System and Method for Cleaning Semiconductor Fabrication Equipment Parts
An exemplary embodiment discloses a process for cleaning semiconductor fabrication equipment parts with non-metallic surfaces. The process optionally includes providing a semiconductor fabrication part with a non-metallic surface to be cleaned and applying a dilute aqueous solution to remove contamination from the non-metallic surface. The aqueous solution optionally includes dilute amounts of hydrofluoric acid, nitric acid and hydrogen peroxide. The dilute amounts would optionally be in the ranges of 0.5-1.5% wt. hydrofluoric acid, 0.1-0.5% wt. nitric acid and 1-10% wt. hydrogen peroxide.
1 . A method for removing particles on a textured surface of a semiconductor fabrication equipment part comprising: determining a chemical bonding characteristic of the particles; identifying a type of particles embedded in the textured surface; measuring a depth of any subsurface damage; and performing a combination of ultrasonication and chemical etching to the textured surface based upon said chemical bonding characteristics, said type of particles and said depth of subsurface damage.