IP Library Granted Patent US 9,893,427
Granted Patent B2
US 9,893,427 · App. 14/213,959 · Granted Feb 13, 2018

Antenna-like matching component

Inventors: Olivier Pajona (Nice, FR); Sebastian Rowson (San Diego, CA); Laurent Desclos (San Diego, CA)
Assignee: ETHERTRONICS, INC.
H01Q9/36H01Q5/50
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Quick Facts
Patent No.
US 9,893,427
App. No.
14/213,959
Granted
Feb 13, 2018
Kind
B2
Abstract

An antenna-like matching component is provided, comprising one or more conductive portions formed on a substrate. Shapes and dimensions of the one or more conductive portions are determined to provide impedance matching for one or more antennas coupled to the matching component.

Claims (20)

1. A communication system, comprising:

one or more antennas, said one or more antennas including at least two antenna feeds, each of the at least two antenna feeds being coupled to a feed path coupling section;

an RF front end module coupled to the feed path coupling section via a plurality of RF paths extending therebetween, the plurality of RF paths comprising at least a first RF path and a second RF path; and

a matching component coupled to each of the RF paths, respectively;

further characterized in that:

the matching component comprises:

a first driving element coupled to a first solder pad;

a first parasitic element coupled to a second solder pad and positioned adjacent to the first driving element;

a second driving element coupled to a third solder pad; and

a second parasitic element coupled to a fourth solder pad and positioned adjacent to the second driving element;

each of the first driving element, first parasitic element, second driving element and second parasitic element being disposed on a substrate;

wherein the first solder pad is electrically coupled to the first RF path in shunt; and

wherein the third solder pad is electrically coupled to the second RF path in shunt.

2. The communication system of claim 1 , wherein the second solder pad is configured to be electrically coupled to ground, kept open, or coupled to another circuit.

3. The communication system of claim 1 , wherein the fourth solder pad is configured to be electrically coupled to ground, kept open, or coupled to another circuit.

4. The communication system of claim 1 , wherein the substrate comprises a dielectric material.

5. The communication system of claim 1 , wherein the matching component is further coupled to a circuit block, wherein the circuit block comprises one or more electronic components selected from the group consisting of: capacitors, inductors, switches, varactors, and transmission lines.

6. The communication system of claim 5 , wherein the circuit block is configured to vary an impedance associated with the matching component.

7. The communication system of claim 1 , wherein said one or more antennas comprises a single antenna having a plurality of antenna feeds.

8. The communication system of claim 1 , wherein the matching component is further connected to one of the antennas via a transmission line extending therebetween.

Assignments (6)
CHANGE OF NAME Recorded Feb 22, 2023
From: ETHERTRONICS, INC.
To: AVX ANTENNA, INC.
Reel/Frame 062763/0342 →
CHANGE OF NAME Recorded Feb 22, 2023
From: AVX ANTENNA, INC.
To: KYOCERA AVX COMPONENTS (SAN DIEGO), INC.
Reel/Frame 062820/0684 →
RELEASE OF SECURITY INTEREST Recorded Jan 31, 2018
From: NH EXPANSION CREDIT FUND HOLDINGS LP
To: ETHERTRONICS, INC.
Reel/Frame 045210/0725 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 29, 2017
From: PAJONA, OLIVIER; ROWSON, SEBASTIAN; DESCLOS, LAURENT
To: ETHERTRONICS, INC.
Reel/Frame 041789/0232 →
SECURITY INTEREST Recorded Oct 21, 2016
From: ETHERTRONICS, INC.
To: NH EXPANSION CREDIT FUND HOLDINGS LP
Reel/Frame 040464/0245 →
SECURITY INTEREST Recorded Feb 10, 2015
From: ETHERTRONICS, INC.
To: SILICON VALLEY BANK
Reel/Frame 034945/0258 →
Continuity (3)
Provisional Application 61838555 · Jun 24, 2013
Provisional Application 61785405 · Mar 14, 2013
Related Publication 20140313099A1 · Oct 23, 2014