IP Library Granted Patent US 9,518,315
Granted Patent B2
US 9,518,315 · App. 14/204,489 · Granted Dec 13, 2016

Processes for improving formability of wrought copper-nickel-tin alloys

Inventors: John F. Wetzel (Hamburg, PA); Ted Skoraszewski (New Ringold, PA)
Assignee: Materion Corporation
C22F1/08C22C9/06C22F1/10
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Quick Facts
Patent No.
US 9,518,315
App. No.
14/204,489
Granted
Dec 13, 2016
Kind
B2
Abstract

Disclosed are processes for improving the formability of a copper-nickel-tin alloy having a 0.2% offset yield strength that is above 115 ksi. The alloy includes about 14.5 to about 15.5 wt % nickel, about 7.5 to about 8.5 wt % tin, and the remaining balance is copper. The copper-nickel-tin alloy is mechanically cold worked to undergo between 5% and 15% plastic deformation. The alloy is then heat treated at elevated temperatures of about 450° F. to about 550° F. for a period of about 3 hours to about 5 hours. The alloy is then subsequently mechanically cold worked again to undergo between 4% and 12% plastic deformation. The alloy is then further heated to an elevated temperature of about 700° F. to about 850° F. for a period between about 3 minutes and about 12 minutes to relieve stress. The resulting alloy has a combination of good formability ratio and good yield strength.

Claims (28)

1. A process for improving the formability of a wrought copper-nickel-tin alloy having a 0.2% offset yield strength that is at least 115 ksi, comprising:

performing a first mechanical cold working step on a copper-nickel-tin alloy to a percentage of cold working (% CW) of about 5% to about 15%; and

relieving stress in the alloy through a heat treatment step.

2. The process of claim 1 , wherein the heat treatment for relieving stress in the alloy is performed at a temperature in the range of 700° F. to 950° F. for a period of about 3 minutes to about 12 minutes.

3. The process of claim 1 , wherein the heat treatment for relieving stress in the alloy is performed at a temperature in the range of 775° F. to 950° F. for a period of about 3 minutes to about 12 minutes.

4. The process of claim 1 , wherein after the heat treatment for relieving stress, the alloy has a yield strength of at least 130 ksi.

5. The process of claim 1 , wherein after the heat treatment for relieving stress, the alloy has a formability ratio that is below 2 in the transverse direction.

6. The process of claim 1 , wherein after the heat treatment for relieving stress, the alloy has a formability ratio that is below 2.5 in the longitudinal direction.

7. The process of claim 1 , wherein after the heat treatment for relieving stress, the alloy has a yield strength of at least 130 ksi, a formability ratio that is below 2 in the transverse direction, and a formability ratio that is below 2.5 in the longitudinal direction.

8. The process of claim 1 , wherein after the heat treatment for relieving stress, the alloy has a formability ratio that is below 1.5 in the transverse direction.

9. The process of claim 1 , wherein after the heat treatment for relieving stress, the alloy has a formability ratio that is below 2 in the longitudinal direction.

10. The process of claim 1 , wherein after heat treatment, the alloy has a formability ratio that is below 1.5 in the transverse direction, and a formability ratio that is below 2 in the longitudinal direction.

11. The process of claim 1 , wherein after heat treatment, the alloy has a yield strength of at least 135 ksi.

12. The process of claim 1 , further comprising:

heat treating the copper-nickel-tin alloy after the first cold working step; and

performing a second cold working step on the copper-nickel-tin alloy to a % CW of about 4% to about 12% prior to relieving stress in the alloy through heat treatment.

13. The process of claim 12 , wherein the heat treating after the first cold working is performed by exposing the alloy to a temperature from about 450° F. to about 550° F. for a period of from about 3 hours to about 5 hours.

14. The process of claim 12 , wherein the heat treatment for relieving stress in the alloy is performed at a temperature in the range of 700° F. to 850° F. for a period of about 3 minutes to about 12 minutes.

15. The process of claim 12 , wherein after the heat treatment for relieving stress, the alloy has a formability ratio that is below 1 in the transverse direction.

16. The process of claim 12 , wherein after the heat treatment for relieving stress, the alloy has a formability ratio that is below 1 in the longitudinal direction.

17. The process of claim 12 , wherein after the heat treatment for relieving stress, the alloy has a yield strength of at least 115 ksi, a formability ratio that is below 1 in the transverse direction, and a formability ratio that is below 1 in the longitudinal direction.

18. The process of claim 12 , wherein the copper-nickel-tin alloy includes from about 14.5 wt % to about 15.5 wt % nickel, and from about 7.5 wt % to about 8.5 wt % tin, with the remaining balance being copper.

19. The process of claim 12 , wherein the alloy is a spinodally-hardened material.

20. A process for improving the formability of a wrought copper-nickel-tin alloy having a 0.2% offset yield strength that is at least 115 ksi, comprising:

performing a first mechanical cold working step on a copper-nickel-tin alloy to a % CW of about 5% to about 15%;

heat treating the copper-nickel-tin alloy after the first cold working by exposing the alloy to a temperature from about 450° F. to about 550° F.;

performing a second mechanical cold working step on the copper-nickel-tin alloy to a % CW of about 4% to about 12%; and

relieving stress in the alloy through heat treatment by exposing the alloy to a temperature from about 700° F. to about 850° F.

Assignments (2)
SECURITY INTEREST Recorded Sep 25, 2019
From: MATERION CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050493/0809 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 6, 2014
From: WETZEL, JOHN F.; SKORASZEWSKI, TED
To: MATERION CORPORATION
Reel/Frame 032830/0251 →
Continuity (2)
Provisional Application 61782802 · Mar 14, 2013
Related Publication 20140261924A1 · Sep 18, 2014