Multi-channel transceiver with laser array and photonic integrated circuit
View Patent ↗A laser module can include: a laser chip having a plurality of laser diodes; a focusing lens optically coupled to each of the plurality of distinct laser diodes; and a photonic integrated circuit (PIC) having a plurality of optical inlet ports optically coupled to the plurality of laser diodes through the focusing lens. The laser module can include an optical isolator optically coupled to the focusing lens and PIC and positioned between the focusing lens and PIC. The laser chip can include a fine pitch laser array. The laser module can include a plurality of optical fibers optically coupled to an optical outlet port of the PIC. The laser module can include a hermetic package containing the laser chip and having a single focusing lens positioned for the plurality of laser diodes to emit laser beams there through.
1. A laser module comprising:
a laser chip having a plurality of laser diodes;
a focusing lens optically coupled to each of the plurality of distinct laser diodes; and
a substrate defining a photonic integrated circuit (PIC) having:
a plurality of optical inlet ports integrated on a surface of the PIC where each individual optical inlet port is optically coupled to one of the plurality of laser diodes through the focusing lens;
a plurality of waveguides integrated in the PIC where each individual waveguide is coupled to one of the plurality of optical inlet ports;
a plurality of optical splitters integrated in the PIC where each individual optical splitter is coupled to one of the plurality of waveguides and each optical splitter splits into two or more optical channels downstream from the individual optical splitter where each optical channel is integrated in the PIC;
a plurality of modulators integrated in the PIC where each individual modulator is coupled to one of the optical channels; and
a plurality of output channels integrated in the PIC where each individual output channel is coupled with one of the plurality of modulators.
2. The laser module of claim 1 , comprising an optical isolator optically coupled to the focusing lens and PIC and positioned between the focusing lens and PIC.
3. The laser module of claim 1 , wherein the laser chip includes a fine pitch laser array.
4. The laser module of claim 3 , wherein the fine pitch laser array has a pitch from about 10 microns to about 50 microns.
5. The laser module of claim 1 , wherein the plurality of laser diodes emit laser beams that have the same wavelength.
6. The laser module of claim 1 , wherein two or more of the plurality of laser diodes emit laser beams that have different wavelengths.
7. The laser module of claim 1 , comprising a plurality of optical fibers optically coupled to an optical outlet port of the PIC, wherein the optical outlet port is coupled with the plurality of output channels such that each individual output channel is optically coupled with one of the plurality of optical fibers.
8. The laser module of claim 1 , wherein the PIC has more optical output channels than the laser chip has laser diodes.
9. The laser module of claim 8 , wherein the number of optical output channels is at least twice the number of laser diodes on the laser chip.
10. The laser module of claim 1 , comprising a hermetic package containing the laser chip and having a single focusing lens positioned for the plurality of laser diodes to emit laser beams there through.
11. The laser module of claim 4 , wherein the plurality of optical inlet ports have a pitch of about 3× or 4× the pitch of the fine pitch laser array.
12. The laser module of claim 1 , comprising a wavelength-division multiplexing (WDM) device optically coupled to an optical outlet port of the PIC, wherein the optical outlet port is coupled with the plurality of output channels such that each individual output channel is optically coupled with one of the plurality of optical fibers.
13. The laser module of claim 1 , the PIC comprising a receiver photodiode.
14. A transmitter comprising:
a laser module comprising:
a laser chip having a plurality of laser diodes in a fine pitch laser array;
a focusing lens optically coupled to each of the plurality of distinct laser diodes;
an optical isolator optically coupled to the focusing lens; and
a substrate defining a photonic integrated circuit (PIC) having:
a plurality of optical inlet ports integrated on a surface of the PIC where each individual optical inlet port is optically coupled to one of the plurality of laser diodes through the focusing lens and optical isolator, wherein the PIC has at least twice more optical output channels than the laser chip has laser diodes;
a plurality of waveguides integrated in the PIC where each individual waveguide is coupled to one of the plurality of optical inlet ports;
a plurality of optical splitters integrated in the PIC where each individual optical splitter is coupled to one of the plurality of waveguides and each optical splitter splits into two or more optical channels downstream from the individual optical splitter where each optical channel is integrated in the PIC;
a plurality of modulators integrated in the PIC where each individual modulator is coupled to one of the optical channels; and
a plurality of output channels integrated in the PIC where each individual output channel is coupled with one of the plurality of modulators.
15. The transmitter of claim 14 , comprising a hermetic package containing the laser chip and having a single focusing lens positioned for the plurality of laser diodes to emit laser beams there through.
16. The transmitter of claim 15 , the PIC comprising:
the plurality of optical inlet ports have a pitch of about 3× or 4× the pitch of the fine pitch laser array;
an integrated waveguide for each optical inlet port;
an optical splitter optically coupled to each integrated waveguide that splits into two or more optical channels downstream from the optical splitter; and
an integrated modulator for each optical channel.
17. A transceiver comprising:
a transmitter laser module comprising:
a laser chip having a plurality of laser diodes in a fine pitch laser array;
a focusing lens optically coupled to each of the plurality of distinct laser diodes;
an optical isolator optically coupled to the focusing lens; and
a substrate defining a photonic integrated circuit (PIC) having:
a plurality of optical inlet ports integrated on a surface of the PIC where each individual optical inlet port is optically coupled to one of the plurality of laser diodes through the focusing lens and optical isolator, wherein the PIC has at least twice more optical output channels than the laser chip has laser diodes;
a plurality of waveguides integrated in the PIC where each individual waveguide is coupled to one of the plurality of optical inlet ports;
a plurality of optical splitters integrated in the PIC where each individual optical splitter is coupled to one of the plurality of waveguides and each optical splitter splits into two or more optical channels downstream from the individual optical splitter where each optical channel is integrated in the PIC;
a plurality of modulators integrated in the PIC where each individual modulator is coupled to one of the optical channels; and
a plurality of output channels integrated in the PIC where each individual output channel is coupled with one of the plurality of modulators; and
a receiver photodiode.
18. The transceiver of claim 17 , comprising a hermetic package containing the laser chip and having a single focusing lens positioned for the plurality of laser diodes to emit laser beams there through.
19. The transceiver of claim 18 , the PIC comprising:
the plurality of optical inlet ports have a pitch of about 3× or 4× the pitch of the fine pitch laser array;
an integrated waveguide for each optical inlet port;
an optical splitter optically coupled to each integrated waveguide that splits into two or more optical channels downstream from the optical splitter; and
an integrated modulator for each optical channel.
20. The transceiver of claim 19 , the PIC comprising the receiver photodiode.
21. The transceiver of claim 19 , comprising a receiver module separate from the transmitter laser module, the receiver module comprising the receiver photodiode.
22. The laser module of claim 1 , wherein the substrate is silicon.