C.;

wherein the process for filling the voids includes:

keeping the nanostructures substantially parallel to each other; and

fixing the nanostructures in position relative to each other by the one or more fill materials;

wherein the process for filling the voids includes depositing the one or more fill materials;

wherein the process for depositing the one or more fill materials includes chemical vapor deposition.

16. A method for making a matrix with at least one embedded array of nanostructures, the method comprising:

filling voids corresponding to nanostructures with at least one or more fill materials, each of the one or more fill materials being associated with a thermal conductivity less than 50 Watts per meter per degree Kelvin, the nanostructures including a semiconductor material; and

forming a matrix embedded with at least the nanostructures, the matrix being associated with at least a sublimation temperature and a melting temperature, the sublimation temperature and the melting temperature each being above 350° C.;

wherein the process for filling the voids includes:

keeping the nanostructures substantially parallel to each other; and

fixing the nanostructures in position relative to each other by the one or more fill materials;

wherein the process for filling the voids includes depositing the one or more fill materials;

wherein the process for depositing the one or more fill materials includes atomic layer deposition.

17. A method for making a matrix with at least one embedded array of nanostructures, the method comprising:

filling voids corresponding to nanostructures with at least one or more fill materials, each of the one or more fill materials being associated with a thermal conductivity less than 50 Watts per meter per degree Kelvin, the nanostructures including a semiconductor material; and

forming a matrix embedded with at least the nanostructures, the matrix being associated with at least a sublimation temperature and a melting temperature, the sublimation temperature and the melting temperature each being above 350° C.;

wherein the process for filling the voids includes:

keeping the nanostructures substantially parallel to each other; and

fixing the nanostructures in position relative to each other by the one or more fill materials;

wherein the process for filling the voids includes depositing the one or more fill materials;

wherein the process for depositing the one or more fill materials includes using at least one selected from a group consisting of tetra-methyl-ortho-silicate (TMOS), tetra-etho-ortho-silicate (TEOS), and silane (SiH 4 ).

18. A method for making a matrix with at least one embedded array of nanostructures, the method comprising:

filling voids corresponding to nanostructures with at least one or more fill materials, each of the one or more fill materials being associated with a thermal conductivity less than 50 Watts per meter per degree Kelvin, the nanostructures including a semiconductor material; and

forming a matrix embedded with at least the nanostructures, the matrix being associated with at least a sublimation temperature and a melting temperature, the sublimation temperature and the melting temperature each being above 350° C.;

wherein the process for filling the voids includes:

keeping the nanostructures substantially parallel to each other; and

fixing the nanostructures in position relative to each other by the one or more fill materials;

wherein the process for filling the voids includes depositing the one or more fill materials;

wherein the process for depositing the one or more fill materials includes forming at least a conformal layer of the one or more fill materials.

19. A method for making a matrix with at least one embedded array of nanostructures, the method comprising:

filling voids corresponding to nanostructures with at least one or more fill materials, each of the one or more fill materials being associated with a thermal conductivity less than 50 Watts per meter per degree Kelvin, the nanostructures including a semiconductor material; and

forming a matrix embedded with at least the nanostructures, the matrix being associated with at least a sublimation temperature and a melting temperature, the sublimation temperature and the melting temperature each being above 350° C.;

wherein the process for filling the voids includes:

keeping the nanostructures substantially parallel to each other; and

fixing the nanostructures in position relative to each other by the one or more fill materials;

wherein the process for filling the voids includes depositing the one or more fill materials;

wherein the process for depositing the one or more fill materials includes depositing the one or more fill materials in layers.

20. The method of claim 19 wherein the process for depositing the one or more fill materials in layers includes:

depositing a first layer, the first layer including one or more materials selected from a group consisting of SiN, TiN, BN, AIN, and CN;

depositing a second layer, the second layer including a first oxide; and depositing a third layer, the third layer including a second oxide.

21. The method of claim 20 wherein the first oxide is SiO 2 and the second oxide is ZrO 2 .

22. The method of claim 20 wherein:

the process for depositing the first layer includes depositing the first layer on surfaces of the nanostructures;

the process for depositing the second layer includes depositing the second layer on the first layer; and

the process for depositing the third layer includes depositing the third layer on the second layer.

23. The method of claim 20 wherein the process for depositing the one or more fill materials in layers further includes:

depositing a fourth layer, the fourth layer including the first oxide; and

depositing a fifth layer, the fifth layer including the second oxide.

24. A method for making a matrix with at least one embedded array of nanostructures, the method comprising:

filling voids corresponding to nanostructures with at least one or more fill materials, each of the one or more fill materials being associated with a thermal conductivity less than 50 Watts per meter per degree Kelvin, the nanostructures including a semiconductor material; and

forming a matrix embedded with at least the nanostructures, the matrix being associated with at least a sublimation temperature and a melting temperature, the sublimation temperature and the melting temperature each being above 350° C.;

wherein the process for filling the voids includes:

keeping the nanostructures substantially parallel to each other; and

fixing the nanostructures in position relative to each other by the one or more fill materials;

wherein:

the one or more fill materials include one or more first materials and one or more second materials;

the voids include a first plurality of voids and a second plurality of voids; and the process for filling the voids includes:

filling the first plurality of voids with the one or more first materials; and

filling the second plurality of voids with the one or more second materials.