IP Library Granted Patent US 9,481,598
Granted Patent B2
US 9,481,598 · App. 14/212,841 · Granted Nov 1, 2016

Laser cutting strengthened glass

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,481,598
App. No.
14/212,841
Granted
Nov 1, 2016
Kind
B2
Abstract

Methods for cutting strengthened glass are disclosed. The methods can include using a laser. The strengthened glass can include chemically strengthened, heat strengthened, and heat tempered glass. Strengthened glass with edges showing indicia of a laser cutting process are also disclosed. The strengthened glass can include an electrochromic film.

Claims (38)

1. A method for cutting thermally-strengthened glass, comprising:

providing a thermally-strengthened glass substrate wherein the thermally-strengthened glass substrate has a first surface and an opposing second surface;

applying laser energy to the thermally-strengthened glass substrate under conditions effective to cut the thermally-strengthened glass substrate, wherein applying laser energy comprises:

focusing the laser energy at a first position on or in proximity of the first surface; and

pulsing the laser energy for a pulse duration ranging from about 10 femtoseconds to about 100 picoseconds at a pulse frequency ranging from about 100 kHz to about 100 MHz, the pulsed laser energy having a pulse energy of about 1 μJ to about 400 μJ, and having a wavelength of about 250 nm to about 1100 nm; and

wherein the laser energy forms a filamentation pattern defined by a series of regularly recurring substantially parallel filamentation traces in the thermally-strengthened glass substrate.

2. The method of claim 1 further comprising translating the laser energy relative to a surface of the strengthened glass substrate at a speed ranging from 10 cm/s to 500 cm/s.

3. The method of claim 1 wherein the laser energy is applied to the thermally-strengthened glass substrate under conditions effective to cut the thermally-strengthened glass substrate into two or more cut pieces, at least one of the cut pieces having a modulus of rupture of greater than about 100 MPa, a set of the cut pieces having a probability of failure of less than about 5% under a 40 MPa load, and the two or more cut pieces having a Weibull modulus greater than 10.

4. The method of claim 1 wherein the strengthened glass substrate has a first surface, an opposing second surface and a thickness defined by the perpendicular distance between the first surface and the second surface, wherein the laser energy comprises a focal point and wherein conditions effective to cut the strengthened glass substrate include:

(a) translating the focal point of the laser energy relative to the first surface,

(b) repeating the steps of pulsing the laser energy and translating the focal point of the laser energy to form a filamentation pattern defined by a series of regularly recurring substantially parallel filamentation traces, and

(c) separating the strengthened glass substrate along the filamentation pattern to form two or more cut pieces of the strengthened glass substrate.

5. The method claim 1 wherein the strengthened glass substrate has a first surface, an opposing second surface, and a thickness defined by the perpendicular distance between the first surface and the second surface, the thickness being at least about 1.6 mm; and wherein the first surface has a surface area of at least 1 m 2 .

6. The method of claim 1 , further comprising protecting a cut edge of the strengthened glass substrate by coating it with a metal, oxide material, or polymer layer.

7. The method of claim 1 , further comprising forming one or more layers on the strengthened glass substrate prior to applying the laser energy, wherein one of the layers is an electrochromic layer.

8. The method of claim 1 , further comprising assembling an electrochromic device using a cut piece of the strengthened glass substrate.

9. The method of claim 1 , further comprising assembling an integrated glass unit using a cut piece of the strengthened glass substrate.

10. The method of claim 1 , wherein the series of filamentation traces extends from a first surface of the thermally-strengthened glass substrate toward a second surface of the thermally-strengthened glass substrate to a depth of at least 75% of the thickness as detected by optical microscopy.

11. The method of claim 10 , wherein the series of filamentation traces extends from the first surface toward the second surface to a depth of at least 90% of the thickness.

12. A method for fabricating two or more electrochromic composites, the method comprising:

providing an electrochromic composite comprising a strengthened glass substrate having a first surface and an opposing second surface, an electrically conductive layer supported on the first surface of the strengthened glass substrate, and an electrochromic layer in electronic communication with the electrically conductive layer; and

applying laser energy to the strengthened glass substrate under conditions effective to cut the strengthened glass substrate to form two or more electrochromic composites, wherein the laser energy forms a filamentation pattern defined by a series of regularly recurring substantially parallel filamentation traces in the strengthened glass substrate extending from a first surface of the strengthened glass substrate toward a second surface of the strengthened glass substrate to a depth of at least 75% of the thickness as detected by optical microscopy.

13. The method of claim 12 , wherein the strengthened glass substrate is a thermally-strengthened glass substrate.

14. The method of claim 12 , wherein the electrochromic composite is provided as a mother glass composite comprising an array of two or more spatially discrete electrochromic composites, each comprising a corresponding spatially discrete portion of the strengthened glass substrate, and the laser energy is applied to the strengthened glass substrate to cut the mother glass composite and separate two or more spatially discrete electrochromic composites.

15. The method of claim 12 , wherein applying laser energy comprises pulsing the laser energy for a pulse duration ranging from about 10 femtoseconds to about 100 picoseconds at a pulse frequency ranging from about 100 kHz to about 100 MHz, the pulsed laser having a pulse energy of about 1 μJ to about 400 μJ, and having a wavelength of about 250 nm to about 1100 nm.

16. The method of claim 12 further comprising translating the laser energy relative to a surface of the strengthened glass substrate at a speed ranging from 10 cm/s to 500 cm/s.

17. The method of claim 12 , wherein the laser energy is applied to the strengthened glass substrate under conditions effective to cut the strengthened glass substrate into two or more cut pieces, at least one of the cut pieces having a modulus of rupture of greater than about 100 MPa, a set of the cut pieces having a probability of failure of less than about 5% under a 40 MPa load, and the two or more cut pieces having a Weibull modulus greater than 10.

18. The method of claim 12 , wherein the strengthened glass substrate has a first surface, an opposing second surface, and a thickness defined by the perpendicular distance between the first surface and the second surface, the thickness being at least about 1.6 mm.

19. The method of claim 12 , further comprising protecting a cut edge of the strengthened glass substrate by coating it with a metal, oxide material, or polymer layer.

20. The method of claim 12 , further comprising assembling an integrated glass unit using a cut piece of the composite.

21. The method of claim 12 , wherein the series of filamentation traces extends from the first surface toward the second surface to a depth of at least 90% of the thickness.

22. A method for fabricating an insulated glass unit, the method comprising:

providing a first mother glass comprising a first strengthened glass substrate;

applying laser energy to the first strengthened glass substrate under conditions effective to cut the strengthened glass substrate to form a first glass lite, wherein applying laser energy comprises pulsing the laser energy for a pulse duration ranging from about 10 femtoseconds to about 100 picoseconds at a pulse frequency ranging from about 100 kHz to about 100 MHz, the pulsed laser having a pulse energy of about 1 μJ to about 400 μJ, and having a wavelength of about 250 nm to about 1100 nm;

providing a second glass lite; and

assembling the first glass lite and the second glass lite into an insulated glass unit.

23. The method of claim 22 , wherein the first strengthened glass substrate is provided as a component of an electrochromic device.

24. The method of claim 22 , wherein the laser energy is applied to the strengthened glass substrate under conditions effective to cut the strengthened glass substrate into two or more cut pieces, at least one of the cut pieces having a modulus of rupture of greater than about 100 MPa and a set of the cut pieces having a probability of failure of less than about 5% under a 40 MPa load and a Weibull modulus greater than 10.

Assignments (18)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 6, 2025
From: HALIO , LLC
To: SMART WINDOW INC., LIMITED
Reel/Frame 070438/0392 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 5, 2025
From: HALIO, INC.
To: HALIO, LLC
Reel/Frame 070404/0027 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Jun 18, 2024
From: HALIO, INC.
To: SKC CO., LTD., AS AGENT
Reel/Frame 067774/0328 →
SECURITY INTEREST Recorded Nov 17, 2023
From: HALIO, INC.
To: SKC CO., LTD., AS AGENT
Reel/Frame 065612/0158 →
RELEASE OF SECURITY INTEREST Recorded Oct 27, 2023
From: SK INC. (FORMERLY KNOWN AS SK HOLDINGS CO., LTD.)
To: HALIO, INC. (FORMERLY KNOWN AS KINESTRAL TECHNOLOGIES, INC.)
Reel/Frame 065383/0200 →
RELEASE OF SECURITY INTEREST Recorded Oct 27, 2023
From: SK INC.
To: HALIO, INC.
Reel/Frame 065382/0722 →
SECURITY INTEREST Recorded Sep 29, 2023
From: HALIO, INC.
To: PLUTUS CAPITAL NY, INC.
Reel/Frame 065084/0633 →
SECURITY INTEREST Recorded Aug 29, 2023
From: HALIO, INC.
To: PLUTUS CAPITAL NY, INC.
Reel/Frame 064753/0657 →
SECURITY INTEREST Recorded Nov 10, 2021
From: HALIO, INC.
To: SK INC.
Reel/Frame 058084/0947 →
CHANGE OF NAME Recorded Apr 1, 2021
From: KINESTRAL TECHNOLOGIES, INC.
To: HALIO, INC.
Reel/Frame 056031/0001 →
SECURITY INTEREST Recorded Jul 10, 2020
From: KINESTRAL TECHNOLOGIES, INC.
To: SK HOLDINGS CO., LTD.
Reel/Frame 053180/0686 →
RELEASE OF SECURITY INTEREST Recorded Jun 9, 2020
From: HORIZON TECHNOLOGY FINANCE CORPORATION
To: KINESTRAL TECHNOLOGIES, INC.
Reel/Frame 052887/0962 →
SECURITY INTEREST Recorded Nov 19, 2019
From: KINESTRAL TECHNOLOGIES, INC.
To: HORIZON TECHNOLOGY FINANCE CORPORATION
Reel/Frame 051059/0378 →
RELEASE OF SECURITY INTEREST Recorded Feb 1, 2019
From: GPB DEBT HOLDINGS II, LLC
To: KINESTRAL TECHNOLOGIES, INC.
Reel/Frame 048226/0446 →
SECURITY INTEREST Recorded Jan 31, 2019
From: KINESTRAL TECHNOLOGIES, INC.
To: SK HOLDINGS CO., LTD.
Reel/Frame 048199/0113 →
SECURITY INTEREST Recorded Dec 18, 2018
From: KINESTRAL TECHNOLOGIES, INC.
To: MURCHINSON VENTURE CREDIT LLC
Reel/Frame 047972/0503 →
SECURITY INTEREST Recorded Jun 7, 2018
From: KINESTRAL TECHNOLOGIES, INC.
To: GPB DEBT HOLDINGS II, LLC
Reel/Frame 046328/0594 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 1, 2014
From: BERGH, HOWARD S.; TIMMERMAN, NICOLAS
To: KINESTRAL TECHNOLOGIES, INC.
Reel/Frame 033860/0252 →