Electrochromic devices
View Patent ↗Conventional electrochromic devices frequently suffer from poor reliability and poor performance. Improvements are made using entirely solid and inorganic materials. Electrochromic devices are fabricated by forming an ion conducting electronically insulating interfacial region that serves as an IC layer. In some methods, the interfacial region is formed after formation of an electrochromic and a counter electrode layer, which are in direct contact with one another. The interfacial region contains an ion conducting electronically insulating material along with components of the electrochromic and/or the counter electrode layer. Materials and microstructure of the electrochromic devices provide improvements in performance and reliability over conventional devices. In addition to the improved electrochromic devices and methods for fabrication, integrated deposition systems for forming such improved devices are also disclosed.
1. An apparatus for fabricating an electrochromic device, comprising:
(a) an integrated deposition system comprising:
(i) a first deposition station containing a first target comprising a first material for depositing a layer of an electrochromic material on a substrate when the substrate is positioned in the first deposition station, wherein the layer of electrochromic material is configured to function as a first electrochromic electrode of the electrochromic device, and
(ii) a second deposition station containing a second target comprising a second material for depositing a layer of a counter electrode material on the substrate when the substrate is positioned in the second deposition station, wherein the layer of counter electrode material is configured to function as a second electrochromic electrode of the electrochromic device; and
(b) a controller containing program instructions provided on a non-transitory, tangible medium for passing the substrate through the first and second deposition stations in a manner that sequentially deposits a stack on the substrate, the stack comprising the layer of electrochromic material in direct contact with the layer of counter electrode material, without an ion conductor layer between the layer of electrochromic material and the layer of counter electrode material.
2. The apparatus of claim 1 , operable to pass the substrate from one station to the next without breaking vacuum.
3. The apparatus of claim 1 , wherein the integrated deposition system further comprises one or more lithiation stations operable to deposit lithium from a lithium-containing material source on at least one of the electrochromic layer and the counter electrode layer.
4. The apparatus of claim 3 , further comprising at least one slit valve operable to permit isolation of said one or more lithiation stations from at least one of the first deposition station and the second deposition station.
5. The apparatus of claim 3 , wherein the controller further comprises instructions for depositing both the layer of electrochromic material and the layer of counter electrode material and lithiating both of said layers.
6. The apparatus of claim 5 , wherein the controller instructions comprise instructions for depositing the layer of electrochromic material before depositing the layer of counter electrode material.
7. The apparatus of claim 3 , wherein the controller further comprises instructions for depositing lithium from the lithium-containing material source on the first deposited one of the electrochromic layer and the counter electrode layer.
8. The apparatus of claim 7 , wherein the controller further comprises instructions for (i) depositing the second deposited one of the electrochromic layer and the counter electrode layer after depositing the lithium, and then (ii) depositing lithium on the second deposited one of the electrochromic layer and the counter electrode layer.
9. The apparatus of claim 3 , wherein the controller further comprises instructions for depositing lithium from the lithium-containing material source on the second deposited one of the electrochromic layer and the counter electrode layer.
10. The apparatus of claim 1 , wherein the integrated deposition system is operable to deposit the stack on an architectural glass substrate.
11. The apparatus of claim 1 , wherein the integrated deposition system further comprises a substrate holder and transport mechanism configured to hold the substrate in a substantially vertical orientation while passing through the integrated deposition system.
12. The apparatus of claim 11 , wherein the substrate holder and transport mechanism are configured to hold an architectural glass substrate.
13. The apparatus of claim 11 , wherein the substrate holder and transport mechanism are configured to move substrate in a forward and backward motion path in front of the first target and/or the second target during deposition of the layer of electrochromic material and/or the layer of counter electrode material.
14. The apparatus of claim 1 , further comprising one or more load locks for passing the substrate between an external environment and the integrated deposition system.
15. The apparatus of claim 1 , wherein the integrated deposition system comprises one or more heaters configured to heat the substrate and one or more cooling components configured to cool, actively or passively, the substrate.
16. The apparatus of claim 1 , wherein the integrated deposition system does not contain a separate target comprising material for an ion conductor layer.
17. The apparatus of claim 1 , wherein the apparatus does not have a separate station for depositing an ion conductor layer between the layer of electrochromic material and the layer of counter electrode material.
18. The apparatus of claim 1 , wherein the first deposition station is adjacent to the second deposition station.
19. The apparatus of claim 1 , wherein the first and second deposition stations are provided in a single chamber.
20. The apparatus of claim 1 , wherein the first target comprises tungsten and the second target comprises nickel.
21. The apparatus of claim 1 , wherein the layer of counter electrode material comprises a doped nickel oxide.
22. The apparatus of claim 21 , wherein the doped nickel oxide comprises tungsten doped nickel oxide.
23. The apparatus of claim 21 , wherein the doped nickel oxide comprises tantalum doped nickel oxide.
24. The apparatus of claim 1 , wherein the layer of counter electrode material comprises a material selected from the group consisting of nickel oxide, nickel tungsten oxide, nickel vanadium oxide, nickel chromium oxide, nickel aluminum oxide, nickel manganese oxide, nickel magnesium oxide, chromium oxide, manganese oxide, and Prussian blue.
25. The apparatus of claim 1 , wherein the first deposition station and the second deposition station are connected modules.
26. The apparatus of claim 1 , wherein the stack comprises a transparent conductive oxide.
27. An apparatus for fabricating an electrochromic device, comprising: an integrated deposition system comprising:
(i) a first deposition station containing a material source configured to deposit an electrochromic layer including an electrochromic material;
(ii) a second deposition station configured to deposit a counter electrode layer including a counter electrode material; and
(iii) a controller containing program instructions provided on a non-transitory, tangible medium for passing the substrate through the first and second deposition stations in a manner that sequentially deposits a stack on the substrate, the stack comprising an intermediate layer sandwiched in between the electrochromic layer and the counter electrode layer; the intermediate layer not substantially electronically insulating; wherein either or both of the first deposition station and the second deposition station are also configured to deposit the intermediate layer over the electrochromic layer or the counter electrode layer, and where the intermediate layer includes an oxygen rich form of the electrochromic material or the counter electrode material and where the first and second deposition stations are interconnected in series and operable to pass a substrate from one station to the next without exposing the substrate to an external environment.
28. The apparatus of claim 27 , operable to pass the substrate from one station to the next without breaking vacuum.
29. The apparatus of claim 28 , wherein the integrated deposition system further comprises one or more lithiation stations operable to deposit lithium from a lithium-containing material source on at least one of the electrochromic layer, the intermediate layer and the counter electrode layer.
30. The apparatus of claim 29 , wherein the controller and deposition stations are configured to sequentially deposit the electrochromic layer, then the intermediate layer, and then the counter electrode layer.
31. The apparatus of claim 30 , wherein the controller further comprises program instructions for depositing lithium onto the electrochromic layer or the intermediate layer prior to depositing the counter electrode.
32. The apparatus of claim 30 , wherein the controller further comprises program instructions for depositing lithium onto the counter electrode.
33. The apparatus of claim 29 , further comprising one or more load locks for passing the substrate between an external environment and the integrated deposition system.
34. The apparatus of claim 33 , further comprising at least one slit valve operable to permit isolation of said one or more lithium deposition stations from at least one of the first deposition station, the second deposition station and the third deposition station.
35. The apparatus of claim 27 , wherein the integrated deposition system is operable to deposit the stack on an architectural glass substrate.
36. The apparatus of claim 35 , wherein the integrated deposition system further comprises a substrate holder and transport mechanism operable to hold the architectural glass substrate in a substantially vertical orientation while passing through the integrated deposition system.
37. The apparatus of claim 27 , wherein the integrated deposition system comprises one or more heaters configured to heat the substrate and one or more cooling components configured to cool the substrate.