Double-sided polishing of hard substrate materials
View Patent ↗Disclosed is a method and apparatus for simultaneously polishing both surfaces of an optical substrate. An upper platen and a lower platen, each covered with a polishing pad material and at least one carrier having an aperture for holding the optical substrate between the platens are provided. The location of the aperture of the carrier is set such that the center of the optical substrate is offset from the center of the carrier and at least a portion of the outer perimeter of the optical substrate extends outwardly beyond at least a portion of at least one of the outer perimeter and the inner perimeter of the platens. The platens are rotated with respect to the carrier, and the carrier is rotated with respect to the platens to polish the optical substrate. The location of the aperture of the carrier is adjustable.
1. A method for simultaneously polishing both surfaces of an optical substrate comprising:
providing an upper platen and a lower platen, each covered with a polishing pad material;
providing at least one carrier having an aperture for holding the optical substrate between the upper platen and the lower platen and adapted to allow the polishing pad material of the upper platen and the lower platen to simultaneously contact an upper surface and a lower surface of the optical substrate, respectively;
setting a first location of the aperture of the carrier such that a center of the optical substrate is offset from a center of the carrier and at least a portion of an outer perimeter of the optical substrate extends outwardly beyond at least a portion of at least one of an outer perimeter and an inner perimeter of the upper platen and the lower platen;
rotating the upper platen and the lower platen;
rotating the carrier;
stopping the rotation of the upper platen and the lower platen;
stopping the rotation of the carrier;
setting a location of the aperture of the carrier to a second location wherein at least a portion of an outer perimeter of the optical substrate extends outwardly beyond at least a portion of at least one of an outer perimeter and an inner perimeter of the upper platen and the lower platen;
rotating the upper platen and the lower platen; and
rotating the carrier,
wherein a maximum distance during rotation that the outer perimeter of the optical substrate extends beyond the at least one of the outer perimeter and the inner perimeter of the upper platen and the lower platen when the aperture is in the second location is different from a maximum distance during rotation that the outer perimeter of the optical substrate extends beyond the at least one of the outer perimeter and the inner perimeter of the upper platen and the lower platen when the aperture is in the first location.
2. The method of claim 1 , wherein, when the aperture is in the first location, at least a portion of the outer perimeter of the optical substrate extends beyond at least a portion of at least one of the outer perimeter and the inner perimeter of the upper platen and the lower platen a distance of up to one-third of the optical substrate diameter.
3. The method of claim 1 , wherein at least one of an upper platen surface or a lower platen surface is modified via mechanical bending during rotation of the upper platen and the lower platen.
4. The method of claim 1 , wherein the upper platen and the lower platen contact the respective surfaces of the optical substrate with a pressure between 0.5 and 2 psi.
5. The method of claim 1 , wherein the upper platen and the lower platen are rotated at a speed between 10 and 30 RPM.
6. The method of claim 1 , wherein a loose abrasive polishing medium is applied to the polishing pad material.
7. The method of claim 1 , wherein the polishing pad material comprises a fixed abrasive integral to the polishing pad material.
8. The method of claim 1 , wherein the optical substrate is chosen from the group consisting of: sapphire, spinel, ALON, aluminum oxide, or composite material transparent in the visible and near infrared and mid-wave infrared wavelength regions.
9. The method of claim 1 , wherein the optical substrate is rectangular, circular, or oval.
10. The method of claim 1 , wherein the optical substrate is between 0.10 inches and 1.00 inch thick.
11. The method of claim 1 , wherein the optical substrate has lateral dimensions between 6 inches and 60 inches and a final maximum transmitted wave-front error over a clear aperture of the optical substrate after polishing is less than 0.25 wave rms when measured at normal angle of incidence at 0.6328 micrometers.
12. The method of claim 1 , wherein a final maximum transmitted wave-front error over any sub-aperture of the optical substrate after polishing is less than 0.25 wave rms when measured at normal angle of incidence at 0.6328 micrometers.
13. The method of claim 1 , wherein a final maximum beam deviation over a clear aperture of the optical substrate after polishing is less than 5 arc-seconds when measured at normal angle of incidence.
14. The method of claim 1 , wherein a final maximum beam deviation over any sub-aperture of the optical substrate after polishing is less than 5 arc-seconds when measured at normal angle of incidence.
15. A method for simultaneously polishing both surfaces of an optical substrate comprising:
providing an upper platen and a lower platen, each covered with a polishing pad material;
providing at least one carrier having an aperture for holding the optical substrate between the upper platen and the lower platen and adapted to allow the polishing pad material of the upper platen and the lower platen to simultaneously contact an upper surface and a lower surface of the optical substrate, respectively;
setting a first location of the aperture of the carrier such that a center of the optical substrate is offset from a center of the carrier and at least a portion of an outer perimeter of the optical substrate extends outwardly beyond at least a portion of at least one of an outer perimeter and an inner perimeter of the upper platen and the lower platen;
rotating the upper platen and the lower platen;
rotating the carrier;
stopping the rotation of the upper platen and the lower platen;
stopping the rotation of the carrier;
setting the location of the aperture of the carrier to a second location wherein at least a portion of an outer perimeter of the optical substrate extends outwardly beyond at least a portion of at least one of an outer perimeter and an inner perimeter of the upper platen and the lower platen;
rotating the upper platen and the lower platen; and
rotating the carrier,
wherein a distance between the center of the aperture and the center of the carrier when the aperture is in the first location is different from a distance between the center of the aperture and the center of the carrier when the aperture is in the second location.
16. An apparatus for simultaneously polishing both surfaces of an optical substrate comprising:
an upper platen and a lower platen, each covered with a polishing pad material; and
a carrier having an aperture for holding the optical substrate between the upper platen and the lower platen and adapted to allow the polishing pad material of the upper platen and the lower platen to simultaneously contact an upper surface and a lower surface of the optical substrate, respectively,
wherein the upper platen and the lower platen rotate; and the carrier rotates, and
a location of a center of the aperture of the carrier is adjustable with respect to a center of the carrier such that a distance that at least a portion of an outer perimeter of the aperture extends outwardly beyond at least a portion of at least one of an outer perimeter and an inner perimeter of the upper platen and the lower platen can be changed.
17. The apparatus of claim 16 , wherein at least a portion of the outer perimeter of the aperture extends outwardly beyond at least a portion of at least one of the outer perimeter and the inner perimeter of the upper platen and the lower platen a distance of up to one-third of a diameter of the aperture.
18. The apparatus of claim 16 , wherein at least one of an upper platen surface or a lower platen surface is adapted to be modified via mechanical bending during rotation of the upper platen and the lower platen.